TWI863659B - 錯誤因素解析裝置及錯誤因素解析方法 - Google Patents

錯誤因素解析裝置及錯誤因素解析方法 Download PDF

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Publication number
TWI863659B
TWI863659B TW112141453A TW112141453A TWI863659B TW I863659 B TWI863659 B TW I863659B TW 112141453 A TW112141453 A TW 112141453A TW 112141453 A TW112141453 A TW 112141453A TW I863659 B TWI863659 B TW I863659B
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TW
Taiwan
Prior art keywords
error
measurement point
anomaly
label
small
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TW112141453A
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English (en)
Chinese (zh)
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TW202422258A (zh
Inventor
吉田泰浩
石川昌義
笹嶋二大
大越栄生
Original Assignee
日商日立全球先端科技股份有限公司
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Publication of TW202422258A publication Critical patent/TW202422258A/zh
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0275—Fault isolation and identification, e.g. classify fault; estimate cause or root of failure
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Debugging And Monitoring (AREA)
  • Testing And Monitoring For Control Systems (AREA)
TW112141453A 2022-11-16 2023-10-30 錯誤因素解析裝置及錯誤因素解析方法 TWI863659B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/042563 WO2024105811A1 (ja) 2022-11-16 2022-11-16 エラー要因解析装置、および、エラー要因解析方法
WOPCT/JP2022/042563 2022-11-16

Publications (2)

Publication Number Publication Date
TW202422258A TW202422258A (zh) 2024-06-01
TWI863659B true TWI863659B (zh) 2024-11-21

Family

ID=91084051

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TW112141453A TWI863659B (zh) 2022-11-16 2023-10-30 錯誤因素解析裝置及錯誤因素解析方法

Country Status (5)

Country Link
JP (1) JP7821323B2 (https=)
KR (1) KR20250076593A (https=)
CN (1) CN120153466A (https=)
TW (1) TWI863659B (https=)
WO (1) WO2024105811A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120290261A1 (en) * 2011-05-12 2012-11-15 Abelman, Frayne & Schwab Valve actuator fault analysis system
US20190056983A1 (en) * 2017-08-18 2019-02-21 TmaxSoft Co., Ltd. It system fault analysis technique based on configuration management database
JP2019054179A (ja) * 2017-09-19 2019-04-04 パナソニックＩｐマネジメント株式会社 エラー要因推定装置およびエラー要因推定方法
WO2021044611A1 (ja) * 2019-09-06 2021-03-11 株式会社日立ハイテク レシピ情報提示システム、レシピエラー推定システム
TW202113703A (zh) * 2019-09-18 2021-04-01 日商三菱電機股份有限公司 作業要素分析裝置及作業要素分析方法
WO2021199164A1 (ja) * 2020-03-30 2021-10-07 株式会社日立ハイテク 診断システム
TW202230060A (zh) * 2020-09-18 2022-08-01 日商三菱電機股份有限公司 資訊處理裝置、資訊處理方法及資訊處理程式產品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4661371B2 (ja) 2005-06-02 2011-03-30 オムロン株式会社 基板検査システム

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120290261A1 (en) * 2011-05-12 2012-11-15 Abelman, Frayne & Schwab Valve actuator fault analysis system
US20190056983A1 (en) * 2017-08-18 2019-02-21 TmaxSoft Co., Ltd. It system fault analysis technique based on configuration management database
JP2019054179A (ja) * 2017-09-19 2019-04-04 パナソニックＩｐマネジメント株式会社 エラー要因推定装置およびエラー要因推定方法
WO2021044611A1 (ja) * 2019-09-06 2021-03-11 株式会社日立ハイテク レシピ情報提示システム、レシピエラー推定システム
TW202113703A (zh) * 2019-09-18 2021-04-01 日商三菱電機股份有限公司 作業要素分析裝置及作業要素分析方法
WO2021199164A1 (ja) * 2020-03-30 2021-10-07 株式会社日立ハイテク 診断システム
TW202230060A (zh) * 2020-09-18 2022-08-01 日商三菱電機股份有限公司 資訊處理裝置、資訊處理方法及資訊處理程式產品

Also Published As

Publication number Publication date
CN120153466A (zh) 2025-06-13
KR20250076593A (ko) 2025-05-29
TW202422258A (zh) 2024-06-01
JP7821323B2 (ja) 2026-02-26
WO2024105811A1 (ja) 2024-05-23
JPWO2024105811A1 (https=) 2024-05-23

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