CN118140195A - 电子设备 - Google Patents

电子设备 Download PDF

Info

Publication number
CN118140195A
CN118140195A CN202280071302.0A CN202280071302A CN118140195A CN 118140195 A CN118140195 A CN 118140195A CN 202280071302 A CN202280071302 A CN 202280071302A CN 118140195 A CN118140195 A CN 118140195A
Authority
CN
China
Prior art keywords
electronic device
recess
communication module
module
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280071302.0A
Other languages
English (en)
Chinese (zh)
Inventor
鸟居宗弘
间木纪行
三上升悟
薄衣佑太郎
飞松辰哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN118140195A publication Critical patent/CN118140195A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202280071302.0A 2021-10-27 2022-10-03 电子设备 Pending CN118140195A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021175720 2021-10-27
JP2021-175720 2021-10-27
PCT/JP2022/036888 WO2023074261A1 (ja) 2021-10-27 2022-10-03 電子機器

Publications (1)

Publication Number Publication Date
CN118140195A true CN118140195A (zh) 2024-06-04

Family

ID=86157822

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280071302.0A Pending CN118140195A (zh) 2021-10-27 2022-10-03 电子设备

Country Status (4)

Country Link
US (1) US20240260236A1 (https=)
JP (1) JPWO2023074261A1 (https=)
CN (1) CN118140195A (https=)
WO (1) WO2023074261A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065385A (ja) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp 基板ケース構造体
JP2001125683A (ja) * 1999-10-28 2001-05-11 Inoac Corp 情報機器用ハウジング
DE60139533D1 (de) * 2000-08-01 2009-09-24 Mitsubishi Electric Corp Elektronisches Gerät mit einem Substrat für die Schaltung
JP4400001B2 (ja) * 2001-04-04 2010-01-20 株式会社デンソー 電子制御装置
JP2004214401A (ja) * 2002-12-27 2004-07-29 Matsushita Electric Ind Co Ltd 電子部品の放熱装置
JP2007124079A (ja) * 2005-10-26 2007-05-17 Matsushita Electric Ind Co Ltd 携帯電話装置
TW201118543A (en) * 2009-11-26 2011-06-01 Hon Hai Prec Ind Co Ltd Electronic device and heat dissipation module thereof
DE102009054517B4 (de) * 2009-12-10 2011-12-29 Robert Bosch Gmbh Elektronisches Steuergerät
JP2011176096A (ja) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd 電子機器
JP5842118B2 (ja) * 2010-06-24 2016-01-13 パナソニックＩｐマネジメント株式会社 赤外線センサ
JP5609680B2 (ja) * 2010-08-27 2014-10-22 ソニー株式会社 放熱構造及び電子機器
WO2014155685A1 (ja) * 2013-03-29 2014-10-02 株式会社 東芝 表示装置および電子機器
JP6523207B2 (ja) * 2016-04-27 2019-05-29 株式会社コンテック ヒートシンクおよび筐体
JP6574024B1 (ja) * 2018-06-07 2019-09-11 レノボ・シンガポール・プライベート・リミテッド 電子機器
JP6934093B1 (ja) * 2020-07-13 2021-09-08 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

Also Published As

Publication number Publication date
US20240260236A1 (en) 2024-08-01
WO2023074261A1 (ja) 2023-05-04
JPWO2023074261A1 (https=) 2023-05-04

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