JPWO2024105811A1 - - Google Patents
Info
- Publication number
- JPWO2024105811A1 JPWO2024105811A1 JP2024558565A JP2024558565A JPWO2024105811A1 JP WO2024105811 A1 JPWO2024105811 A1 JP WO2024105811A1 JP 2024558565 A JP2024558565 A JP 2024558565A JP 2024558565 A JP2024558565 A JP 2024558565A JP WO2024105811 A1 JPWO2024105811 A1 JP WO2024105811A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
- G05B23/0275—Fault isolation and identification, e.g. classify fault; estimate cause or root of failure
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Mathematical Physics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Debugging And Monitoring (AREA)
- Testing And Monitoring For Control Systems (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/042563 WO2024105811A1 (ja) | 2022-11-16 | 2022-11-16 | エラー要因解析装置、および、エラー要因解析方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024105811A1 true JPWO2024105811A1 (https=) | 2024-05-23 |
| JP7821323B2 JP7821323B2 (ja) | 2026-02-26 |
Family
ID=91084051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024558565A Active JP7821323B2 (ja) | 2022-11-16 | 2022-11-16 | エラー要因解析装置、および、エラー要因解析方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7821323B2 (https=) |
| KR (1) | KR20250076593A (https=) |
| CN (1) | CN120153466A (https=) |
| TW (1) | TWI863659B (https=) |
| WO (1) | WO2024105811A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019054179A (ja) * | 2017-09-19 | 2019-04-04 | パナソニックＩｐマネジメント株式会社 | エラー要因推定装置およびエラー要因推定方法 |
| WO2021044611A1 (ja) * | 2019-09-06 | 2021-03-11 | 株式会社日立ハイテク | レシピ情報提示システム、レシピエラー推定システム |
| WO2021199164A1 (ja) * | 2020-03-30 | 2021-10-07 | 株式会社日立ハイテク | 診断システム |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4661371B2 (ja) | 2005-06-02 | 2011-03-30 | オムロン株式会社 | 基板検査システム |
| US8838413B2 (en) * | 2011-05-12 | 2014-09-16 | Saudi Arabian Oil Company | Valve actuator fault analysis system |
| KR101965839B1 (ko) * | 2017-08-18 | 2019-04-05 | 주식회사 티맥스 소프트 | 구성정보 관리 데이터베이스 기반의 it 시스템 장애 분석 기법 |
| WO2021053738A1 (ja) * | 2019-09-18 | 2021-03-25 | 三菱電機株式会社 | 作業要素分析装置及び作業要素分析方法 |
| WO2022059183A1 (ja) * | 2020-09-18 | 2022-03-24 | 三菱電機株式会社 | 情報処理装置、情報処理方法及び情報処理プログラム |
-
2022
- 2022-11-16 WO PCT/JP2022/042563 patent/WO2024105811A1/ja not_active Ceased
- 2022-11-16 KR KR1020257013407A patent/KR20250076593A/ko active Pending
- 2022-11-16 JP JP2024558565A patent/JP7821323B2/ja active Active
- 2022-11-16 CN CN202280101550.5A patent/CN120153466A/zh active Pending
-
2023
- 2023-10-30 TW TW112141453A patent/TWI863659B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019054179A (ja) * | 2017-09-19 | 2019-04-04 | パナソニックＩｐマネジメント株式会社 | エラー要因推定装置およびエラー要因推定方法 |
| WO2021044611A1 (ja) * | 2019-09-06 | 2021-03-11 | 株式会社日立ハイテク | レシピ情報提示システム、レシピエラー推定システム |
| WO2021199164A1 (ja) * | 2020-03-30 | 2021-10-07 | 株式会社日立ハイテク | 診断システム |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI863659B (zh) | 2024-11-21 |
| CN120153466A (zh) | 2025-06-13 |
| KR20250076593A (ko) | 2025-05-29 |
| TW202422258A (zh) | 2024-06-01 |
| JP7821323B2 (ja) | 2026-02-26 |
| WO2024105811A1 (ja) | 2024-05-23 |
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