CN119894963A - 聚酰亚胺薄膜的制造方法 - Google Patents

聚酰亚胺薄膜的制造方法 Download PDF

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Publication number
CN119894963A
CN119894963A CN202380065052.4A CN202380065052A CN119894963A CN 119894963 A CN119894963 A CN 119894963A CN 202380065052 A CN202380065052 A CN 202380065052A CN 119894963 A CN119894963 A CN 119894963A
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CN
China
Prior art keywords
structural unit
polyimide film
formula
group
diamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380065052.4A
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English (en)
Chinese (zh)
Inventor
星野舜
村谷孝博
铃木纮二
石井健太郎
田山琢朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of CN119894963A publication Critical patent/CN119894963A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN202380065052.4A 2022-09-16 2023-09-13 聚酰亚胺薄膜的制造方法 Pending CN119894963A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-148523 2022-09-16
JP2022148523 2022-09-16
PCT/JP2023/033284 WO2024058194A1 (ja) 2022-09-16 2023-09-13 ポリイミドフィルムの製造方法

Publications (1)

Publication Number Publication Date
CN119894963A true CN119894963A (zh) 2025-04-25

Family

ID=90275127

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380065052.4A Pending CN119894963A (zh) 2022-09-16 2023-09-13 聚酰亚胺薄膜的制造方法

Country Status (5)

Country Link
JP (1) JPWO2024058194A1 (https=)
KR (1) KR20250059423A (https=)
CN (1) CN119894963A (https=)
TW (1) TW202424070A (https=)
WO (1) WO2024058194A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10301281A (ja) * 1997-02-25 1998-11-13 Toray Ind Inc 感光性ポリイミド前駆体組成物
WO2016024457A1 (ja) * 2014-08-12 2016-02-18 株式会社カネカ アルコキシシラン変性ポリアミド酸溶液、それを用いた積層体及びフレキシブルデバイス、並びに積層体の製造方法
WO2017051827A1 (ja) * 2015-09-24 2017-03-30 旭化成株式会社 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
KR20170115339A (ko) * 2016-04-07 2017-10-17 주식회사 엘지화학 내열성이 개선된 폴리이미드 필름 및 그 제조방법
JP7304338B2 (ja) * 2018-03-30 2023-07-06 株式会社カネカ ポリイミド膜の製造方法および電子デバイスの製造方法
JP7519812B2 (ja) * 2020-05-28 2024-07-22 太陽ホールディングス株式会社 ポリアミド酸、ポリイミド及びポリイミドフィルム
EP4212574A4 (en) * 2020-09-09 2024-10-09 KJ Chemicals Corporation SOLVENT FOR RESIN SYNTHESIS AND METHOD FOR PRODUCING SYNTHETIC RESIN USING SAID SOLVENT
JP2022061487A (ja) * 2020-10-06 2022-04-18 東レ株式会社 樹脂組成物、それを用いた表示デバイスまたは受光デバイスの製造方法、基板ならびにデバイス

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Publication number Publication date
WO2024058194A1 (ja) 2024-03-21
JPWO2024058194A1 (https=) 2024-03-21
TW202424070A (zh) 2024-06-16
KR20250059423A (ko) 2025-05-02

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