JPWO2025083789A1 - - Google Patents
Info
- Publication number
- JPWO2025083789A1 JPWO2025083789A1 JP2025552514A JP2025552514A JPWO2025083789A1 JP WO2025083789 A1 JPWO2025083789 A1 JP WO2025083789A1 JP 2025552514 A JP2025552514 A JP 2025552514A JP 2025552514 A JP2025552514 A JP 2025552514A JP WO2025083789 A1 JPWO2025083789 A1 JP WO2025083789A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/037604 WO2025083789A1 (ja) | 2023-10-17 | 2023-10-17 | 半導体モジュールの製造方法、半導体モジュール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025083789A1 true JPWO2025083789A1 (https=) | 2025-04-24 |
Family
ID=95448615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025552514A Pending JPWO2025083789A1 (https=) | 2023-10-17 | 2023-10-17 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025083789A1 (https=) |
| CN (1) | CN121730031A (https=) |
| WO (1) | WO2025083789A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2902919B2 (ja) * | 1993-11-25 | 1999-06-07 | 三洋電機株式会社 | 表面実装型半導体装置 |
| JP2001326295A (ja) * | 2000-05-15 | 2001-11-22 | Rohm Co Ltd | 半導体装置および半導体装置製造用フレーム |
| JP2014187149A (ja) * | 2013-03-22 | 2014-10-02 | Hitachi Automotive Systems Ltd | パワーモジュール |
| JP6767898B2 (ja) * | 2017-02-28 | 2020-10-14 | 日立オートモティブシステムズ株式会社 | パワー半導体装置 |
| JP6966558B2 (ja) * | 2017-08-30 | 2021-11-17 | 日立Astemo株式会社 | パワー半導体装置及びその製造方法 |
-
2023
- 2023-10-17 WO PCT/JP2023/037604 patent/WO2025083789A1/ja active Pending
- 2023-10-17 JP JP2025552514A patent/JPWO2025083789A1/ja active Pending
- 2023-10-17 CN CN202380101553.3A patent/CN121730031A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN121730031A (zh) | 2026-03-24 |
| WO2025083789A1 (ja) | 2025-04-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251113 |