JP2023082554A - 筐体及びプローバ - Google Patents

筐体及びプローバ Download PDF

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Publication number
JP2023082554A
JP2023082554A JP2021196404A JP2021196404A JP2023082554A JP 2023082554 A JP2023082554 A JP 2023082554A JP 2021196404 A JP2021196404 A JP 2021196404A JP 2021196404 A JP2021196404 A JP 2021196404A JP 2023082554 A JP2023082554 A JP 2023082554A
Authority
JP
Japan
Prior art keywords
side frame
housing
layer
prober
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021196404A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023082554A5 (enExample
Inventor
秀明 長島
Hideaki Nagashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2021196404A priority Critical patent/JP2023082554A/ja
Priority to KR1020247017579A priority patent/KR102707853B1/ko
Priority to PCT/JP2022/036737 priority patent/WO2023100463A1/ja
Priority to MYPI2024003091A priority patent/MY206652A/en
Priority to CN202280079960.4A priority patent/CN118355479A/zh
Publication of JP2023082554A publication Critical patent/JP2023082554A/ja
Priority to US18/731,040 priority patent/US12399215B2/en
Publication of JP2023082554A5 publication Critical patent/JP2023082554A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021196404A 2021-12-02 2021-12-02 筐体及びプローバ Pending JP2023082554A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021196404A JP2023082554A (ja) 2021-12-02 2021-12-02 筐体及びプローバ
KR1020247017579A KR102707853B1 (ko) 2021-12-02 2022-09-30 하우징 및 프로버
PCT/JP2022/036737 WO2023100463A1 (ja) 2021-12-02 2022-09-30 筐体及びプローバ
MYPI2024003091A MY206652A (en) 2021-12-02 2022-09-30 Housing and prober
CN202280079960.4A CN118355479A (zh) 2021-12-02 2022-09-30 壳体以及探测器
US18/731,040 US12399215B2 (en) 2021-12-02 2024-05-31 Housing and prober

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021196404A JP2023082554A (ja) 2021-12-02 2021-12-02 筐体及びプローバ

Publications (2)

Publication Number Publication Date
JP2023082554A true JP2023082554A (ja) 2023-06-14
JP2023082554A5 JP2023082554A5 (enExample) 2025-03-18

Family

ID=86611939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021196404A Pending JP2023082554A (ja) 2021-12-02 2021-12-02 筐体及びプローバ

Country Status (6)

Country Link
US (1) US12399215B2 (enExample)
JP (1) JP2023082554A (enExample)
KR (1) KR102707853B1 (enExample)
CN (1) CN118355479A (enExample)
MY (1) MY206652A (enExample)
WO (1) WO2023100463A1 (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016181639A (ja) * 2015-03-25 2016-10-13 株式会社東京精密 プローバ
KR20210019193A (ko) * 2019-08-12 2021-02-22 주식회사 쎄믹스 그룹 프로버 시스템 및 이의 설치 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7100340B2 (en) * 2001-08-31 2006-09-05 Asyst Technologies, Inc. Unified frame for semiconductor material handling system
JP5120018B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
US9304412B2 (en) * 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
KR20110039763A (ko) * 2009-10-12 2011-04-20 뉴센트 주식회사 프로브카드 자동클리닝시스템
JP6042760B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP6267928B2 (ja) * 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
JP5967510B1 (ja) 2015-03-24 2016-08-10 株式会社東京精密 プローバ
JP6908858B2 (ja) * 2015-03-25 2021-07-28 株式会社東京精密 筐体
JP6041175B2 (ja) 2015-03-30 2016-12-07 株式会社東京精密 プローバ
JP6652361B2 (ja) * 2015-09-30 2020-02-19 東京エレクトロン株式会社 ウエハ検査装置及びウエハ検査方法
JP6365953B1 (ja) * 2017-03-07 2018-08-01 株式会社東京精密 プローバ
JP2020096028A (ja) * 2018-12-11 2020-06-18 東京エレクトロン株式会社 検査装置、及び、検査方法
JP7458161B2 (ja) 2019-09-24 2024-03-29 東京エレクトロン株式会社 検査装置の制御方法および検査装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016181639A (ja) * 2015-03-25 2016-10-13 株式会社東京精密 プローバ
KR20210019193A (ko) * 2019-08-12 2021-02-22 주식회사 쎄믹스 그룹 프로버 시스템 및 이의 설치 방법

Also Published As

Publication number Publication date
US20240319264A1 (en) 2024-09-26
KR102707853B1 (ko) 2024-09-23
MY206652A (en) 2024-12-30
KR20240091037A (ko) 2024-06-21
US12399215B2 (en) 2025-08-26
CN118355479A (zh) 2024-07-16
WO2023100463A1 (ja) 2023-06-08

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