CN1213367C - System and method for automatically managing mfg. room for semi-conductors - Google Patents
System and method for automatically managing mfg. room for semi-conductors Download PDFInfo
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- CN1213367C CN1213367C CNB001226681A CN00122668A CN1213367C CN 1213367 C CN1213367 C CN 1213367C CN B001226681 A CNB001226681 A CN B001226681A CN 00122668 A CN00122668 A CN 00122668A CN 1213367 C CN1213367 C CN 1213367C
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- 238000000034 method Methods 0.000 title claims abstract description 211
- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 claims abstract description 60
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- 230000004044 response Effects 0.000 claims abstract description 23
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims description 47
- 238000007726 management method Methods 0.000 claims description 42
- 238000003860 storage Methods 0.000 claims description 39
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- 238000013500 data storage Methods 0.000 claims description 12
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- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000012217 deletion Methods 0.000 claims description 3
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32074—History of operation of each machine
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32196—Store audit, history of inspection, control and workpiece data into database
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/35—Nc in input of data, input till input file format
- G05B2219/35291—Record history, log, journal, audit of machine operation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
A system for automatically managing semiconductor production bays, includes: a plurality of process equipment, each for processing a lot representing a predetermined number of semiconductor wafers and generating real-time process data associated with a process in response to a lot data, at least one production management device for generating control commands and receiving the real-time process data, a equipment control device for controlling said process equipment in response to the control commands and transmitting the real-time process data to said production management device, a data storing device for storing data associated with process and the lot in the semiconductor production bays in response to the commands issued from said production management device, a history managed device for managing the history of the process equipment and semiconductor wafer.
Description
The present invention relates to the system and method between automatically managing semiconductor is made, particularly can manage the system and method for the data relevant effectively with the technology of making semiconductor devices.
Automatic system for semiconductor works uses between a plurality of automatic semiconductors manufacturings usually.In between each semiconductor is made, provide the special process equipment of a plurality of process semiconductor wafers, for example etching apparatus, lithographic equipment etc.
In addition, also use accumulator between semiconductor manufacturing automatically, wherein accumulator deposit provisionally to be provided between manufacturing and between making in the box of processing.Each box is a kind of container that can stack the semiconductor wafer of scheduled volume, and wherein the semiconductor wafer of scheduled volume is called a collection of.
In order to manage the data relevant, in the automatic system for semiconductor works of routine, also use network system with technology.
Conventional network system comprises main frame, a plurality of terminal and the database that is connected to main frame.All data that host process is relevant with the manufacturing of semiconductor wafer in the conventional automatic system for semiconductor works.Host computer control process equipment thus.
Adopt network system, can reduce operator's quantity of management technique, therefore reduce the impurity that is attached to wafer.In addition, can the fast processing data relevant with the semiconductor wafer manufacturing.
Yet, because conventional processor does not have the memory storage of classification and the configuration management of data, therefore be difficult to manage effectively between all semiconductors make, the technology that many operators are carried out in participating between the semiconductor manufacturing has reduced the throughput rate of semiconductor devices thus.
Therefore, an object of the present invention is to provide the system and method between a kind of manufacturing of managing semiconductor automatically, can solve the problems of the prior art with effective and efficient manner.
According to a scheme of the present invention, the system between a kind of manufacturing of managing semiconductor automatically is provided, comprising: a plurality of process equipments, each is used to handle the semiconductor wafer of a collection of scheduled volume and produces the real-time process data relevant with technology in response to lot data; At least one manufacturing management device be used for producing and the relevant control command of technology between semiconductor is made, and reception is from the real-time process data of described each process equipment; Plant control unit is controlled described process equipment in response to control command, and real-time process data is sent to described manufacturing management device; Data storage device is in response to the order of being sent by described manufacturing management device, between storing semiconductor is made in technology and batch relevant data; And the history management device, in response to the control command of sending by described manufacturing management device, manage the historical record of each described process equipment and semiconductor wafer.
According to another aspect of the present invention, method between a kind of manufacturing of managing semiconductor automatically is provided, may further comprise the steps: provide after the order by using first secondary data that transmits by the production control device to produce box, provide order to be sent to a plurality of process equipments and an automatic conveyor in box; Use described process equipment to be contained in the box one batch; By transacter in data storage device, the real-time process data that described process equipment produces during stores processor; By using described automatic conveyer case in the box storing unit; And in the historical record memory storage, store real-time process data, wherein said real-time process data is classified by the history management device.
According to another aspect of the present invention, a kind of computer-readable medium of stored program instruction is provided, programmed instruction is arranged on the method for carrying out on the computing machine between managing semiconductor manufacturing automatically, may further comprise the steps: a) first secondary data that is transmitted by the production control device by use produces box provides after the order, provides order to be sent to a plurality of process equipments and an automatic conveyor in box; B) use described process equipment to be contained in the box one batch; C) by transacter in data storage device, the real-time process data that described process equipment produces during stores processor; D) by using described automatic conveyer case in the box storing unit; And e) the real-time process data of storage in the historical record memory storage, wherein process data is classified by the history management device in real time.
From below in conjunction with the accompanying drawing description of a preferred embodiment, above and other purpose of the present invention and characteristics will become obviously, wherein:
Fig. 1 shows the synoptic diagram of the automatic system for semiconductor works that uses the system between managing semiconductor manufacturing automatically according to a preferred embodiment of the present invention;
Fig. 2 is illustrated in the structure in historical record data storehouse in the system of Fig. 1;
Fig. 3 drawn with Fig. 2 in the structure of batch relevant lot data table;
Fig. 4 shows the structure of the device data table relevant with process equipment among Fig. 2;
Fig. 5 show be contained in Fig. 2 in the relevant graticule and the box structure of data table of graticule (reticle) of each semiconductor wafer;
Fig. 6 represent with progress shown in Fig. 2 under the structure of the relevant process data table of technology;
Fig. 7 A shows according to the present invention the process flow diagram of a method between managing semiconductor manufacturing automatically to 7C;
The CMS that Fig. 8 shows among Fig. 7 A provides order to be sent to the flow chart of steps of process equipment in box;
Fig. 9 shows the flow chart of steps that AGV among Fig. 7 A is provided to box process equipment;
Figure 10 shows the flow chart of steps that the process data among Fig. 7 B is recorded real-time data base;
Figure 11 shows the flow chart of steps that box is recalled in the process equipment request in Fig. 7 B;
Figure 12 shows the flow chart of steps that in Fig. 7 B CMS is sent to the box countermand process equipment;
Figure 13 shows AGV and is recalled box and box is stored in flow chart of steps in the accumulator by process equipment.
In order to make semiconductor devices, be equipped with usually in the automatic system for semiconductor works between a plurality of semiconductors manufacturings, be connected to the manufacturing management system by common communication line between the semiconductor manufacturing.For simplicity, the present invention only introduces between a semiconductor manufacturing.
With reference to figure 1, show the synoptic diagram of the automatic system for semiconductor works that uses the system between managing semiconductor manufacturing automatically according to a preferred embodiment of the present invention.
As shown in the figure, automatic system for semiconductor works comprises at least one unit, between having predetermined quantity in the unit for example 4 semiconductors being made.Process equipment 700, accumulator 890 and one or more automatic guidance transport vehicle (AGV) 880 of scheduled volume be equipped with between the semiconductor manufacturing.Each process equipment 700 process semiconductor wafers is to obtain semiconductor devices.Process equipment comprises for example etching apparatus, lithographic equipment etc.Accumulator is stored a plurality of boxes provisionally.Each box has the semiconductor wafer of scheduled volume, is called a collection of.By using AGV 880 that box optionally is sent to process equipment.The box of having handled in process equipment then (hereinafter being called " box of processing or batch ") uses AGV 880 to be sent to another process equipment or accumulator 890.The box of having handled of storage is transported between second half conductor manufacturing in the accumulator 890.
The Ethernet that is for example provided by Xerox company is provided by device control part 600 each process equipment
TMCommon communication line 10.Accumulator 890 and AGV also are connected to common communication line 10.
Automatic system for semiconductor works also comprises Single Component Management part 100, is connected to the real-time data base 200 of Single Component Management part 10, is connected to the temporary storage cell 300 of Single Component Management part 100, the historical record data storehouse 500 that is connected to the history management part 400 of temporary storage cell 300 and is connected to history management part 400.Single Component Management part 100, history management part 400 and historical record data storehouse 500 are connected respectively to the common communication line 10 of communicating by letter with therebetween.
Pass through Ethernet
TMCable 10, Single Component Management part 100 is communicated by letter with the device control part 600 of CONTROL PROCESS equipment 700, and communicates by letter with the transmission control section 800 of control accumulator 890 and AGV 860.
In addition, historical record data storehouse 500 is connected to report section 900 by common communication line 10.
Single Component Management part 100 comprises operator interface server (hereinafter being called OIS) 120, produce the data collection server (hereinafter being called DGS) 160 of batch relevant process data in management server (hereinafter being called CMS) 140 of control command and storage and the real-time data base 200.
OIS 120 has a graphic user interface.The operator originally can with to be processed batch of relevant lot data, for example I.D. of batch identifier (I.D.), the box that holds batch etc. is input to OIS120.The lot data that is input to OIS 120 is sent to CMS 140, feeds back to real-time data base 200 by DGS 160 then.At this moment, on the former basis that is stored in the technology progress in the real-time data base 200, CMS 140 produces boxes provides order or box countermand as control command.Order is by common communication line 10, i.e. Ethernet is with Ethernet
TMThe form of information is provided to and transmits control section 800, and is simultaneously displayed on the display screen of OIS 120.
It is the real-time process data of Ethernet message form that CMS 140 receives from device control part 700, and stores real-time process data into temporary storage cell 300.At this moment, the real-time process data of 300 storing predetermined times of temporary storage cell.
History management part 400 comprises history information server (hereinafter being called HIS) 420, on the basis of CMS 140 orders, fetch real-time process data, and the real-time process data that will fetch is stored in the historical record data storehouse 500 from temporary storage cell 300.
Device control part 600 comprises the device server (hereinafter being called EQS) 620 that is connected to common communication line 10, and the devices communicating server (hereinafter being called ECS) 640 that process equipment 700 is communicated by letter with EQS 602.The process data that ECS 640 sends process equipment 700 is converted to semiconductor equipment communication standard (hereinafter being called SECS) information.The communication protocol of SECS for communicating by letter between the server in this system.EQS 620 is sent to process equipment 700 with the control command that CMS 140 sends by EQS 620 and ECS 640.In addition, EQS 620 receives the process data by process equipment 700 outputs by ECS 640, and process data is sent to CMS 140.
Transmit that control section 800 comprises the accumulator Control Server (hereinafter being called SCS) 820 of controlling accumulator 890, inner control server (hereinafter being called ICS) 840 and the automatic guidance transport vehicle controller (hereinafter being called AGVC) 860 that is connected to ICS 840 between the manufacturing that is connected to SCS 820.
ICS 840 receives the control command of being sent by CMS 140, and control command is sent to each SCS 820 and AGVC 860.SCS 820 loads or unloads control accumulator 890 on the basis of control command of reception of box of selection at accumulator 890.
AGVC 860 produces on the basis of the control command that receives and transmits control signal, after this will transmit control signal and be sent to AGV 880.Then, AGV 880 transmits the box of selecting in response to transmitting control signal.
Report section 900 comprises the report server 920 of data being fetched and produced report from historical record data storehouse 500, and the report database 940 of the report of storage report server 920 generations.
By using a plurality of software programs can realize a plurality of above servers, one or more by using, for example personal computer, workstation, microprocessor etc. can be realized each part.
With reference to figure 2, the figure shows the structure in historical record data storehouse in the system according to the invention.
As shown in Figure 2, historical record data storehouse 500 comprises lot data table 510, device data table 520, graticule and box tables of data 530 and process data table 540.
With reference to figure 3, the figure shows with Fig. 2 in the structure of batch relevant lot data table 510.
As shown in the figure, lot data table 510 has batch state table 511, batch history table 512, batch deleting history record sheet 513, batch property list 514, operational order table 515, technology table 516, batch refusal table 517, batch again processing list 518 and batch error list 519.
Batch state table 511 storage representations will to a batch technology of carrying out, batch in number of wafers, batch in the data of wafer state etc.Batch history table 512 storage representations to a batch technology of carrying out, batch in the data of variation etc. of number of wafers.Batch deleting history record sheet 513 storage representations are by batch historical record, deletion time and the operator's etc. of the deletion of historical record delete command data.The data of batch character that batch property list 514 storage representations are limited by the operator.The data of the operational order that operational order table 515 storage representation uses in each technology.The data that technology table 516 storage representation produces during each technology.The data of the technology of batch refusal, the reason of refusal, the management historical record of refusal etc. take place in batch refusal table 517 storage representation.Batch again data of reason of handling again of processing list 518 storage representations batch needs etc.When batch making a mistake, the data of the reason of batch error list 519 storage representation mistakes, the management historical record of mistake etc.
With reference to figure 4, the figure shows and the relevant device data table 520 of technology among Fig. 2.
As shown in Figure 4, device data table 520 has device status table 521, device history record table 522, maintenance of equipment table 523, operation of equipment table 524 and device command history table 525.
The data of the current state of process equipment 700 in the device status table 521 storage representation technologies.The data that device history record table 522 storage representation makes a mistake in process equipment 700.Storage of maintenance of equipment table 523 and the relevant information of process equipment 700 maintenances.The data that operation of equipment table 524 storage is relevant with the technology of carrying out in process equipment 700 and with process equipment 700 relevant data.When process equipment 700 was undesired, device command history table 525 was stored in the processing command in the process equipment 700.
With reference to figure 5, the figure shows be contained in Fig. 2 in the relevant graticule of the graticule (reticle) of each semiconductor wafer and the structure of box tables of data 530.
As shown in Figure 5, graticule and box tables of data 530 have a graticule history table 531 and graticule command history table 532.
When at least one graticule mistake, graticule history table 531 is stored in the data that make a mistake in the graticule.When at least one graticule mistake, graticule command history table 532 is stored in the processing command in the process equipment 700.
With reference to figure 6, the figure shows with progress shown in Fig. 2 under the data of the relevant process data table of technology.
As shown in Figure 6, process data table 540 has a state of the art table 541 and a process history record sheet 542.
In state of the art table 541 storage technology semiconductor wafer or batch status information.The data of the semiconductor wafer quantity that process history record sheet 542 storage representations are handled in process equipment 700 and the time of arts demand.
Present embodiment has been introduced the present invention and has been had a Single Component Management part 100, history management part 400 and real-time data base 200, but in fact, in automatic system for semiconductor works, can use two or more Single Component Management parts 100, history management part 400 and real-time data base 200.
In addition, the data that are stored in the above table are stored in the temporary storage cell 300 with document form.If through preset time, data file is stored in the historical record data storehouse 500.Single Component Management part 100 and history management part 400 operation repetitives.
Fig. 7 A shows according to the present invention the process flow diagram of a method between managing semiconductor manufacturing automatically to 7C.
To shown in the 7C, at step S300, the operator forms to be processed batch by the graphic user interface input of using OIS 120 with a batch relevant lot data as Fig. 7 A.The I.D. that comprises batch with batch relevant lot data, to batch technology that will carry out, batch in number of wafers and the box I.D. that holds batch.Simultaneously, at step S310, CMS 140 receives first secondary data, produces box then order is provided.At step S320 and S330, CMS 140 provides order to be sent to process equipment 700 and ICS 840 with the form of information in box.
At this moment, at step S340, ICS 840 provides order to be sent to SCS 820 and AGVC860 in box.Box provide order to comprise to have box I.D. control data, the position of box and the position of carrying case are provided.
At this moment, at step S350, AGVC 860 is provided to AGV 880 with the AGV control signal, and SCS820 is sent to accumulator 890 with the accumulator control signal.Then, accumulator 890 box that allows AGV 880 to collect to hold to handle batch.
In addition, at step S360, AGV 880 is provided to target process equipment with box by accumulator 890.
Then, at step S370, hold in the box that the target process device processes is transmitted by AGV 880 batch, and the real-time process data that will contain with technology and device-dependent process data is sent to CMS140.At this moment, at step S380, CMS 140 records real-time data base 200 by DGS 160 with real-time process data.
After this, when target process equipment was finished technology, at step S390, target process equipment produced the request signal that CMS 140 is recalled the box of finishing in request by device control part 600.
Then, at step S400 and S410, CMS 140 produces the box countermands, and the box countermand is sent to target process equipment and ICS 840 with the form of information.The box countermand comprise have the control data that will recall box I.D., the process equipment that will recall box and next target process equipment.At step S420, ICS 840 is sent to AGVC 860 with the box countermand.Simultaneously, in the box of batch packing into that process equipment 700 will be handled, wait for next work then.
At step S430, AGVC 860 uses cordless communication network that the AGV control signal is sent to AGV 880, and at step S440, AGV 880 fetches box from process equipment 700, and box is stored in the accumulator 890.
At step S450, the new positional information of the box that SCS 820 will newly stack is sent to CMS 140, at step S460, CMS 140 use new updating location information be stored in the new stacking in the real-time data base 200 box with the front position.
Then, CMS 140 fetches the process data that is stored in the real-time data base 200, at step S470, the process data of fetching is recorded in the temporary storage cell 300 as process date file.After this, CMS 140 will represent that the fileinfo of temporary storage cell 300 storage technology data is sent to HIS420.Then, at step S480, HIS 420 is recorded in the historical record data storehouse 500 by temporary storage cell 300 withdrawal processes data files and with process data.
At this moment, at step S490, the operator confirms whether CMS 140 needs another work by OIS 120.Then, another work if desired, CMS 140 turns back to step S310, produces box order is provided.On the other hand, if without any need for other work, at step S500, report section 900 determines whether to require to finish the report of technology.
When needs are reported, step S510, report server 920 is fetched the data that are stored in the historical record data storehouse 500, at step S520, output report.After this, report server 920 with the report data storage in report database 940.
On the other hand, when not requiring report, technology turns back to step S409.
With reference to figure 8, the CMS 140 that the figure shows among Fig. 7 A provides order to be sent to the flow chart of steps of target process equipment 700 in box.
At step S321, CMS 140 provides order to be sent to EQS 620 with message form in box.After this, at step S322, EQS 620 provides order to be sent to ECS 640 in box, and it is the control signal of CONTROL PROCESS equipment 700 that ECS 640 provides command conversion with box.Then, at step S323, ECS 640 will provide the control signal of order to be sent to process equipment 700 corresponding to box.At this moment, process equipment 700 is in the waiting status of waiting for box.
With reference to figure 9, the figure shows the flow chart of steps that AGV 880 is provided to box target process equipment.
At step S361, SCS 820 is sent to accumulator 890 with the accumulator control signal, and at step S362, accumulator 890 prepares to provide the target box in response to control signal.
Then, at step S363, AGV 880 provides order to receive control signal in response to the box from AGVC 860, at step S364, moves to extract the target box towards accumulator 890.After this, at step S365, AGV 880 moves towards the target process equipment 700 that will provide, and at step S366, the target box is provided to target process equipment 700.
With reference to Figure 10, the figure shows the flow chart of steps that process data is recorded real-time data base.
At step S381, process equipment 700 transmits real-time process data by ECS 640.Then, at step S382, ECS 640 is converted to SECS information with real-time process data.After this, real-time process data is converted to EQS 620.
At this moment, at step S383, the real-time process data that EQS 620 will change by common communication line 10 is sent to CMS 140.Then, CMS 140 is sent to DGS 160 with real-time process data, and at step S384, DGS 160 is recorded in real-time process data in the real-time data base 200.
With reference to Figure 11, the figure shows the flow chart of steps that box is recalled in the process equipment request.
At step S391, process equipment 700 is finished technology, and at step S392, request is retracted into ECS 640 with box.
Then, at step S393, ECS 640 recalls request with box and is converted to SECS information, and the box of conversion is recalled request is sent to EQS 620.After this, at step S394, EQS 620 recalls request by common communication line 10 with box and is sent to CMS 140.Recall request in response to box, at step S395, CMS 140 produces the box countermand.
With reference to Figure 12, the figure shows the flow chart of steps that CMS is sent to the box countermand process equipment.
At step S401, CMS 140 is sent to EQS 620 with the box countermand, and at step S402, EQS 620 is sent to ECS 640 with the box countermand.
Then, at step S403, ECS 640 is converted to equipment controling signal with SECS information flask countermand, at step S404, equipment controling signal is sent to process equipment 700.
After this, at step S405, in the box of batch packing into that process equipment 700 will be handled and wait for next order.
With reference to Figure 13, the figure shows AGV and recall box and box is stored in flow chart of steps in the accumulator by process equipment.
At step S441, AGV 880 receives the AGV control signal in response to the box countermand, and moves towards process equipment 700.Then, at step S442, AGV 880 is recalled the box of having handled by process equipment 700.After this, at step S443, AGV 880 moves and box is stored in the accumulator 890 towards accumulator 890.At this moment, destination apparatus can be another process equipment.
According to the present invention, since between semiconductor is made the various technologies of generation and control data automatically real-time storage in real-time data base, therefore can finish the holistic management between the semiconductor manufacturing effectively, greatly improve the throughput rate of semiconductor devices thus.
Though only introduced the present invention, also can carry out other modification and distortion, and not break away from the spirit and scope of the present invention of stating in following claims with reference to some preferred embodiment.
Claims (29)
1. the system between a kind automatically managing semiconductor is made comprises:
A plurality of treatment facilities, each handles the semiconductor wafer of a collection of scheduled volume, and produces the real-time process data relevant with technology in response to lot data;
At least one manufacturing management device be used for producing and the relevant control command of technology between semiconductor is made, and reception is from the real-time process data of described each process equipment;
Plant control unit is controlled described process equipment in response to control command, and real-time process data is sent to described manufacturing management device;
Data storage device, in response to the order of sending by described manufacturing management device, between storing semiconductor is made in technology and batch relevant data; And
The history management device in response to the control command of being sent by described manufacturing management device, is managed the historical record of each described process equipment and semiconductor wafer.
2. according to the system of claim 1, also comprise the box conveyer, the box that will hold batch in response to the control command of being sent by management devices between described manufacturing is sent to target process equipment.
3. according to the system of claim 2, also comprise and fetch data that are stored in the described data storage device and the annunciator that produces report.
4. according to the system of claim 3, also comprise:
The box storing unit is deposited in response to the control command of being sent by described manufacturing installation and to be held the box of handling batch and will handling batch.
5. according to the system of claim 4, wherein said manufacturing management device comprises having the interface arrangement that graphic user interface is used to import lot data;
The production control device produces box according to lot data order is provided, and produces the box countermand in response to the request of described plant control unit, and receives the real-time process data that is sent by described station; And
Transacter stores real-time process data into described data storage device.
6. according to the system of claim 5, wherein said plant control unit comprises the process equipment control device of controlling described process equipment in response to the order of being sent by described production control device; And
Communication apparatus, receiving box provides order and box countermand by what described production control device sent, with these command conversion is equipment controling signal, and change the real-time process data that described process equipment sends into semiconductor equipment communication standard information, then real-time process data is sent to described plant control unit.
7. according to the system of claim 6, wherein the box conveyer comprises inner controller between manufacturing, and being used to receive the box that is sent by described production control device provides order and box countermand;
The accumulator control device produces the accumulator control signal, provides order and box countermand to control described box storing unit by inner controller between described manufacturing in response to box;
The box channel control unit produces the transmission control signal that order and box countermand are provided corresponding to box; And
Conveyer, in response to the transmission control signal that order and box countermand are provided corresponding to box, extract the target box respectively, the target box is provided to target process equipment by described box storing unit, extract the target box by target process equipment, the target box is provided to described box storing unit.
8. according to the system of claim 7, wherein said data storage device comprises the real-time data memory device of depositing real-time process data;
Store the temporary storing device of real-time process data provisionally as file;
The historical record memory storage is after the schedule time, under the control of described history management device, with the real-time process data classification in the storage temporary storing device; And
The report memory storage of the report that storage is drafted by described annunciator.
9. system according to Claim 8, wherein the sign that comprises batch of lot data, will to a batch technology of carrying out, batch in number of wafers and the box sign of holding batch.
10. according to the system of claim 9, wherein in real time the state that comprises batch of process data, with a batch relevant order, with the state of batch relevant process data, described process equipment, relevant service data, the order of being correlated with described process equipment and technology carries out state with described process equipment.
11. according to the system of claim 10, wherein said historical record memory storage comprises and handles batch relevant lot data table, the device data table of being correlated with described process equipment, the graticule of being correlated with the graticule that is contained in each semiconductor wafer in the box and box tables of data and the process data table relevant with progress.
12. according to the system of claim 11, wherein said lot data table comprises a batch state table, storage representation will to a batch technology of carrying out, batch in number of wafers, batch in the data of wafer state;
The data of the variation of number of wafers in batch history table, storage representation batch;
Batch deleting history record sheet, the data of batch historical record of storage representation deletion;
The data of batch character that batch property list, storage representation are limited by the operator;
The operational order table, storage representation has carried out the data of the operational order of technology;
Technology table, storage representation carry out the data that produce during the technology;
The data of management historical record of reason, the refusal of technology, the refusal of batch refusal take place in batch refusal table, storage representation;
Batch again processing list, the data of the reason that storage representation batch needs are handled again; And
Batch error list, when batch wrong, the data of the management historical record of the reason of storage representation mistake, mistake.
13. according to the system of claim 12, wherein said device data table comprises the current state of process equipment described in the technology;
The data that device history record table, storage representation make a mistake in process equipment;
The maintenance of equipment table, storage and the relevant information of described process equipment maintenance;
The operation of equipment table is stored data relevant with the technology of carrying out and the data relevant with described process equipment in process equipment;
The device command history table when process equipment is undesired, is stored in the processing command in the process equipment.
14. according to the system of claim 13, wherein said graticule and tables of data comprise the graticule history table, when at least one is wrong in box and the graticule, and the data that storage box or graticule make a mistake.
15. according to the system of claim 14, wherein relevant with technology described process data table comprises the state of the art table, be used for the storage technology semiconductor wafer or batch status information; And
The data of the semiconductor wafer quantity that process history record sheet storage representation is handled in described process equipment and the time of arts demand.
16. the method between a kind automatically managing semiconductor is made may further comprise the steps:
A) first secondary data that is transmitted by the production control device by use produces box provides after the order, provides order to be sent to a plurality of process equipments and an automatic conveyor in box;
B) use described process equipment be contained in the box batch;
C) by transacter in data storage device, the real-time process data that described process equipment produces during stores processor;
D) by using described automatic conveyer case in the box storing unit; And
E) the real-time process data of storage in the historical record memory storage, wherein process data is classified by the history management device in real time.
17., further comprising the steps of according to the method for claim 16:
F) in response to the report request that transmits by the outside, provide be stored in described historical record memory storage in the relevant report of data; And
G) storage report in the report memory storage.
18. according to the method for claim 17, wherein step a) may further comprise the steps:
A1) with first secondary data input interface unit;
A2) produce box by the described production control device that receives first secondary data order is provided;
A3) box is provided order be sent to inner controller between described process equipment and manufacturing;
A4) box is provided the order and second lot data are sent to the channel control unit of the described automatic conveyor of control and the accumulator control device of the described box storing unit of control; And
A5) will provide order to be sent to described box conveyer from the box of described channel control unit by radio communication.
19. according to the method for claim 18, step a2 wherein) may further comprise the steps:
A21) will provide order to be sent to described plant control unit from the box of described production control device;
A22) will provide order to be sent to communication apparatus from the box of described plant control unit;
A23) providing command conversion at described communication apparatus with box is machine language;
A24 a23) after the step, provides order to be sent to box in the box that is converted to machine language order is provided by intermediate medium; And
A25) wait for described process equipment.
20. according to the method for claim 18, wherein the sign that comprises batch of first secondary data, will to first batch of technology of carrying out, batch in number of wafers and the box sign of holding batch.
21. according to the method for claim 18, wherein second lot data comprises that having box identifies, provides the position of box and the position of carrying case.
22. according to the method for claim 16, wherein step b) may further comprise the steps:
B1) will be sent to described accumulator control device by described order middle device from second lot data of described accumulator control device;
B2) on the basis of second lot data, prepare to provide box;
B3) will provide the order and second lot data to be sent to described automatic conveyor from the box of described channel control unit;
B4) extract box from described box storing unit, described automatic conveyor is moved to the described process equipment that box will be provided;
B5) be provided for the box of described process equipment; And
B6) to being contained in the technology of batch carrying out in the box.
23. according to the method for claim 16, wherein step c) may further comprise the steps:
C1) real-time process data is sent to described communication apparatus by the order middle device;
C2) real-time process data is converted to after the semiconductor equipment communication standard type information, will be sent to described plant control unit from the real-time process data of the conversion of described communicator;
C3) will be sent to described production control device from the real-time process data of the conversion of described plant control unit; And
C4) will be sent to described transacter from the real-time process data of the conversion of making control device, then, the real-time process data that uses described transacter to change stores in the described data storage device.
24. according to the method for claim 16, wherein step d) may further comprise the steps:
D1), ask so box is retracted into described production control device if described process equipment is finished technology;
D2) produce the box countermand that comprises the 3rd lot data by described production control device, then, the box countermand is sent to inner controller between described process equipment and described manufacturing;
D3) inner controller is sent to described channel control unit with the 3rd lot data between described manufacturing by using;
D4) by batch being deposited in the box of controlling that described process equipment will handle, then, wait for described process equipment;
D5) will be sent to described automatic conveyor from the box countermand of described channel control unit; And
D6) by described automatic conveyor, recall box by described process equipment, box is deposited in the described box storing unit then.
25. according to the method for claim 24, wherein steps d 1) may further comprise the steps:
D11) if described process equipment has been finished technology, request is retracted into described device command device by described order intermediate medium with box;
D12) box is recalled request and be converted to semiconductor equipment communication standard type information, then, will be sent to described plant control unit from the order of the conversion of described technology communicator;
D13) will be sent to described production control device from the request of the conversion of described plant control unit.
26. according to the method for claim 24, wherein steps d 2) may further comprise the steps:
D21) produce from the box countermand of described manufacturing installation, then, the box countermand is sent to described plant control unit;
D22) will be sent to described communication apparatus from the box countermand of described plant control unit;
D23) the box countermand is converted to after the machine language, the box countermand is sent to described process equipment by described order middle device; And
D24) the box countermand is sent to inner controller between described manufacturing.
27. according to the method for claim 26, wherein the 3rd lot data comprises the sign that will recall box, the process equipment of recalling the process equipment of box and box being provided.
28. according to the method for claim 24, wherein steps d 6) may further comprise the steps:
D61) the box countermand that will comprise the 3rd lot data is sent to described automatic conveyor by described channel control unit;
D62) on the basis of the 3rd lot data, box is recalled by described process equipment;
D63) box is stored in the described box storing unit;
D64) positional information with the box deposited in the described box storing unit is sent to described production control device by described box storing unit; And
D65) the former updating location information with the box of described data storage device stored is the positional information that leaves described box storing unit inner box in.
29. according to the method for claim 16, wherein step e) may further comprise the steps:
E1) the real-time process data that will be stored in the described data storage device is fetched, and then real-time process data is stored in the temporary storing device;
E2) result that will be stored in the real-time process data in the temporary storing device sends to described history management device by described production control device; And
E3) retrieve real-time process data by described temporary storing device, then, real-time process data is recorded in the described historical record memory storage.
Applications Claiming Priority (2)
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| KR1019990018261A KR100303322B1 (en) | 1999-05-20 | 1999-05-20 | unity automatization system and method for the semi-conductor line management |
| KR18261/1999 | 1999-05-20 |
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| KR (1) | KR100303322B1 (en) |
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| JP2001176763A (en) * | 1999-12-14 | 2001-06-29 | Nec Corp | Method and system for automatic process for non-product wafer including product wafer, and record medium on which the method is recorded |
| EP1391796A4 (en) * | 2001-05-24 | 2007-08-08 | Yamatake Corp | Process controller, product information collector, and process tracer |
| ITBO20010330A1 (en) * | 2001-05-25 | 2002-11-25 | Gd Spa | METHOD FOR ESTIMATING THE EFFICIENCY OF AN AUTOMATIC MACHINE |
| US7123974B1 (en) * | 2002-11-19 | 2006-10-17 | Rockwell Software Inc. | System and methodology providing audit recording and tracking in real time industrial controller environment |
| KR100520062B1 (en) * | 2003-03-11 | 2005-10-11 | 삼성전자주식회사 | Auto guided system and control method thereof |
| US6931303B2 (en) * | 2003-10-02 | 2005-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated transport system |
| JP4673548B2 (en) * | 2003-11-12 | 2011-04-20 | 東京エレクトロン株式会社 | Substrate processing apparatus and control method thereof |
| JP2005294754A (en) * | 2004-04-05 | 2005-10-20 | Toshiba Corp | Electron beam drawing apparatus, electron beam drawing method, electronic beam drawing program, and method of manufacturing semiconductor device using direct drawing system |
| JP2006237365A (en) * | 2005-02-25 | 2006-09-07 | Agilent Technol Inc | Method and program for managing semiconductor characteristics evaluation device |
| US7206653B1 (en) * | 2005-11-29 | 2007-04-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer-based planning methods and systems for batch-based processing tools |
| KR100755136B1 (en) | 2005-12-28 | 2007-09-04 | 동부일렉트로닉스 주식회사 | Method for analyzing process status of semiconductor products classified by group title in manufacturing execution system |
| KR101251855B1 (en) * | 2010-02-18 | 2013-04-10 | 신닛테츠스미킨 카부시키카이샤 | Operation guidance setting support device, operation support system, and computer readable recording media recording computer program |
| TWI571908B (en) | 2014-08-15 | 2017-02-21 | 力晶科技股份有限公司 | Process control method and process control system |
| CN109240224B (en) * | 2018-08-17 | 2022-04-15 | 张家港康得新光电材料有限公司 | Material receiving method, device, equipment and storage medium |
| CN110290194A (en) * | 2019-06-20 | 2019-09-27 | 苏州工业园区恒越自动化科技有限公司 | A kind of SECS communication means based on SEMI standard |
| CN114924536B (en) * | 2022-05-26 | 2024-01-30 | 江苏泰治科技股份有限公司 | Photovoltaic cell production control method |
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- 2000-05-22 FR FR0006508A patent/FR2793916B1/en not_active Expired - Fee Related
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| JP2001035760A (en) | 2001-02-09 |
| ITMI20001128A1 (en) | 2001-11-22 |
| TW482967B (en) | 2002-04-11 |
| NL1015251A1 (en) | 2000-11-21 |
| DE10024735A1 (en) | 2001-02-01 |
| GB2352058A (en) | 2001-01-17 |
| GB0012374D0 (en) | 2000-07-12 |
| KR100303322B1 (en) | 2001-09-26 |
| GB2352058B (en) | 2003-08-13 |
| NL1015251C2 (en) | 2004-10-19 |
| FR2793916B1 (en) | 2005-06-03 |
| FR2793916A1 (en) | 2000-11-24 |
| IT1317658B1 (en) | 2003-07-15 |
| CN1278621A (en) | 2001-01-03 |
| KR20000074361A (en) | 2000-12-15 |
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