CN121730031A - 半导体模块的制造方法、半导体模块 - Google Patents

半导体模块的制造方法、半导体模块

Info

Publication number
CN121730031A
CN121730031A CN202380101553.3A CN202380101553A CN121730031A CN 121730031 A CN121730031 A CN 121730031A CN 202380101553 A CN202380101553 A CN 202380101553A CN 121730031 A CN121730031 A CN 121730031A
Authority
CN
China
Prior art keywords
conductor plate
convex portion
semiconductor
plate
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380101553.3A
Other languages
English (en)
Chinese (zh)
Inventor
志村隆弘
露野圆丈
岛津博美
井出英一
浅野雅彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anstemo Corp
Original Assignee
Anstemo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anstemo Corp filed Critical Anstemo Corp
Publication of CN121730031A publication Critical patent/CN121730031A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202380101553.3A 2023-10-17 2023-10-17 半导体模块的制造方法、半导体模块 Pending CN121730031A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/037604 WO2025083789A1 (ja) 2023-10-17 2023-10-17 半導体モジュールの製造方法、半導体モジュール

Publications (1)

Publication Number Publication Date
CN121730031A true CN121730031A (zh) 2026-03-24

Family

ID=95448615

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380101553.3A Pending CN121730031A (zh) 2023-10-17 2023-10-17 半导体模块的制造方法、半导体模块

Country Status (3)

Country Link
JP (1) JPWO2025083789A1 (https=)
CN (1) CN121730031A (https=)
WO (1) WO2025083789A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2902919B2 (ja) * 1993-11-25 1999-06-07 三洋電機株式会社 表面実装型半導体装置
JP2001326295A (ja) * 2000-05-15 2001-11-22 Rohm Co Ltd 半導体装置および半導体装置製造用フレーム
JP2014187149A (ja) * 2013-03-22 2014-10-02 Hitachi Automotive Systems Ltd パワーモジュール
JP6767898B2 (ja) * 2017-02-28 2020-10-14 日立オートモティブシステムズ株式会社 パワー半導体装置
JP6966558B2 (ja) * 2017-08-30 2021-11-17 日立Astemo株式会社 パワー半導体装置及びその製造方法

Also Published As

Publication number Publication date
WO2025083789A1 (ja) 2025-04-24
JPWO2025083789A1 (https=) 2025-04-24

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