CN1184866C - 热控制器件以及制造这种器件的方法 - Google Patents

热控制器件以及制造这种器件的方法 Download PDF

Info

Publication number
CN1184866C
CN1184866C CNB998094374A CN99809437A CN1184866C CN 1184866 C CN1184866 C CN 1184866C CN B998094374 A CNB998094374 A CN B998094374A CN 99809437 A CN99809437 A CN 99809437A CN 1184866 C CN1184866 C CN 1184866C
Authority
CN
China
Prior art keywords
carbon
thermal management
management device
encapsulating material
pyrolytic graphite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998094374A
Other languages
English (en)
Chinese (zh)
Other versions
CN1313023A (zh
Inventor
A·甘迪
R·德欧利维拉
A·A·卡特尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Queen Mary University of London
Original Assignee
EUROPE ORGANISATION FOR NUCLEAR
Queen Mary and Westfiled College University of London
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROPE ORGANISATION FOR NUCLEAR, Queen Mary and Westfiled College University of London filed Critical EUROPE ORGANISATION FOR NUCLEAR
Publication of CN1313023A publication Critical patent/CN1313023A/zh
Application granted granted Critical
Publication of CN1184866C publication Critical patent/CN1184866C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Control Of Heat Treatment Processes (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Making Paper Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
CNB998094374A 1998-07-08 1999-07-08 热控制器件以及制造这种器件的方法 Expired - Fee Related CN1184866C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
GBGB9814835.6A GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GB9814835.6 1998-07-08
GB9825376.8 1998-11-19
GBGB9825376.8A GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board
GB9900924.3 1999-01-15
GB9900924 1999-01-15

Publications (2)

Publication Number Publication Date
CN1313023A CN1313023A (zh) 2001-09-12
CN1184866C true CN1184866C (zh) 2005-01-12

Family

ID=27269389

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998094374A Expired - Fee Related CN1184866C (zh) 1998-07-08 1999-07-08 热控制器件以及制造这种器件的方法

Country Status (17)

Country Link
US (2) US6514616B1 (https=)
EP (2) EP1492396A3 (https=)
JP (1) JP2002520863A (https=)
KR (1) KR100707155B1 (https=)
CN (1) CN1184866C (https=)
AT (1) ATE277497T1 (https=)
AU (1) AU4790799A (https=)
CA (1) CA2336889C (https=)
DE (1) DE69920459T2 (https=)
DK (1) DK1095545T3 (https=)
ES (1) ES2229727T3 (https=)
GB (2) GB9814835D0 (https=)
HK (1) HK1040473B (https=)
PT (1) PT1095545E (https=)
RU (1) RU2214698C2 (https=)
SI (1) SI1095545T1 (https=)
WO (1) WO2000003567A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108646885A (zh) * 2014-01-26 2018-10-12 太仓斯迪克新材料科技有限公司 用于笔记本电脑的散热片

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
WO2001095077A1 (en) * 2000-06-06 2001-12-13 Matsushita Refrigeration Company Portable information appliance
US20020021997A1 (en) * 2000-06-23 2002-02-21 Akira Taomoto Graphite sheet coated with insulating material and coating method thereof
US8382004B2 (en) * 2001-04-04 2013-02-26 Graftech International Holdings Inc. Flexible graphite flooring heat spreader
KR100468122B1 (ko) * 2002-07-08 2005-01-26 삼성전자주식회사 전자렌지
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
KR20060010763A (ko) * 2003-05-01 2006-02-02 퀸 메리 앤드 웨스트필드 컬리지 케이스화된 열 관리 장치 및 그 제조 방법
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
GB2409341A (en) * 2003-12-16 2005-06-22 Otter Controls Ltd Improvements relating to thermal control units
KR100792056B1 (ko) * 2004-01-08 2008-01-04 히다치 가세고교 가부시끼가이샤 폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물
US7918591B2 (en) 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US7297399B2 (en) * 2005-10-11 2007-11-20 General Electric Company Thermal transport structure and associated method
US7797808B2 (en) * 2005-10-11 2010-09-21 General Electric Company Thermal management system and associated method
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
GB2432830A (en) * 2005-12-02 2007-06-06 Morganite Elect Carbon Formation of thermally anisotropic carbon material
US20070251456A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc., A Delaware Corporation Composite heater and chill plate
US8148647B2 (en) * 2006-08-23 2012-04-03 Mitsubishi Electric Corporation Printed circuit board and method of manufacturing the same
GB0700917D0 (en) * 2007-01-17 2007-02-28 Queen Mary & Westfield College Structures with improved properties
US7808787B2 (en) * 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
US20090169410A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a thermo pyrolytic graphite-embedded heatsink
US7742307B2 (en) * 2008-01-17 2010-06-22 Raytheon Company High performance power device
US8570747B2 (en) * 2008-12-04 2013-10-29 Hewlett-Packard Development Company, L.P. Carbon laminated enclosure
US7903418B2 (en) 2009-04-21 2011-03-08 Hewlett-Packard Development Company, L.P. Thermal mitigation device and method
MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
DE102009035850A1 (de) * 2009-07-31 2011-02-03 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leiterplattenordnung mit Keramikplatte und Grafitschicht
GB0917098D0 (en) 2009-09-29 2009-11-11 Morganite Elect Carbon Carbon materials
JP5035356B2 (ja) * 2010-01-26 2012-09-26 株式会社デンソー 樹脂封止型電子装置およびその製造方法
RU2474004C1 (ru) * 2011-08-16 2013-01-27 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ изготовления многоуровневых тонкопленочных микросхем
JP5619830B2 (ja) * 2011-08-24 2014-11-05 パナソニック株式会社 樹脂−反磁性物質複合構造体、その製造方法、およびそれを用いた半導体装置
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
US20180229825A1 (en) 2014-05-01 2018-08-16 Blue Robotics Inc. Submersible electric thruster
CN108701880B (zh) * 2016-03-14 2022-04-08 松下知识产权经营株式会社 复合片以及使用该复合片的电池组
CN109417855A (zh) * 2016-06-29 2019-03-01 奥特斯奥地利科技与系统技术有限公司 通过介电壳体内的碳结构冷却部件承载件材料
CN207939941U (zh) * 2018-03-27 2018-10-02 京东方科技集团股份有限公司 用于显示面板的散热装置和显示装置
CN110147127A (zh) * 2019-05-24 2019-08-20 珠海格力智能装备有限公司 控制系统及方法
CA3169302C (fr) * 2020-03-02 2023-02-28 Didier Charvet Instrument optique spatial comprenant une garde thermique amelioree
US11497137B2 (en) * 2020-12-18 2022-11-08 Hewlett Packard Enterprise Development Lp Method and apparatus for extended serial temperature control in a compute device
WO2025079195A1 (ja) * 2023-10-12 2025-04-17 日本碍子株式会社 半導体製造装置用部材

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
US4318954A (en) 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
FR2546878B1 (fr) 1983-05-31 1988-04-08 Slonina Jean Pierre Plaque support d'un substrat ceramique, leger, a forte conductivite thermique et coefficient de dilatation adapte pour toutes applications dans le domaine electronique
US4591659A (en) 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
US4916016A (en) 1986-01-23 1990-04-10 Ici Americas Inc. Metal or plastic-clad polyvinyl resin laminates
US4849858A (en) 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
US4791248A (en) 1987-01-22 1988-12-13 The Boeing Company Printed wire circuit board and its method of manufacture
US5296310A (en) 1992-02-14 1994-03-22 Materials Science Corporation High conductivity hydrid material for thermal management
CH687490A5 (de) 1992-03-25 1996-12-13 Dyconex Ag Leiterplattenverstaerkung.
US5309321A (en) 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
CA2124158C (en) * 1993-06-14 2005-09-13 Daniel H. Hecht High modulus carbon and graphite articles and method for their preparation
JP3305720B2 (ja) * 1993-07-06 2002-07-24 株式会社東芝 放熱シート
WO1996037915A1 (en) 1995-05-26 1996-11-28 Sheldahl, Inc. Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
WO1998040431A1 (en) * 1997-03-11 1998-09-17 Amoco Corporation Thermally conductive film and method for the preparation thereof
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6075701A (en) 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108646885A (zh) * 2014-01-26 2018-10-12 太仓斯迪克新材料科技有限公司 用于笔记本电脑的散热片

Also Published As

Publication number Publication date
PT1095545E (pt) 2005-01-31
EP1095545B1 (en) 2004-09-22
HK1040473A1 (en) 2002-06-07
CA2336889C (en) 2008-09-30
KR20010079508A (ko) 2001-08-22
SI1095545T1 (en) 2005-02-28
EP1492396A2 (en) 2004-12-29
JP2002520863A (ja) 2002-07-09
DK1095545T3 (da) 2005-01-24
ATE277497T1 (de) 2004-10-15
HK1040473B (zh) 2005-05-27
CN1313023A (zh) 2001-09-12
RU2214698C2 (ru) 2003-10-20
DE69920459T2 (de) 2005-10-13
DE69920459D1 (de) 2004-10-28
US20030099836A1 (en) 2003-05-29
US6689471B2 (en) 2004-02-10
EP1492396A3 (en) 2005-07-27
GB9814835D0 (en) 1998-09-09
CA2336889A1 (en) 2000-01-20
ES2229727T3 (es) 2005-04-16
AU4790799A (en) 2000-02-01
EP1095545A1 (en) 2001-05-02
US6514616B1 (en) 2003-02-04
WO2000003567A1 (en) 2000-01-20
GB9825376D0 (en) 1999-01-13
KR100707155B1 (ko) 2007-04-16

Similar Documents

Publication Publication Date Title
CN1184866C (zh) 热控制器件以及制造这种器件的方法
CN1171514C (zh) 低cte的电源和地层
CN1282403C (zh) 多层布线板
CN1158006A (zh) 具有降低应力成模衬底部分的挠性层的高密度互连电路模件
CN102550138B (zh) 结构体及其制造方法
CN1946271A (zh) 印刷电路板及其制造方法
CN1263356C (zh) 电路基片的制造方法及电路基片和其电力转换模块
CN1205669C (zh) 电路基片及其制造方法以及使用它的电子仪器
RU2001103633A (ru) Устройство отвода тепла, электрическая система, содержащая устройство отвода тепла, способ изготовления устройства отвода тепла и способ изготовления электрического компонента
JP4035948B2 (ja) 熱電素子モジュール及びその製法
WO2013142580A1 (en) Application of dielectric layer and circuit traces on heat sink
WO2014129696A1 (ko) 두께 방향으로 우수한 열전도 특성을 갖는 방열판의 제조방법과 이 방법에 의해 제조된 방열판
JP3850956B2 (ja) 放熱性炭素複合板
TWI460076B (zh) A substrate manufacturing method and a structure for simplifying the process
CN101069283A (zh) 封装的热能管理装置以及制造这种装置的方法
RU2256307C2 (ru) Устройство отвода тепла (варианты), электрическая система, содержащая устройство отвода тепла (варианты), способ изготовления устройства отвода тепла (варианты) и способ изготовления электрического компонента (варианты)
JPH10509277A (ja) 追加の印刷回路のための熱制御
HK1073565A (en) A thermal management device and method of making such a device
RU2003115417A (ru) Устройство отвода тепла (варианты), электрическая система, содержащая устройство отвода тепла (варианты), способ изготовления устройства отвода тепла (варианты) и способ изготовления электрического компонента (варианты)
JP2004179011A (ja) 絶縁フィルムおよびこれを用いた多層配線基板
JPH01157589A (ja) 金属ベース基板の製造方法
JP2004322482A (ja) 絶縁フィルムおよびこれを用いた多層配線基板
JPH01240676A (ja) 金属ベース基板の製造方法
JP2003062942A (ja) 絶縁フィルムおよびこれを用いた多層配線基板
JP2004296573A (ja) 絶縁フィルムおよびこれを用いた多層配線基板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: QUEEN MARY & WESTFIELD COLLEGE- WAGONFELD ACADEMY

Free format text: FORMER OWNER: EUROPEAN ATOMIC ENERGY RESEARCH ORGANIZATION

Free format text: FORMER OWNER: QUEEN MARY + WESTFIELD COLLEGE- WAGONFELD ACADEMY

Effective date: 20050520

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20050520

Address after: London, England

Patentee after: Queen Mary & Westfield College

Address before: geneva

Co-patentee before: Queen Mary & Westfield College

Patentee before: Europe Organisation for Nuclear

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050112