JPWO2023074261A5 - - Google Patents

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Publication number
JPWO2023074261A5
JPWO2023074261A5 JP2023556238A JP2023556238A JPWO2023074261A5 JP WO2023074261 A5 JPWO2023074261 A5 JP WO2023074261A5 JP 2023556238 A JP2023556238 A JP 2023556238A JP 2023556238 A JP2023556238 A JP 2023556238A JP WO2023074261 A5 JPWO2023074261 A5 JP WO2023074261A5
Authority
JP
Japan
Prior art keywords
recess
heat dissipation
dissipation material
electronic device
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023556238A
Other languages
English (en)
Japanese (ja)
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JPWO2023074261A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/036888 external-priority patent/WO2023074261A1/ja
Publication of JPWO2023074261A1 publication Critical patent/JPWO2023074261A1/ja
Publication of JPWO2023074261A5 publication Critical patent/JPWO2023074261A5/ja
Pending legal-status Critical Current

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JP2023556238A 2021-10-27 2022-10-03 Pending JPWO2023074261A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021175720 2021-10-27
PCT/JP2022/036888 WO2023074261A1 (ja) 2021-10-27 2022-10-03 電子機器

Publications (2)

Publication Number Publication Date
JPWO2023074261A1 JPWO2023074261A1 (https=) 2023-05-04
JPWO2023074261A5 true JPWO2023074261A5 (https=) 2024-07-17

Family

ID=86157822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556238A Pending JPWO2023074261A1 (https=) 2021-10-27 2022-10-03

Country Status (4)

Country Link
US (1) US20240260236A1 (https=)
JP (1) JPWO2023074261A1 (https=)
CN (1) CN118140195A (https=)
WO (1) WO2023074261A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065385A (ja) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp 基板ケース構造体
JP2001125683A (ja) * 1999-10-28 2001-05-11 Inoac Corp 情報機器用ハウジング
DE60139533D1 (de) * 2000-08-01 2009-09-24 Mitsubishi Electric Corp Elektronisches Gerät mit einem Substrat für die Schaltung
JP4400001B2 (ja) * 2001-04-04 2010-01-20 株式会社デンソー 電子制御装置
JP2004214401A (ja) * 2002-12-27 2004-07-29 Matsushita Electric Ind Co Ltd 電子部品の放熱装置
JP2007124079A (ja) * 2005-10-26 2007-05-17 Matsushita Electric Ind Co Ltd 携帯電話装置
TW201118543A (en) * 2009-11-26 2011-06-01 Hon Hai Prec Ind Co Ltd Electronic device and heat dissipation module thereof
DE102009054517B4 (de) * 2009-12-10 2011-12-29 Robert Bosch Gmbh Elektronisches Steuergerät
JP2011176096A (ja) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd 電子機器
JP5842118B2 (ja) * 2010-06-24 2016-01-13 パナソニックＩｐマネジメント株式会社 赤外線センサ
JP5609680B2 (ja) * 2010-08-27 2014-10-22 ソニー株式会社 放熱構造及び電子機器
WO2014155685A1 (ja) * 2013-03-29 2014-10-02 株式会社 東芝 表示装置および電子機器
JP6523207B2 (ja) * 2016-04-27 2019-05-29 株式会社コンテック ヒートシンクおよび筐体
JP6574024B1 (ja) * 2018-06-07 2019-09-11 レノボ・シンガポール・プライベート・リミテッド 電子機器
JP6934093B1 (ja) * 2020-07-13 2021-09-08 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

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