CN1213367C - 自动地管理半导体制造间的系统和方法 - Google Patents
自动地管理半导体制造间的系统和方法 Download PDFInfo
- Publication number
- CN1213367C CN1213367C CNB001226681A CN00122668A CN1213367C CN 1213367 C CN1213367 C CN 1213367C CN B001226681 A CNB001226681 A CN B001226681A CN 00122668 A CN00122668 A CN 00122668A CN 1213367 C CN1213367 C CN 1213367C
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- process equipment
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000000034 method Methods 0.000 title claims abstract description 211
- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 claims abstract description 60
- 235000012431 wafers Nutrition 0.000 claims abstract description 30
- 230000004044 response Effects 0.000 claims abstract description 23
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims description 47
- 238000007726 management method Methods 0.000 claims description 42
- 238000003860 storage Methods 0.000 claims description 39
- 238000004891 communication Methods 0.000 claims description 21
- 238000013500 data storage Methods 0.000 claims description 12
- 230000005055 memory storage Effects 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000012423 maintenance Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000012217 deletion Methods 0.000 claims description 3
- 230000037430 deletion Effects 0.000 claims description 3
- 230000002596 correlated effect Effects 0.000 claims 3
- 230000001276 controlling effect Effects 0.000 claims 2
- 230000000875 corresponding effect Effects 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 230000008676 import Effects 0.000 claims 1
- 210000000352 storage cell Anatomy 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32074—History of operation of each machine
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32196—Store audit, history of inspection, control and workpiece data into database
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/35—Nc in input of data, input till input file format
- G05B2219/35291—Record history, log, journal, audit of machine operation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- General Factory Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Control By Computers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR18261/1999 | 1999-05-20 | ||
KR1019990018261A KR100303322B1 (ko) | 1999-05-20 | 1999-05-20 | 반도체 라인 관리를 위한 통합 자동화 시스템 및 그 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1278621A CN1278621A (zh) | 2001-01-03 |
CN1213367C true CN1213367C (zh) | 2005-08-03 |
Family
ID=19586791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001226681A Expired - Fee Related CN1213367C (zh) | 1999-05-20 | 2000-05-20 | 自动地管理半导体制造间的系统和方法 |
Country Status (9)
Country | Link |
---|---|
JP (1) | JP2001035760A (xx) |
KR (1) | KR100303322B1 (xx) |
CN (1) | CN1213367C (xx) |
DE (1) | DE10024735A1 (xx) |
FR (1) | FR2793916B1 (xx) |
GB (1) | GB2352058B (xx) |
IT (1) | IT1317658B1 (xx) |
NL (1) | NL1015251A1 (xx) |
TW (1) | TW482967B (xx) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001176763A (ja) * | 1999-12-14 | 2001-06-29 | Nec Corp | 製品ウェハを含む非製品ウェハの自動化処理方法ならびにシステム及び同方法が記録された記録媒体 |
EP1391796A4 (en) * | 2001-05-24 | 2007-08-08 | Yamatake Corp | PROCESS CONTROL UNIT, PRODUCT INFORMATION COLLECTION DEVICE, AND PROCESS TRAINING PROGRAM |
ITBO20010330A1 (it) * | 2001-05-25 | 2002-11-25 | Gd Spa | Metodo per la stima dell'efficienza di una macchina automatica |
US7123974B1 (en) | 2002-11-19 | 2006-10-17 | Rockwell Software Inc. | System and methodology providing audit recording and tracking in real time industrial controller environment |
KR100520062B1 (ko) * | 2003-03-11 | 2005-10-11 | 삼성전자주식회사 | 자동반송시스템 및 그 제어방법 |
US6931303B2 (en) * | 2003-10-02 | 2005-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated transport system |
JP4673548B2 (ja) * | 2003-11-12 | 2011-04-20 | 東京エレクトロン株式会社 | 基板処理装置及びその制御方法 |
JP2005294754A (ja) * | 2004-04-05 | 2005-10-20 | Toshiba Corp | 電子ビーム描画装置、電子ビーム描画方法、電子ビーム描画プログラム及び直接描画方式を用いた半導体装置の製造方法 |
JP2006237365A (ja) | 2005-02-25 | 2006-09-07 | Agilent Technol Inc | 半導体特性評価装置の管理方法及びそのプログラム |
US7206653B1 (en) * | 2005-11-29 | 2007-04-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer-based planning methods and systems for batch-based processing tools |
KR100755136B1 (ko) | 2005-12-28 | 2007-09-04 | 동부일렉트로닉스 주식회사 | 제조실행 시스템에서 그룹별 반도체 제품군의 공정상태파악방법 |
KR101251855B1 (ko) * | 2010-02-18 | 2013-04-10 | 신닛테츠스미킨 카부시키카이샤 | 조업 가이던스 설정 지원 장치, 조업 지원 시스템, 및 컴퓨터 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 |
TWI571908B (zh) | 2014-08-15 | 2017-02-21 | 力晶科技股份有限公司 | 製程控制方法與製程控制系統 |
CN109240224B (zh) * | 2018-08-17 | 2022-04-15 | 张家港康得新光电材料有限公司 | 一种收料方法、装置、设备及存储介质 |
CN110290194A (zh) * | 2019-06-20 | 2019-09-27 | 苏州工业园区恒越自动化科技有限公司 | 一种基于semi标准的secs通信方法 |
CN114924536B (zh) * | 2022-05-26 | 2024-01-30 | 江苏泰治科技股份有限公司 | 一种光伏电池片生产控制方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4974166A (en) * | 1987-05-18 | 1990-11-27 | Asyst Technologies, Inc. | Processing systems with intelligent article tracking |
JP3309997B2 (ja) * | 1991-09-05 | 2002-07-29 | 株式会社日立製作所 | 複合処理装置 |
JP2724082B2 (ja) * | 1992-12-18 | 1998-03-09 | シャープ株式会社 | Vlsiプロセスのデータ解析支援システム |
JPH06203040A (ja) * | 1992-12-28 | 1994-07-22 | Honda Motor Co Ltd | 製造経歴管理システム |
JPH06338552A (ja) * | 1993-05-31 | 1994-12-06 | Sony Corp | 半導体シミュレーション装置 |
IT1272036B (it) * | 1993-11-05 | 1997-06-11 | Marelli Autronica | Sistema di registraziome per una linea di produzione. |
US5654896A (en) * | 1994-10-31 | 1997-08-05 | Ixys Corp | Performance prediction method for semiconductor power modules and ICS |
US5591299A (en) * | 1995-04-28 | 1997-01-07 | Advanced Micro Devices, Inc. | System for providing integrated monitoring, control and diagnostics functions for semiconductor spray process tools |
US5659467A (en) * | 1996-06-26 | 1997-08-19 | Texas Instruments Incorporated | Multiple model supervisor control system and method of operation |
JP2800795B2 (ja) * | 1996-08-05 | 1998-09-21 | 日本電気株式会社 | 生産制御方法及び生産制御装置 |
KR100211671B1 (ko) * | 1996-11-11 | 1999-08-02 | 윤종용 | 반도체 제조장비의 관리시스템 및 관리방법 |
KR19980068469A (ko) * | 1997-02-20 | 1998-10-15 | 김광호 | 반도체 설비 통합 제어시스템 |
US5862054A (en) * | 1997-02-20 | 1999-01-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Process monitoring system for real time statistical process control |
KR19980074797A (ko) * | 1997-03-27 | 1998-11-05 | 윤종용 | 반도체 제조용 설비의 관리방법 |
JPH10335193A (ja) * | 1997-05-30 | 1998-12-18 | Toshiba Corp | 製造工程仕様作成運営システム、プロセスデータ作成システム及び半導体装置の製造方法 |
WO2000036479A1 (en) * | 1998-12-16 | 2000-06-22 | Speedfam-Ipec Corporation | An equipment virtual controller |
-
1999
- 1999-05-20 KR KR1019990018261A patent/KR100303322B1/ko not_active IP Right Cessation
-
2000
- 2000-05-19 DE DE10024735A patent/DE10024735A1/de not_active Withdrawn
- 2000-05-19 NL NL1015251A patent/NL1015251A1/xx not_active IP Right Cessation
- 2000-05-20 CN CNB001226681A patent/CN1213367C/zh not_active Expired - Fee Related
- 2000-05-22 JP JP2000150555A patent/JP2001035760A/ja active Pending
- 2000-05-22 FR FR0006508A patent/FR2793916B1/fr not_active Expired - Fee Related
- 2000-05-22 IT IT2000MI001128A patent/IT1317658B1/it active
- 2000-05-22 GB GB0012374A patent/GB2352058B/en not_active Expired - Fee Related
- 2000-05-23 TW TW089109913A patent/TW482967B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FR2793916B1 (fr) | 2005-06-03 |
KR20000074361A (ko) | 2000-12-15 |
NL1015251C2 (xx) | 2004-10-19 |
IT1317658B1 (it) | 2003-07-15 |
GB2352058B (en) | 2003-08-13 |
GB0012374D0 (en) | 2000-07-12 |
JP2001035760A (ja) | 2001-02-09 |
CN1278621A (zh) | 2001-01-03 |
TW482967B (en) | 2002-04-11 |
FR2793916A1 (fr) | 2000-11-24 |
KR100303322B1 (ko) | 2001-09-26 |
GB2352058A (en) | 2001-01-17 |
ITMI20001128A1 (it) | 2001-11-22 |
DE10024735A1 (de) | 2001-02-01 |
ITMI20001128A0 (it) | 2000-05-22 |
NL1015251A1 (nl) | 2000-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050803 Termination date: 20100520 |