CN1225786C - 带嵌入式框架的窗口式非陶瓷封装 - Google Patents

带嵌入式框架的窗口式非陶瓷封装 Download PDF

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Publication number
CN1225786C
CN1225786C CNB998148369A CN99814836A CN1225786C CN 1225786 C CN1225786 C CN 1225786C CN B998148369 A CNB998148369 A CN B998148369A CN 99814836 A CN99814836 A CN 99814836A CN 1225786 C CN1225786 C CN 1225786C
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CN
China
Prior art keywords
frame
window
molding composite
framework
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998148369A
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English (en)
Chinese (zh)
Other versions
CN1331841A (zh
Inventor
Z·－F·李
K·森古普塔
D·L·汤普森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/219,186 external-priority patent/US6072232A/en
Application filed by Intel Corp filed Critical Intel Corp
Publication of CN1331841A publication Critical patent/CN1331841A/zh
Application granted granted Critical
Publication of CN1225786C publication Critical patent/CN1225786C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CNB998148369A 1998-12-21 1999-11-23 带嵌入式框架的窗口式非陶瓷封装 Expired - Fee Related CN1225786C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/219,186 US6072232A (en) 1998-10-13 1998-12-21 Windowed non-ceramic package having embedded frame
US09/219,186 1998-12-21

Publications (2)

Publication Number Publication Date
CN1331841A CN1331841A (zh) 2002-01-16
CN1225786C true CN1225786C (zh) 2005-11-02

Family

ID=22818234

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998148369A Expired - Fee Related CN1225786C (zh) 1998-12-21 1999-11-23 带嵌入式框架的窗口式非陶瓷封装

Country Status (8)

Country Link
JP (1) JP2002533926A (https=)
KR (1) KR100490692B1 (https=)
CN (1) CN1225786C (https=)
AU (1) AU1744800A (https=)
DE (1) DE19983826T1 (https=)
GB (1) GB2359927B (https=)
TW (1) TWI249234B (https=)
WO (1) WO2000038230A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825540B2 (en) * 2001-12-05 2004-11-30 Matsushita Electric Industrial Co., Ltd. Miniaturized, resin-sealed solid state imaging apparatus
CN104154995B (zh) * 2014-08-21 2016-09-28 中国科学院光电研究院 一种高光谱探测集成模块及其制造方法
CN111551775A (zh) * 2020-06-16 2020-08-18 新纳传感系统有限公司 一种电流传感器的制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS60115247A (ja) * 1983-11-28 1985-06-21 Fujitsu Ltd 半導体装置
JPH0724287B2 (ja) * 1987-02-12 1995-03-15 三菱電機株式会社 光透過用窓を有する半導体装置とその製造方法
EP0468379B1 (en) * 1990-07-21 1999-11-17 Mitsui Chemicals, Inc. Semiconductor device having a package
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width
JP2784126B2 (ja) * 1993-02-23 1998-08-06 京セラ株式会社 半導体素子収納用パッケージの製造方法
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US5498900A (en) * 1993-12-22 1996-03-12 Honeywell Inc. Semiconductor package with weldable ceramic lid
US5471011A (en) * 1994-05-26 1995-11-28 Ak Technology, Inc. Homogeneous thermoplastic semi-conductor chip carrier package
US5471001A (en) * 1994-12-15 1995-11-28 E. I. Du Pont De Nemours And Company Crystallization of adipic acid
JP3471111B2 (ja) * 1995-03-20 2003-11-25 三菱電機株式会社 半導体装置
JPH0992748A (ja) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp 半導体素子用パッケージ
JP3292798B2 (ja) * 1995-10-04 2002-06-17 三菱電機株式会社 半導体装置
JPH09107054A (ja) * 1995-10-13 1997-04-22 Sony Corp 半導体装置
US5821617A (en) * 1996-07-29 1998-10-13 Microsemi Corporation Surface mount package with low coefficient of thermal expansion
JPH10189792A (ja) * 1996-12-27 1998-07-21 Sony Corp 半導体パッケージ
JP2002020358A (ja) * 2000-07-07 2002-01-23 Kansai Tlo Kk アミノ酸誘導体配位子と希土類金属の錯体からなる新規水溶性キラルシフト試薬及び光学分割試薬
JP2002174956A (ja) * 2000-12-06 2002-06-21 Ricoh Co Ltd 画像形成装置
JP2003042150A (ja) * 2001-07-31 2003-02-13 Koyo Seiko Co Ltd 転がり軸受装置

Also Published As

Publication number Publication date
JP2002533926A (ja) 2002-10-08
DE19983826T1 (de) 2002-03-07
CN1331841A (zh) 2002-01-16
KR20020018993A (ko) 2002-03-09
TWI249234B (en) 2006-02-11
AU1744800A (en) 2000-07-12
GB2359927B (en) 2003-11-26
WO2000038230A1 (en) 2000-06-29
GB0113365D0 (en) 2001-07-25
GB2359927A (en) 2001-09-05
KR100490692B1 (ko) 2005-05-24

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Granted publication date: 20051102

Termination date: 20121123