CN118975413A - 伸缩性器件 - Google Patents

伸缩性器件 Download PDF

Info

Publication number
CN118975413A
CN118975413A CN202380025592.XA CN202380025592A CN118975413A CN 118975413 A CN118975413 A CN 118975413A CN 202380025592 A CN202380025592 A CN 202380025592A CN 118975413 A CN118975413 A CN 118975413A
Authority
CN
China
Prior art keywords
wiring
protective layer
substrate
connection member
stretchable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380025592.XA
Other languages
English (en)
Chinese (zh)
Inventor
伊藤宏充
中村祐依
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN118975413A publication Critical patent/CN118975413A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
CN202380025592.XA 2022-03-08 2023-02-28 伸缩性器件 Pending CN118975413A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-035572 2022-03-08
JP2022035572 2022-03-08
PCT/JP2023/007286 WO2023171464A1 (ja) 2022-03-08 2023-02-28 伸縮性デバイス

Publications (1)

Publication Number Publication Date
CN118975413A true CN118975413A (zh) 2024-11-15

Family

ID=87935215

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380025592.XA Pending CN118975413A (zh) 2022-03-08 2023-02-28 伸缩性器件

Country Status (4)

Country Link
US (1) US20240422919A1 (https=)
JP (1) JPWO2023171464A1 (https=)
CN (1) CN118975413A (https=)
WO (1) WO2023171464A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025192170A1 (ja) * 2024-03-14 2025-09-18 株式会社村田製作所 伸縮性デバイス

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3360445B2 (ja) * 1994-11-14 2002-12-24 カシオ計算機株式会社 フレキシブル配線基板の接続構造
JP4423970B2 (ja) * 2003-12-26 2010-03-03 ソニーケミカル＆インフォメーションデバイス株式会社 回路の接続構造及び接続方法
JP2007041389A (ja) * 2005-08-04 2007-02-15 Nec Lcd Technologies Ltd 表示装置及びその製造方法
JP6053190B2 (ja) * 2014-09-30 2016-12-27 株式会社フジクラ プリント配線板
JP2016178225A (ja) * 2015-03-20 2016-10-06 デクセリアルズ株式会社 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤
JP6901244B2 (ja) * 2016-07-13 2021-07-14 日本メクトロン株式会社 フレキシブルプリント配線板の製造方法
JP7061763B2 (ja) * 2018-01-15 2022-05-02 パイクリスタル株式会社 電子デバイス
JP2019139073A (ja) * 2018-02-09 2019-08-22 株式会社ジャパンディスプレイ 表示装置及び配線基板
KR102810370B1 (ko) * 2019-05-28 2025-05-19 리퀴드 와이어 인크. 변형가능 전자 디바이스

Also Published As

Publication number Publication date
JPWO2023171464A1 (https=) 2023-09-14
WO2023171464A1 (ja) 2023-09-14
US20240422919A1 (en) 2024-12-19

Similar Documents

Publication Publication Date Title
CN100468715C (zh) 半导体元件的连接结构、布线衬底及半导体装置
US10083887B2 (en) Chip component-embedded resin multilayer substrate and manufacturing method thereof
EP2930747A1 (en) Lead for connection to a semiconductor device
KR20090009737A (ko) 반도체장치 및 그 제조방법
KR20090009710A (ko) 반도체 장치 및 그 제조 방법
KR20150018247A (ko) 전자기기의 접합구조
CN118975413A (zh) 伸缩性器件
US10219380B2 (en) Electronic device module and manufacturing method thereof
WO2023106055A1 (ja) 伸縮性デバイス
CN107958875B (zh) 半导体装置以及布线基板的设计方法
WO2010070779A1 (ja) 異方性導電樹脂、基板接続構造及び電子機器
TW200406055A (en) Semiconductor device
US12087736B2 (en) Semiconductor device
JP2004087936A (ja) 半導体装置及び半導体装置の製造方法並びに電子機器
KR100516815B1 (ko) 반도체장치
KR20110092779A (ko) 반도체 파워 모듈 패키지 및 그의 제조방법
JP6399006B2 (ja) 部品実装基板の製造方法
JP7794361B2 (ja) 伸縮性デバイス
JP4845097B2 (ja) 半導体装置
US20220199568A1 (en) Module
US20250048542A1 (en) Circuit module and manufacturing method therefor
US20240170353A1 (en) Semiconductor device and mounting structure for semiconductor element
WO2023171294A1 (ja) 伸縮性デバイス
JP2006332415A (ja) 半導体装置
JP6474008B2 (ja) 接続材料

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination