CN1179618C - 用于电子插盒的盖 - Google Patents

用于电子插盒的盖 Download PDF

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Publication number
CN1179618C
CN1179618C CNB998131318A CN99813131A CN1179618C CN 1179618 C CN1179618 C CN 1179618C CN B998131318 A CNB998131318 A CN B998131318A CN 99813131 A CN99813131 A CN 99813131A CN 1179618 C CN1179618 C CN 1179618C
Authority
CN
China
Prior art keywords
base
force
cover
pin
thermal element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998131318A
Other languages
English (en)
Chinese (zh)
Other versions
CN1325611A (zh
Inventor
T
T·王
M·克罗克尔
���˹���Ѷ���
P·戴维逊
M·麦格雷戈尔
ƶ��׿�
J·贝尼菲尔德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of CN1325611A publication Critical patent/CN1325611A/zh
Application granted granted Critical
Publication of CN1179618C publication Critical patent/CN1179618C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
    • H05K5/15—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by resilient members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
    • H05K7/1431—Retention mechanisms for CPU modules

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
CNB998131318A 1998-11-11 1999-11-05 用于电子插盒的盖 Expired - Fee Related CN1179618C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/189,905 US6028771A (en) 1998-11-11 1998-11-11 Cover for an electronic cartridge
US09/189,905 1998-11-11
US09/189905 1998-11-11

Publications (2)

Publication Number Publication Date
CN1325611A CN1325611A (zh) 2001-12-05
CN1179618C true CN1179618C (zh) 2004-12-08

Family

ID=22699253

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998131318A Expired - Fee Related CN1179618C (zh) 1998-11-11 1999-11-05 用于电子插盒的盖

Country Status (8)

Country Link
US (1) US6028771A (enExample)
JP (1) JP2002529941A (enExample)
KR (1) KR100402399B1 (enExample)
CN (1) CN1179618C (enExample)
AU (1) AU1344600A (enExample)
MX (1) MXPA01004112A (enExample)
MY (1) MY117199A (enExample)
WO (1) WO2000028801A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102338142A (zh) * 2010-07-16 2012-02-01 深圳富泰宏精密工业有限公司 卡合结构及应用该卡合结构的电子装置

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046905A (en) 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US6585534B2 (en) * 1998-08-20 2003-07-01 Intel Corporation Retention mechanism for an electrical assembly
TW428882U (en) * 1999-04-16 2001-04-01 Hon Hai Prec Ind Co Ltd Fixing device of the computer board
US6888722B2 (en) * 1999-12-30 2005-05-03 Intel Corporation Thermal design for minimizing interface in a multi-site thermal contact condition
DE10032369C2 (de) * 2000-07-04 2002-05-16 Infineon Technologies Ag Abdeckvorrichtung für Keramikmodule
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US7453706B2 (en) * 2003-11-13 2008-11-18 Adc Telecommunications, Inc. Module with interchangeable card
EP1977376A1 (de) * 2006-01-27 2008-10-08 Pos Tuning, Udo Vosshenrich GmbH & Co. KG Kommunikationssystem für verkaufsräume
KR20100030126A (ko) * 2008-09-09 2010-03-18 삼성전자주식회사 메모리 장치 및 그를 포함하는 전자 장치
USD794644S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794642S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794641S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795261S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD794643S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795262S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD794034S1 (en) * 2009-01-07 2017-08-08 Samsung Electronics Co., Ltd. Memory device
KR20130027304A (ko) * 2011-09-07 2013-03-15 삼성전자주식회사 컨트롤 패널 어셈블리 및 이를 구비한 세탁물 처리 장치
WO2013081585A1 (en) * 2011-11-29 2013-06-06 Intel Corporation Expansion card having synergistic cooling, structural and volume reduction solutions
US8971038B2 (en) * 2012-05-22 2015-03-03 Lear Corporation Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)
JP6613130B2 (ja) * 2015-12-22 2019-11-27 モレックス エルエルシー カード保持部材及びカード用コネクタセット
CN108966579A (zh) * 2018-08-22 2018-12-07 芜湖飞龙汽车电子技术研究院有限公司 一种电子水泵控制板固定用壳体装置
CN110708914B (zh) * 2019-08-30 2021-06-01 华为技术有限公司 卡扣组件、板卡以及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631299A (en) * 1970-05-21 1971-12-28 Square D Co Printed circuit board module and support with circuit board supporting posts
JPS5818299Y2 (ja) * 1978-04-28 1983-04-13 富士通株式会社 プリント基板ユニット内蔵型電子機器
JPS5996874U (ja) * 1982-12-21 1984-06-30 オムロン株式会社 電子機器の組立構造
US5838542A (en) * 1996-09-30 1998-11-17 Intel Corporation Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage
US5856910A (en) * 1996-10-30 1999-01-05 Intel Corporation Processor card assembly having a cover with flexible locking latches
US5894408A (en) * 1998-02-17 1999-04-13 Intel Corporation Electronic cartridge which allows differential thermal expansion between components of the cartridge

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102338142A (zh) * 2010-07-16 2012-02-01 深圳富泰宏精密工业有限公司 卡合结构及应用该卡合结构的电子装置

Also Published As

Publication number Publication date
KR100402399B1 (ko) 2003-10-22
US6028771A (en) 2000-02-22
MY117199A (en) 2004-05-31
JP2002529941A (ja) 2002-09-10
CN1325611A (zh) 2001-12-05
WO2000028801A1 (en) 2000-05-18
MXPA01004112A (es) 2002-04-24
KR20010089438A (ko) 2001-10-06
AU1344600A (en) 2000-05-29

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Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
PB01 Publication
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20041208

Termination date: 20101105