GB9814835D0 - A thermal management board - Google Patents

A thermal management board

Info

Publication number
GB9814835D0
GB9814835D0 GBGB9814835.6A GB9814835A GB9814835D0 GB 9814835 D0 GB9814835 D0 GB 9814835D0 GB 9814835 A GB9814835 A GB 9814835A GB 9814835 D0 GB9814835 D0 GB 9814835D0
Authority
GB
United Kingdom
Prior art keywords
thermal management
carbon
encapsulating material
management device
management board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9814835.6A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
European Organization for Nuclear Research CERN
Original Assignee
European Organization for Nuclear Research CERN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by European Organization for Nuclear Research CERN filed Critical European Organization for Nuclear Research CERN
Priority to GBGB9814835.6A priority Critical patent/GB9814835D0/en
Publication of GB9814835D0 publication Critical patent/GB9814835D0/en
Priority to GBGB9825376.8A priority patent/GB9825376D0/en
Priority to HK02101746.3A priority patent/HK1040473B/zh
Priority to DK99931369T priority patent/DK1095545T3/da
Priority to AU47907/99A priority patent/AU4790799A/en
Priority to PCT/GB1999/002180 priority patent/WO2000003567A1/en
Priority to EP99931369A priority patent/EP1095545B1/en
Priority to AT99931369T priority patent/ATE277497T1/de
Priority to US09/719,478 priority patent/US6514616B1/en
Priority to JP2000559715A priority patent/JP2002520863A/ja
Priority to RU2003115417/09A priority patent/RU2256307C2/ru
Priority to RU2001103633/09A priority patent/RU2214698C2/ru
Priority to PT99931369T priority patent/PT1095545E/pt
Priority to CNB998094374A priority patent/CN1184866C/zh
Priority to SI9930712T priority patent/SI1095545T1/xx
Priority to EP04017844A priority patent/EP1492396A3/en
Priority to KR1020017000252A priority patent/KR100707155B1/ko
Priority to CA002336889A priority patent/CA2336889C/en
Priority to DE69920459T priority patent/DE69920459T2/de
Priority to ES99931369T priority patent/ES2229727T3/es
Priority to US10/336,338 priority patent/US6689471B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Control Of Heat Treatment Processes (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Making Paper Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
GBGB9814835.6A 1998-07-08 1998-07-08 A thermal management board Ceased GB9814835D0 (en)

Priority Applications (21)

Application Number Priority Date Filing Date Title
GBGB9814835.6A GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GBGB9825376.8A GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board
ES99931369T ES2229727T3 (es) 1998-07-08 1999-07-08 Dispositivo de control termico y metodo de fabricacion de tal dispositivo.
RU2003115417/09A RU2256307C2 (ru) 1998-07-08 1999-07-08 Устройство отвода тепла (варианты), электрическая система, содержащая устройство отвода тепла (варианты), способ изготовления устройства отвода тепла (варианты) и способ изготовления электрического компонента (варианты)
RU2001103633/09A RU2214698C2 (ru) 1998-07-08 1999-07-08 Устройство отвода тепла, электрическая система, содержащая устройство отвода тепла, способ изготовления устройства отвода тепла и способ изготовления электрического компонента
AU47907/99A AU4790799A (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device
PCT/GB1999/002180 WO2000003567A1 (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device
EP99931369A EP1095545B1 (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device
AT99931369T ATE277497T1 (de) 1998-07-08 1999-07-08 Wärme-management-vorrichtung und verfahren zu seiner herstellung
US09/719,478 US6514616B1 (en) 1998-07-08 1999-07-08 Thermal management device and method of making such a device
JP2000559715A JP2002520863A (ja) 1998-07-08 1999-07-08 熱管理素子およびその製造方法
HK02101746.3A HK1040473B (zh) 1998-07-08 1999-07-08 热控制器件以及制造这种器件的方法
DK99931369T DK1095545T3 (da) 1998-07-08 1999-07-08 Varmehåndteringsindretning og fremgangsmåde til fremstilling af en sådan indretning
PT99931369T PT1095545E (pt) 1998-07-08 1999-07-08 Dispositivo de gestao e temperatura e metodo para fazer um dispositivo semelhante
CNB998094374A CN1184866C (zh) 1998-07-08 1999-07-08 热控制器件以及制造这种器件的方法
SI9930712T SI1095545T1 (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device
EP04017844A EP1492396A3 (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device
KR1020017000252A KR100707155B1 (ko) 1998-07-08 1999-07-08 열 관리 장치 및 그 제조 방법
CA002336889A CA2336889C (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device
DE69920459T DE69920459T2 (de) 1998-07-08 1999-07-08 Wärme-management-vorrichtung und verfahren zu seiner herstellung
US10/336,338 US6689471B2 (en) 1998-07-08 2003-01-02 Thermal management device and method of making such a device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB9814835.6A GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GBGB9825376.8A GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board
GB9900924 1999-01-15

Publications (1)

Publication Number Publication Date
GB9814835D0 true GB9814835D0 (en) 1998-09-09

Family

ID=27269389

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9814835.6A Ceased GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GBGB9825376.8A Ceased GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board

Family Applications After (1)

Application Number Title Priority Date Filing Date
GBGB9825376.8A Ceased GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board

Country Status (17)

Country Link
US (2) US6514616B1 (https=)
EP (2) EP1492396A3 (https=)
JP (1) JP2002520863A (https=)
KR (1) KR100707155B1 (https=)
CN (1) CN1184866C (https=)
AT (1) ATE277497T1 (https=)
AU (1) AU4790799A (https=)
CA (1) CA2336889C (https=)
DE (1) DE69920459T2 (https=)
DK (1) DK1095545T3 (https=)
ES (1) ES2229727T3 (https=)
GB (2) GB9814835D0 (https=)
HK (1) HK1040473B (https=)
PT (1) PT1095545E (https=)
RU (1) RU2214698C2 (https=)
SI (1) SI1095545T1 (https=)
WO (1) WO2000003567A1 (https=)

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WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
KR20060010763A (ko) * 2003-05-01 2006-02-02 퀸 메리 앤드 웨스트필드 컬리지 케이스화된 열 관리 장치 및 그 제조 방법
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
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KR100792056B1 (ko) * 2004-01-08 2008-01-04 히다치 가세고교 가부시끼가이샤 폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물
US7918591B2 (en) 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US7297399B2 (en) * 2005-10-11 2007-11-20 General Electric Company Thermal transport structure and associated method
US7797808B2 (en) * 2005-10-11 2010-09-21 General Electric Company Thermal management system and associated method
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
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US20070251456A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc., A Delaware Corporation Composite heater and chill plate
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US7808787B2 (en) * 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
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US7903418B2 (en) 2009-04-21 2011-03-08 Hewlett-Packard Development Company, L.P. Thermal mitigation device and method
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US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
DE102009035850A1 (de) * 2009-07-31 2011-02-03 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leiterplattenordnung mit Keramikplatte und Grafitschicht
GB0917098D0 (en) 2009-09-29 2009-11-11 Morganite Elect Carbon Carbon materials
JP5035356B2 (ja) * 2010-01-26 2012-09-26 株式会社デンソー 樹脂封止型電子装置およびその製造方法
RU2474004C1 (ru) * 2011-08-16 2013-01-27 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ изготовления многоуровневых тонкопленочных микросхем
JP5619830B2 (ja) * 2011-08-24 2014-11-05 パナソニック株式会社 樹脂−反磁性物質複合構造体、その製造方法、およびそれを用いた半導体装置
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
CN107043108B (zh) * 2014-01-26 2019-04-23 斯迪克新型材料（江苏）有限公司 用于智能手机的散热片制造工艺
US20180229825A1 (en) 2014-05-01 2018-08-16 Blue Robotics Inc. Submersible electric thruster
CN108701880B (zh) * 2016-03-14 2022-04-08 松下知识产权经营株式会社 复合片以及使用该复合片的电池组
CN109417855A (zh) * 2016-06-29 2019-03-01 奥特斯奥地利科技与系统技术有限公司 通过介电壳体内的碳结构冷却部件承载件材料
CN207939941U (zh) * 2018-03-27 2018-10-02 京东方科技集团股份有限公司 用于显示面板的散热装置和显示装置
CN110147127A (zh) * 2019-05-24 2019-08-20 珠海格力智能装备有限公司 控制系统及方法
CA3169302C (fr) * 2020-03-02 2023-02-28 Didier Charvet Instrument optique spatial comprenant une garde thermique amelioree
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Also Published As

Publication number Publication date
PT1095545E (pt) 2005-01-31
CN1184866C (zh) 2005-01-12
EP1095545B1 (en) 2004-09-22
HK1040473A1 (en) 2002-06-07
CA2336889C (en) 2008-09-30
KR20010079508A (ko) 2001-08-22
SI1095545T1 (en) 2005-02-28
EP1492396A2 (en) 2004-12-29
JP2002520863A (ja) 2002-07-09
DK1095545T3 (da) 2005-01-24
ATE277497T1 (de) 2004-10-15
HK1040473B (zh) 2005-05-27
CN1313023A (zh) 2001-09-12
RU2214698C2 (ru) 2003-10-20
DE69920459T2 (de) 2005-10-13
DE69920459D1 (de) 2004-10-28
US20030099836A1 (en) 2003-05-29
US6689471B2 (en) 2004-02-10
EP1492396A3 (en) 2005-07-27
CA2336889A1 (en) 2000-01-20
ES2229727T3 (es) 2005-04-16
AU4790799A (en) 2000-02-01
EP1095545A1 (en) 2001-05-02
US6514616B1 (en) 2003-02-04
WO2000003567A1 (en) 2000-01-20
GB9825376D0 (en) 1999-01-13
KR100707155B1 (ko) 2007-04-16

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