CN120153466A - 错误因素解析装置以及错误因素解析方法 - Google Patents

错误因素解析装置以及错误因素解析方法 Download PDF

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Publication number
CN120153466A
CN120153466A CN202280101550.5A CN202280101550A CN120153466A CN 120153466 A CN120153466 A CN 120153466A CN 202280101550 A CN202280101550 A CN 202280101550A CN 120153466 A CN120153466 A CN 120153466A
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CN
China
Prior art keywords
error
measurement point
small
degree
abnormality
Prior art date
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Pending
Application number
CN202280101550.5A
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English (en)
Chinese (zh)
Inventor
吉田泰浩
石川昌义
笹岛二大
大越荣生
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Publication of CN120153466A publication Critical patent/CN120153466A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0275—Fault isolation and identification, e.g. classify fault; estimate cause or root of failure
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Debugging And Monitoring (AREA)
  • Testing And Monitoring For Control Systems (AREA)
CN202280101550.5A 2022-11-16 2022-11-16 错误因素解析装置以及错误因素解析方法 Pending CN120153466A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/042563 WO2024105811A1 (ja) 2022-11-16 2022-11-16 エラー要因解析装置、および、エラー要因解析方法

Publications (1)

Publication Number Publication Date
CN120153466A true CN120153466A (zh) 2025-06-13

Family

ID=91084051

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280101550.5A Pending CN120153466A (zh) 2022-11-16 2022-11-16 错误因素解析装置以及错误因素解析方法

Country Status (5)

Country Link
JP (1) JP7821323B2 (https=)
KR (1) KR20250076593A (https=)
CN (1) CN120153466A (https=)
TW (1) TWI863659B (https=)
WO (1) WO2024105811A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4661371B2 (ja) 2005-06-02 2011-03-30 オムロン株式会社 基板検査システム
US8838413B2 (en) * 2011-05-12 2014-09-16 Saudi Arabian Oil Company Valve actuator fault analysis system
KR101965839B1 (ko) * 2017-08-18 2019-04-05 주식회사 티맥스 소프트 구성정보 관리 데이터베이스 기반의 it 시스템 장애 분석 기법
JP7029585B2 (ja) * 2017-09-19 2022-03-04 パナソニックＩｐマネジメント株式会社 エラー要因推定装置およびエラー要因推定方法
JP7153142B2 (ja) * 2019-09-06 2022-10-13 株式会社日立ハイテク レシピ情報提示システム、レシピエラー推定システム
WO2021053738A1 (ja) * 2019-09-18 2021-03-25 三菱電機株式会社 作業要素分析装置及び作業要素分析方法
KR102818861B1 (ko) * 2020-03-30 2025-06-12 주식회사 히타치하이테크 진단 시스템
WO2022059183A1 (ja) * 2020-09-18 2022-03-24 三菱電機株式会社 情報処理装置、情報処理方法及び情報処理プログラム

Also Published As

Publication number Publication date
TWI863659B (zh) 2024-11-21
KR20250076593A (ko) 2025-05-29
TW202422258A (zh) 2024-06-01
JP7821323B2 (ja) 2026-02-26
WO2024105811A1 (ja) 2024-05-23
JPWO2024105811A1 (https=) 2024-05-23

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