CN1230050C - 电子机器 - Google Patents
电子机器 Download PDFInfo
- Publication number
- CN1230050C CN1230050C CN03108710.8A CN03108710A CN1230050C CN 1230050 C CN1230050 C CN 1230050C CN 03108710 A CN03108710 A CN 03108710A CN 1230050 C CN1230050 C CN 1230050C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- machine
- conductor
- scolding tin
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Volume Flow (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrical Control Of Air Or Fuel Supplied To Internal-Combustion Engine (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002224329A JP4310086B2 (ja) | 2002-08-01 | 2002-08-01 | エンジン用電子機器 |
JP224329/2002 | 2002-08-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1473002A CN1473002A (zh) | 2004-02-04 |
CN1230050C true CN1230050C (zh) | 2005-11-30 |
Family
ID=30437704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN03108710.8A Expired - Lifetime CN1230050C (zh) | 2002-08-01 | 2003-03-28 | 电子机器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7215021B2 (zh) |
JP (1) | JP4310086B2 (zh) |
CN (1) | CN1230050C (zh) |
DE (1) | DE10333296A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003242714A (ja) * | 2001-10-24 | 2003-08-29 | Fuji Electric Co Ltd | 情報記録媒体、その媒体の製造方法、情報処理装置、並びに、著作権管理システム |
JP4636915B2 (ja) * | 2005-03-18 | 2011-02-23 | 日立オートモティブシステムズ株式会社 | 空気流量測定装置 |
JP2007307774A (ja) * | 2006-05-17 | 2007-11-29 | Ricoh Co Ltd | 液体吐出ヘッド、液体吐出装置、画像形成装置 |
CN101772720A (zh) * | 2007-05-25 | 2010-07-07 | 株式会社尼康 | 光学元件保持装置、镜筒、曝光装置以及器件的制造方法 |
DE102008037206B4 (de) | 2008-08-11 | 2014-07-03 | Heraeus Sensor Technology Gmbh | 300°C-Flowsensor |
JP5726409B2 (ja) * | 2009-07-01 | 2015-06-03 | シャープ株式会社 | 発光装置および発光装置の製造方法 |
JP5623062B2 (ja) | 2009-11-13 | 2014-11-12 | シャープ株式会社 | 発光装置およびその製造方法 |
WO2011070739A1 (ja) * | 2009-12-07 | 2011-06-16 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置 |
JP2011151268A (ja) | 2010-01-22 | 2011-08-04 | Sharp Corp | 発光装置 |
GB2485419B (en) * | 2010-11-15 | 2015-02-25 | Semblant Ltd | Method for reducing creep corrosion |
DE102011088216A1 (de) * | 2011-12-12 | 2013-06-13 | Continental Automotive Gmbh | Motorsteuergerät mit Opferstruktur |
JP5645880B2 (ja) | 2012-06-15 | 2014-12-24 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
EP3187881B1 (en) * | 2015-12-28 | 2020-08-26 | Sensirion AG | Thermal flow sensor |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63253659A (ja) | 1987-04-10 | 1988-10-20 | Hitachi Ltd | 厚膜混成集積回路装置 |
JPH0319387A (ja) | 1989-06-16 | 1991-01-28 | Nippondenso Co Ltd | 混成集積回路 |
US5468681A (en) * | 1989-08-28 | 1995-11-21 | Lsi Logic Corporation | Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias |
JPH04334083A (ja) | 1991-05-09 | 1992-11-20 | Ngk Insulators Ltd | 厚膜回路基板およびその製造方法 |
JP2749479B2 (ja) | 1992-03-19 | 1998-05-13 | 株式会社日立製作所 | エンジン制御装置 |
JPH05275823A (ja) | 1992-03-24 | 1993-10-22 | Taiyo Yuden Co Ltd | 混成集積回路装置の製造方法 |
US5615658A (en) * | 1993-10-13 | 1997-04-01 | Hashimoto; Akira | Combustion air quality improving device for internal combustion engine or general combustion equipment |
US6442831B1 (en) * | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
US5977783A (en) * | 1994-10-28 | 1999-11-02 | Nitto Denko Corporation | Multilayer probe for measuring electrical characteristics |
JP2992464B2 (ja) * | 1994-11-04 | 1999-12-20 | キヤノン株式会社 | 集電電極用被覆ワイヤ、該集電電極用被覆ワイヤを用いた光起電力素子及びその製造方法 |
JPH09246723A (ja) | 1996-03-11 | 1997-09-19 | Sumitomo Kinzoku Electro Device:Kk | 低温焼成セラミック回路基板 |
BR9710046A (pt) * | 1996-06-28 | 1999-08-10 | Aon Int Inc | Agente de controle para redução de emissões de névoa de ácido de metal de operações de célula eletrolítica |
JP3617299B2 (ja) * | 1997-05-30 | 2005-02-02 | 株式会社村田製作所 | 可変抵抗器 |
JP3311282B2 (ja) * | 1997-10-13 | 2002-08-05 | 株式会社東芝 | 金属部材の接合方法及び接合体 |
US6142018A (en) * | 1997-11-10 | 2000-11-07 | Cts Corporation | Conductor burnishing |
US6332442B1 (en) * | 1998-04-16 | 2001-12-25 | Toyoda Gosei Co., Ltd. | Intake air duct |
US6623620B2 (en) * | 1999-11-22 | 2003-09-23 | Hathaway Brown School | Method for detecting or monitoring sulfur dioxide with an electrochemical sensor |
WO2001080256A1 (fr) * | 2000-04-14 | 2001-10-25 | Matsushita Electric Industrial Co., Ltd. | Corps stratifie, condensateur, composant electronique, procede et dispositif de fabrication dudit corps stratifie, dudit condensateur et dudit composant electronique |
US20040043479A1 (en) * | 2000-12-11 | 2004-03-04 | Briscoe Cynthia G. | Multilayerd microfluidic devices for analyte reactions |
US20050269727A1 (en) * | 2001-02-15 | 2005-12-08 | Integral Technologies, Inc. | Low cost vehicle air intake and exhaust handling devices manufactured from conductive loaded resin-based materials |
US7396236B2 (en) * | 2001-03-16 | 2008-07-08 | Formfactor, Inc. | Wafer level interposer |
JP3787509B2 (ja) | 2001-09-03 | 2006-06-21 | 株式会社日立製作所 | 発熱抵抗式空気流量測定装置 |
US6652731B2 (en) * | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6961168B2 (en) * | 2002-06-21 | 2005-11-01 | The Regents Of The University Of California | Durable electrooptic devices comprising ionic liquids |
JP3853263B2 (ja) * | 2002-07-08 | 2006-12-06 | Necエレクトロニクス株式会社 | 半導体装置 |
US20040011650A1 (en) * | 2002-07-22 | 2004-01-22 | Frederic Zenhausern | Method and apparatus for manipulating polarizable analytes via dielectrophoresis |
US6922068B2 (en) * | 2003-03-20 | 2005-07-26 | Shih-Hsiung Lee | Method for testing high power SMD type IC with method for making manual and automation test base |
-
2002
- 2002-08-01 JP JP2002224329A patent/JP4310086B2/ja not_active Expired - Lifetime
-
2003
- 2003-03-28 CN CN03108710.8A patent/CN1230050C/zh not_active Expired - Lifetime
- 2003-07-22 DE DE10333296A patent/DE10333296A1/de not_active Withdrawn
- 2003-07-31 US US10/630,773 patent/US7215021B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US7215021B2 (en) | 2007-05-08 |
JP2004071588A (ja) | 2004-03-04 |
CN1473002A (zh) | 2004-02-04 |
JP4310086B2 (ja) | 2009-08-05 |
US20040113267A1 (en) | 2004-06-17 |
DE10333296A1 (de) | 2004-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Ibaraki Patentee after: HITACHI AUTOMOTIVE SYSTEMS, Ltd. Patentee after: HITACHI AUTOMOTIVE SYSTEMS ENGINEERING, Ltd. Address before: Ibaraki Patentee before: HITACHI AUTOMOTIVE SYSTEMS, Ltd. Patentee before: HITACHI CAR ENG Co.,Ltd. Address after: Ibaraki Patentee after: Hitachi astemo Co.,Ltd. Address before: Ibaraki Patentee before: HITACHI AUTOMOTIVE SYSTEMS, Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211126 Address after: Ibaraki Patentee after: HITACHI AUTOMOTIVE SYSTEMS, Ltd. Patentee after: HITACHI CAR ENG Co.,Ltd. Address before: Tokyo Patentee before: Hitachi, Ltd. Patentee before: HITACHI CAR ENG Co.,Ltd. Effective date of registration: 20211126 Address after: Ibaraki Patentee after: HITACHI AUTOMOTIVE SYSTEMS, Ltd. Address before: Ibaraki Patentee before: HITACHI AUTOMOTIVE SYSTEMS, Ltd. Patentee before: HITACHI AUTOMOTIVE SYSTEMS ENGINEERING, Ltd. |
|
TR01 | Transfer of patent right | ||
CX01 | Expiry of patent term |
Granted publication date: 20051130 |
|
CX01 | Expiry of patent term |