KR20250076593A - 에러 요인 해석 장치, 및 에러 요인 해석 방법 - Google Patents
에러 요인 해석 장치, 및 에러 요인 해석 방법 Download PDFInfo
- Publication number
- KR20250076593A KR20250076593A KR1020257013407A KR20257013407A KR20250076593A KR 20250076593 A KR20250076593 A KR 20250076593A KR 1020257013407 A KR1020257013407 A KR 1020257013407A KR 20257013407 A KR20257013407 A KR 20257013407A KR 20250076593 A KR20250076593 A KR 20250076593A
- Authority
- KR
- South Korea
- Prior art keywords
- error
- sub
- abnormality
- measurement points
- factor analysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
- G05B23/0275—Fault isolation and identification, e.g. classify fault; estimate cause or root of failure
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
-
- H01L22/12—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Mathematical Physics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Debugging And Monitoring (AREA)
- Testing And Monitoring For Control Systems (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/042563 WO2024105811A1 (ja) | 2022-11-16 | 2022-11-16 | エラー要因解析装置、および、エラー要因解析方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250076593A true KR20250076593A (ko) | 2025-05-29 |
Family
ID=91084051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257013407A Pending KR20250076593A (ko) | 2022-11-16 | 2022-11-16 | 에러 요인 해석 장치, 및 에러 요인 해석 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7821323B2 (https=) |
| KR (1) | KR20250076593A (https=) |
| CN (1) | CN120153466A (https=) |
| TW (1) | TWI863659B (https=) |
| WO (1) | WO2024105811A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339445A (ja) | 2005-06-02 | 2006-12-14 | Omron Corp | 基板検査システム |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8838413B2 (en) * | 2011-05-12 | 2014-09-16 | Saudi Arabian Oil Company | Valve actuator fault analysis system |
| KR101965839B1 (ko) * | 2017-08-18 | 2019-04-05 | 주식회사 티맥스 소프트 | 구성정보 관리 데이터베이스 기반의 it 시스템 장애 분석 기법 |
| JP7029585B2 (ja) * | 2017-09-19 | 2022-03-04 | パナソニックIpマネジメント株式会社 | エラー要因推定装置およびエラー要因推定方法 |
| JP7153142B2 (ja) * | 2019-09-06 | 2022-10-13 | 株式会社日立ハイテク | レシピ情報提示システム、レシピエラー推定システム |
| WO2021053738A1 (ja) * | 2019-09-18 | 2021-03-25 | 三菱電機株式会社 | 作業要素分析装置及び作業要素分析方法 |
| KR102818861B1 (ko) * | 2020-03-30 | 2025-06-12 | 주식회사 히타치하이테크 | 진단 시스템 |
| WO2022059183A1 (ja) * | 2020-09-18 | 2022-03-24 | 三菱電機株式会社 | 情報処理装置、情報処理方法及び情報処理プログラム |
-
2022
- 2022-11-16 WO PCT/JP2022/042563 patent/WO2024105811A1/ja not_active Ceased
- 2022-11-16 KR KR1020257013407A patent/KR20250076593A/ko active Pending
- 2022-11-16 JP JP2024558565A patent/JP7821323B2/ja active Active
- 2022-11-16 CN CN202280101550.5A patent/CN120153466A/zh active Pending
-
2023
- 2023-10-30 TW TW112141453A patent/TWI863659B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339445A (ja) | 2005-06-02 | 2006-12-14 | Omron Corp | 基板検査システム |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI863659B (zh) | 2024-11-21 |
| CN120153466A (zh) | 2025-06-13 |
| TW202422258A (zh) | 2024-06-01 |
| JP7821323B2 (ja) | 2026-02-26 |
| WO2024105811A1 (ja) | 2024-05-23 |
| JPWO2024105811A1 (https=) | 2024-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12554571B2 (en) | Error cause estimation device and estimation method | |
| US12591227B2 (en) | Systems and methods for anomaly recognition and detection using lifelong deep neural networks | |
| CN110709688B (zh) | 用于预测在装配单元中的缺陷的方法 | |
| JP7748798B2 (ja) | 教師なし異常検出及び高次元センサデータの多数決投票による原因説明のための方法及びシステム | |
| CN116188475A (zh) | 一种外观缺陷自动光学检测的智慧控制方法、系统及介质 | |
| US20230221684A1 (en) | Explaining Machine Learning Output in Industrial Applications | |
| JP2009068946A (ja) | 欠陥分類装置および方法並びにプログラム | |
| CN112805719B (zh) | 分类半导体样本中的缺陷 | |
| CN109285791B (zh) | 设计布局为主的快速在线缺陷诊断、分类及取样方法及系统 | |
| TWI801973B (zh) | 錯誤因素之推定裝置及推定方法 | |
| JP4355193B2 (ja) | 半導体デバイスの製造方法及び半導体デバイス製造システム | |
| CN117933846B (zh) | 一种基于大数据技术的电商智慧化物流配送系统及方法 | |
| TW202028901A (zh) | 異常因子推估裝置、異常因子推估方法及程式產品 | |
| CN118056211A (zh) | 错误原因推定装置、错误原因推定方法以及计算机可读介质 | |
| JP2022113099A (ja) | 作業管理装置、作業管理方法、および作業管理プログラム | |
| KR102470763B1 (ko) | 데이터 이상치 탐색 장치 및 방법 | |
| Kim et al. | A sensor data mining process for identifying root causes associated with low yield in semiconductor manufacturing | |
| KR20250076593A (ko) | 에러 요인 해석 장치, 및 에러 요인 해석 방법 | |
| JP4758619B2 (ja) | 問題工程特定方法および装置 | |
| CN119816917A (zh) | 信息处理方法、计算机程序以及信息处理装置 | |
| CN116894965A (zh) | 教师数据收集方法以及收集装置 | |
| CN121999291A (zh) | 包裹封签识别方法、装置、设备及存储介质 | |
| CN121861561A (zh) | 一种pcb板智能检测与缺陷生产参数追溯方法 | |
| CN121350505A (zh) | 基于图像处理的品控管理智能检验方法、系统及介质 | |
| WO2022158216A1 (ja) | 作業管理装置、作業管理方法、および作業管理プログラム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |