JPWO2023074261A1 - - Google Patents

Info

Publication number
JPWO2023074261A1
JPWO2023074261A1 JP2023556238A JP2023556238A JPWO2023074261A1 JP WO2023074261 A1 JPWO2023074261 A1 JP WO2023074261A1 JP 2023556238 A JP2023556238 A JP 2023556238A JP 2023556238 A JP2023556238 A JP 2023556238A JP WO2023074261 A1 JPWO2023074261 A1 JP WO2023074261A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023556238A
Other languages
Japanese (ja)
Other versions
JPWO2023074261A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023074261A1 publication Critical patent/JPWO2023074261A1/ja
Publication of JPWO2023074261A5 publication Critical patent/JPWO2023074261A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472Sheet interfaces
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/03Covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2023556238A 2021-10-27 2022-10-03 Pending JPWO2023074261A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021175720 2021-10-27
PCT/JP2022/036888 WO2023074261A1 (ja) 2021-10-27 2022-10-03 電子機器

Publications (2)

Publication Number Publication Date
JPWO2023074261A1 true JPWO2023074261A1 (https=) 2023-05-04
JPWO2023074261A5 JPWO2023074261A5 (https=) 2024-07-17

Family

ID=86157822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556238A Pending JPWO2023074261A1 (https=) 2021-10-27 2022-10-03

Country Status (4)

Country Link
US (1) US20240260236A1 (https=)
JP (1) JPWO2023074261A1 (https=)
CN (1) CN118140195A (https=)
WO (1) WO2023074261A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065385A (ja) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp 基板ケース構造体
JP2007124079A (ja) * 2005-10-26 2007-05-17 Matsushita Electric Ind Co Ltd 携帯電話装置
WO2014155685A1 (ja) * 2013-03-29 2014-10-02 株式会社 東芝 表示装置および電子機器
JP2019212832A (ja) * 2018-06-07 2019-12-12 レノボ・シンガポール・プライベート・リミテッド 電子機器
JP6934093B1 (ja) * 2020-07-13 2021-09-08 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001125683A (ja) * 1999-10-28 2001-05-11 Inoac Corp 情報機器用ハウジング
DE60139533D1 (de) * 2000-08-01 2009-09-24 Mitsubishi Electric Corp Elektronisches Gerät mit einem Substrat für die Schaltung
JP4400001B2 (ja) * 2001-04-04 2010-01-20 株式会社デンソー 電子制御装置
JP2004214401A (ja) * 2002-12-27 2004-07-29 Matsushita Electric Ind Co Ltd 電子部品の放熱装置
TW201118543A (en) * 2009-11-26 2011-06-01 Hon Hai Prec Ind Co Ltd Electronic device and heat dissipation module thereof
DE102009054517B4 (de) * 2009-12-10 2011-12-29 Robert Bosch Gmbh Elektronisches Steuergerät
JP2011176096A (ja) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd 電子機器
JP5842118B2 (ja) * 2010-06-24 2016-01-13 パナソニックIpマネジメント株式会社 赤外線センサ
JP5609680B2 (ja) * 2010-08-27 2014-10-22 ソニー株式会社 放熱構造及び電子機器
JP6523207B2 (ja) * 2016-04-27 2019-05-29 株式会社コンテック ヒートシンクおよび筐体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065385A (ja) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp 基板ケース構造体
JP2007124079A (ja) * 2005-10-26 2007-05-17 Matsushita Electric Ind Co Ltd 携帯電話装置
WO2014155685A1 (ja) * 2013-03-29 2014-10-02 株式会社 東芝 表示装置および電子機器
JP2019212832A (ja) * 2018-06-07 2019-12-12 レノボ・シンガポール・プライベート・リミテッド 電子機器
JP6934093B1 (ja) * 2020-07-13 2021-09-08 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

Also Published As

Publication number Publication date
US20240260236A1 (en) 2024-08-01
WO2023074261A1 (ja) 2023-05-04
CN118140195A (zh) 2024-06-04

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