CN118575244A - 层叠陶瓷电容器 - Google Patents
层叠陶瓷电容器 Download PDFInfo
- Publication number
- CN118575244A CN118575244A CN202380018164.4A CN202380018164A CN118575244A CN 118575244 A CN118575244 A CN 118575244A CN 202380018164 A CN202380018164 A CN 202380018164A CN 118575244 A CN118575244 A CN 118575244A
- Authority
- CN
- China
- Prior art keywords
- capacitor
- external electrode
- bump
- ceramic capacitor
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-055678 | 2022-03-30 | ||
| JP2022055678 | 2022-03-30 | ||
| PCT/JP2023/010559 WO2023189718A1 (ja) | 2022-03-30 | 2023-03-17 | 積層セラミックコンデンサ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118575244A true CN118575244A (zh) | 2024-08-30 |
Family
ID=88201839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380018164.4A Pending CN118575244A (zh) | 2022-03-30 | 2023-03-17 | 层叠陶瓷电容器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240387111A1 (https=) |
| JP (1) | JP7662104B2 (https=) |
| CN (1) | CN118575244A (https=) |
| WO (1) | WO2023189718A1 (https=) |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2587851Y2 (ja) * | 1991-07-01 | 1998-12-24 | 株式会社村田製作所 | 積層コンデンサ |
| JPH1167585A (ja) * | 1997-08-11 | 1999-03-09 | Murata Mfg Co Ltd | 積層電子部品 |
| US7177137B2 (en) * | 2002-04-15 | 2007-02-13 | Avx Corporation | Plated terminations |
| DE102005016590A1 (de) * | 2005-04-11 | 2006-10-26 | Epcos Ag | Elektrisches Mehrschicht-Bauelement und Verfahren zur Herstellung eines Mehrschicht-Bauelements |
| JP2008302588A (ja) * | 2007-06-07 | 2008-12-18 | Canon Inc | インクジェットヘッド及びインクジェットヘッドの製造方法 |
| JP2009016395A (ja) * | 2007-06-29 | 2009-01-22 | Kyocera Kinseki Corp | 電子部品の接合方法 |
| JP5853976B2 (ja) * | 2012-06-12 | 2016-02-09 | 株式会社村田製作所 | 積層コンデンサ |
| US9805867B2 (en) * | 2012-09-19 | 2017-10-31 | Apple Inc. | Acoustically quiet capacitors |
| JP6136916B2 (ja) * | 2013-03-15 | 2017-05-31 | 株式会社村田製作所 | 積層コンデンサ |
| KR102029493B1 (ko) * | 2014-09-29 | 2019-10-07 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| JP6623493B2 (ja) | 2016-03-16 | 2019-12-25 | 大口マテリアル株式会社 | リードフレーム及び半導体装置、並びにそれらの製造方法 |
| KR102408016B1 (ko) * | 2016-12-01 | 2022-06-13 | 가부시키가이샤 무라타 세이사쿠쇼 | 칩형 전자 부품 |
| KR102057905B1 (ko) * | 2017-08-31 | 2019-12-20 | 삼성전기주식회사 | 적층형 전자 부품 및 그 실장 기판 |
| KR102473422B1 (ko) * | 2017-10-02 | 2022-12-02 | 삼성전기주식회사 | 적층형 전자 부품 및 그 실장 기판 |
| JP7292958B2 (ja) * | 2019-04-26 | 2023-06-19 | 株式会社村田製作所 | 電子部品の実装構造体 |
| JP2020202220A (ja) * | 2019-06-07 | 2020-12-17 | 株式会社村田製作所 | 積層セラミック電子部品 |
| KR102730020B1 (ko) * | 2019-12-31 | 2024-11-14 | 삼성전기주식회사 | 적층형 전자 부품 및 그 실장 기판 |
-
2023
- 2023-03-17 WO PCT/JP2023/010559 patent/WO2023189718A1/ja not_active Ceased
- 2023-03-17 JP JP2024511818A patent/JP7662104B2/ja active Active
- 2023-03-17 CN CN202380018164.4A patent/CN118575244A/zh active Pending
-
2024
- 2024-07-30 US US18/788,282 patent/US20240387111A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7662104B2 (ja) | 2025-04-15 |
| US20240387111A1 (en) | 2024-11-21 |
| JPWO2023189718A1 (https=) | 2023-10-05 |
| WO2023189718A1 (ja) | 2023-10-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |