CN118355479A - 壳体以及探测器 - Google Patents

壳体以及探测器 Download PDF

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Publication number
CN118355479A
CN118355479A CN202280079960.4A CN202280079960A CN118355479A CN 118355479 A CN118355479 A CN 118355479A CN 202280079960 A CN202280079960 A CN 202280079960A CN 118355479 A CN118355479 A CN 118355479A
Authority
CN
China
Prior art keywords
level
side frame
housing
floor base
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280079960.4A
Other languages
English (en)
Chinese (zh)
Inventor
长岛秀明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of CN118355479A publication Critical patent/CN118355479A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202280079960.4A 2021-12-02 2022-09-30 壳体以及探测器 Pending CN118355479A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-196404 2021-12-02
JP2021196404A JP2023082554A (ja) 2021-12-02 2021-12-02 筐体及びプローバ
PCT/JP2022/036737 WO2023100463A1 (ja) 2021-12-02 2022-09-30 筐体及びプローバ

Publications (1)

Publication Number Publication Date
CN118355479A true CN118355479A (zh) 2024-07-16

Family

ID=86611939

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280079960.4A Pending CN118355479A (zh) 2021-12-02 2022-09-30 壳体以及探测器

Country Status (6)

Country Link
US (1) US12399215B2 (enExample)
JP (1) JP2023082554A (enExample)
KR (1) KR102707853B1 (enExample)
CN (1) CN118355479A (enExample)
MY (1) MY206652A (enExample)
WO (1) WO2023100463A1 (enExample)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016181690A (ja) * 2015-03-24 2016-10-13 株式会社東京精密 プローバ
CN108470690A (zh) * 2017-03-07 2018-08-31 株式会社东京精密 探测器
JP2019109242A (ja) * 2015-03-25 2019-07-04 株式会社東京精密 筐体
KR20210019193A (ko) * 2019-08-12 2021-02-22 주식회사 쎄믹스 그룹 프로버 시스템 및 이의 설치 방법
JP2021052065A (ja) * 2019-09-24 2021-04-01 東京エレクトロン株式会社 検査装置の制御方法および検査装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7100340B2 (en) * 2001-08-31 2006-09-05 Asyst Technologies, Inc. Unified frame for semiconductor material handling system
JP5120018B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
US9304412B2 (en) * 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
KR20110039763A (ko) * 2009-10-12 2011-04-20 뉴센트 주식회사 프로브카드 자동클리닝시스템
JP6042760B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP6267928B2 (ja) * 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
JP6478106B2 (ja) * 2015-03-25 2019-03-06 株式会社東京精密 プローバ
JP6041175B2 (ja) 2015-03-30 2016-12-07 株式会社東京精密 プローバ
JP6652361B2 (ja) * 2015-09-30 2020-02-19 東京エレクトロン株式会社 ウエハ検査装置及びウエハ検査方法
JP2020096028A (ja) * 2018-12-11 2020-06-18 東京エレクトロン株式会社 検査装置、及び、検査方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016181690A (ja) * 2015-03-24 2016-10-13 株式会社東京精密 プローバ
JP2019109242A (ja) * 2015-03-25 2019-07-04 株式会社東京精密 筐体
CN108470690A (zh) * 2017-03-07 2018-08-31 株式会社东京精密 探测器
KR20210019193A (ko) * 2019-08-12 2021-02-22 주식회사 쎄믹스 그룹 프로버 시스템 및 이의 설치 방법
JP2021052065A (ja) * 2019-09-24 2021-04-01 東京エレクトロン株式会社 検査装置の制御方法および検査装置

Also Published As

Publication number Publication date
MY206652A (en) 2024-12-30
KR20240091037A (ko) 2024-06-21
KR102707853B1 (ko) 2024-09-23
WO2023100463A1 (ja) 2023-06-08
US12399215B2 (en) 2025-08-26
US20240319264A1 (en) 2024-09-26
JP2023082554A (ja) 2023-06-14

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