JPWO2023074261A1 - - Google Patents
Info
- Publication number
- JPWO2023074261A1 JPWO2023074261A1 JP2023556238A JP2023556238A JPWO2023074261A1 JP WO2023074261 A1 JPWO2023074261 A1 JP WO2023074261A1 JP 2023556238 A JP2023556238 A JP 2023556238A JP 2023556238 A JP2023556238 A JP 2023556238A JP WO2023074261 A1 JPWO2023074261 A1 JP WO2023074261A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021175720 | 2021-10-27 | ||
| PCT/JP2022/036888 WO2023074261A1 (ja) | 2021-10-27 | 2022-10-03 | 電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023074261A1 true JPWO2023074261A1 (https=) | 2023-05-04 |
| JPWO2023074261A5 JPWO2023074261A5 (https=) | 2024-07-17 |
Family
ID=86157822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023556238A Pending JPWO2023074261A1 (https=) | 2021-10-27 | 2022-10-03 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240260236A1 (https=) |
| JP (1) | JPWO2023074261A1 (https=) |
| CN (1) | CN118140195A (https=) |
| WO (1) | WO2023074261A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1065385A (ja) * | 1996-08-21 | 1998-03-06 | Mitsubishi Electric Corp | 基板ケース構造体 |
| JP2007124079A (ja) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Ind Co Ltd | 携帯電話装置 |
| WO2014155685A1 (ja) * | 2013-03-29 | 2014-10-02 | 株式会社 東芝 | 表示装置および電子機器 |
| JP2019212832A (ja) * | 2018-06-07 | 2019-12-12 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
| JP6934093B1 (ja) * | 2020-07-13 | 2021-09-08 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001125683A (ja) * | 1999-10-28 | 2001-05-11 | Inoac Corp | 情報機器用ハウジング |
| DE60139533D1 (de) * | 2000-08-01 | 2009-09-24 | Mitsubishi Electric Corp | Elektronisches Gerät mit einem Substrat für die Schaltung |
| JP4400001B2 (ja) * | 2001-04-04 | 2010-01-20 | 株式会社デンソー | 電子制御装置 |
| JP2004214401A (ja) * | 2002-12-27 | 2004-07-29 | Matsushita Electric Ind Co Ltd | 電子部品の放熱装置 |
| TW201118543A (en) * | 2009-11-26 | 2011-06-01 | Hon Hai Prec Ind Co Ltd | Electronic device and heat dissipation module thereof |
| DE102009054517B4 (de) * | 2009-12-10 | 2011-12-29 | Robert Bosch Gmbh | Elektronisches Steuergerät |
| JP2011176096A (ja) * | 2010-02-24 | 2011-09-08 | Mitsumi Electric Co Ltd | 電子機器 |
| JP5842118B2 (ja) * | 2010-06-24 | 2016-01-13 | パナソニックIpマネジメント株式会社 | 赤外線センサ |
| JP5609680B2 (ja) * | 2010-08-27 | 2014-10-22 | ソニー株式会社 | 放熱構造及び電子機器 |
| JP6523207B2 (ja) * | 2016-04-27 | 2019-05-29 | 株式会社コンテック | ヒートシンクおよび筐体 |
-
2022
- 2022-10-03 WO PCT/JP2022/036888 patent/WO2023074261A1/ja not_active Ceased
- 2022-10-03 JP JP2023556238A patent/JPWO2023074261A1/ja active Pending
- 2022-10-03 CN CN202280071302.0A patent/CN118140195A/zh active Pending
-
2024
- 2024-04-08 US US18/629,721 patent/US20240260236A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1065385A (ja) * | 1996-08-21 | 1998-03-06 | Mitsubishi Electric Corp | 基板ケース構造体 |
| JP2007124079A (ja) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Ind Co Ltd | 携帯電話装置 |
| WO2014155685A1 (ja) * | 2013-03-29 | 2014-10-02 | 株式会社 東芝 | 表示装置および電子機器 |
| JP2019212832A (ja) * | 2018-06-07 | 2019-12-12 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
| JP6934093B1 (ja) * | 2020-07-13 | 2021-09-08 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240260236A1 (en) | 2024-08-01 |
| WO2023074261A1 (ja) | 2023-05-04 |
| CN118140195A (zh) | 2024-06-04 |
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