KR102707853B1 - 하우징 및 프로버 - Google Patents

하우징 및 프로버 Download PDF

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Publication number
KR102707853B1
KR102707853B1 KR1020247017579A KR20247017579A KR102707853B1 KR 102707853 B1 KR102707853 B1 KR 102707853B1 KR 1020247017579 A KR1020247017579 A KR 1020247017579A KR 20247017579 A KR20247017579 A KR 20247017579A KR 102707853 B1 KR102707853 B1 KR 102707853B1
Authority
KR
South Korea
Prior art keywords
layer
side frame
housing
floor base
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247017579A
Other languages
English (en)
Korean (ko)
Other versions
KR20240091037A (ko
Inventor
히데아키 나가시마
Original Assignee
가부시키가이샤 도교 세이미쓰
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 도교 세이미쓰 filed Critical 가부시키가이샤 도교 세이미쓰
Publication of KR20240091037A publication Critical patent/KR20240091037A/ko
Application granted granted Critical
Publication of KR102707853B1 publication Critical patent/KR102707853B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020247017579A 2021-12-02 2022-09-30 하우징 및 프로버 Active KR102707853B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021196404A JP2023082554A (ja) 2021-12-02 2021-12-02 筐体及びプローバ
JPJP-P-2021-196404 2021-12-02
PCT/JP2022/036737 WO2023100463A1 (ja) 2021-12-02 2022-09-30 筐体及びプローバ

Publications (2)

Publication Number Publication Date
KR20240091037A KR20240091037A (ko) 2024-06-21
KR102707853B1 true KR102707853B1 (ko) 2024-09-23

Family

ID=86611939

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247017579A Active KR102707853B1 (ko) 2021-12-02 2022-09-30 하우징 및 프로버

Country Status (6)

Country Link
US (1) US12399215B2 (enExample)
JP (1) JP2023082554A (enExample)
KR (1) KR102707853B1 (enExample)
CN (1) CN118355479A (enExample)
MY (1) MY206652A (enExample)
WO (1) WO2023100463A1 (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060177289A1 (en) 2001-08-31 2006-08-10 Bonora Anthony C Unified frame for semiconductor material handling system
US20200064400A1 (en) 2013-10-29 2020-02-27 Tokyo Electron Limited Wafer inspection system, wafer inspection apparatus and prober

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120018B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
US9304412B2 (en) * 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
KR20110039763A (ko) * 2009-10-12 2011-04-20 뉴센트 주식회사 프로브카드 자동클리닝시스템
JP6042760B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP5967510B1 (ja) 2015-03-24 2016-08-10 株式会社東京精密 プローバ
JP6478106B2 (ja) * 2015-03-25 2019-03-06 株式会社東京精密 プローバ
JP6908858B2 (ja) * 2015-03-25 2021-07-28 株式会社東京精密 筐体
JP6041175B2 (ja) 2015-03-30 2016-12-07 株式会社東京精密 プローバ
JP6652361B2 (ja) * 2015-09-30 2020-02-19 東京エレクトロン株式会社 ウエハ検査装置及びウエハ検査方法
JP6365953B1 (ja) * 2017-03-07 2018-08-01 株式会社東京精密 プローバ
JP2020096028A (ja) * 2018-12-11 2020-06-18 東京エレクトロン株式会社 検査装置、及び、検査方法
KR102222827B1 (ko) * 2019-08-12 2021-03-04 주식회사 쎄믹스 그룹 프로버 시스템 및 이의 설치 방법
JP7458161B2 (ja) 2019-09-24 2024-03-29 東京エレクトロン株式会社 検査装置の制御方法および検査装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060177289A1 (en) 2001-08-31 2006-08-10 Bonora Anthony C Unified frame for semiconductor material handling system
US20200064400A1 (en) 2013-10-29 2020-02-27 Tokyo Electron Limited Wafer inspection system, wafer inspection apparatus and prober

Also Published As

Publication number Publication date
US20240319264A1 (en) 2024-09-26
MY206652A (en) 2024-12-30
KR20240091037A (ko) 2024-06-21
US12399215B2 (en) 2025-08-26
CN118355479A (zh) 2024-07-16
JP2023082554A (ja) 2023-06-14
WO2023100463A1 (ja) 2023-06-08

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