MY117199A - A cover for an electronic cartridge - Google Patents

A cover for an electronic cartridge

Info

Publication number
MY117199A
MY117199A MYPI99004375A MYPI9904375A MY117199A MY 117199 A MY117199 A MY 117199A MY PI99004375 A MYPI99004375 A MY PI99004375A MY PI9904375 A MYPI9904375 A MY PI9904375A MY 117199 A MY117199 A MY 117199A
Authority
MY
Malaysia
Prior art keywords
cover
substrate
pin
snap
electronic cartridge
Prior art date
Application number
MYPI99004375A
Other languages
English (en)
Inventor
Thomas Wong
Michael Crocker
Peter Davison
Mike Macgregor
Joe Benefield
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of MY117199A publication Critical patent/MY117199A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/10Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
    • H05K5/15Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by resilient members
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1429Housings for circuits carrying a CPU and adapted to receive expansion cards
    • H05K7/1431Retention mechanisms for CPU modules

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
MYPI99004375A 1998-11-11 1999-10-09 A cover for an electronic cartridge MY117199A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/189,905 US6028771A (en) 1998-11-11 1998-11-11 Cover for an electronic cartridge

Publications (1)

Publication Number Publication Date
MY117199A true MY117199A (en) 2004-05-31

Family

ID=22699253

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99004375A MY117199A (en) 1998-11-11 1999-10-09 A cover for an electronic cartridge

Country Status (8)

Country Link
US (1) US6028771A (enExample)
JP (1) JP2002529941A (enExample)
KR (1) KR100402399B1 (enExample)
CN (1) CN1179618C (enExample)
AU (1) AU1344600A (enExample)
MX (1) MXPA01004112A (enExample)
MY (1) MY117199A (enExample)
WO (1) WO2000028801A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6046905A (en) 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US6585534B2 (en) * 1998-08-20 2003-07-01 Intel Corporation Retention mechanism for an electrical assembly
TW428882U (en) * 1999-04-16 2001-04-01 Hon Hai Prec Ind Co Ltd Fixing device of the computer board
US6888722B2 (en) * 1999-12-30 2005-05-03 Intel Corporation Thermal design for minimizing interface in a multi-site thermal contact condition
DE10032369C2 (de) * 2000-07-04 2002-05-16 Infineon Technologies Ag Abdeckvorrichtung für Keramikmodule
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US7453706B2 (en) * 2003-11-13 2008-11-18 Adc Telecommunications, Inc. Module with interchangeable card
WO2007085211A1 (de) * 2006-01-27 2007-08-02 Pos Tuning Udo Vosshenrich Gmbh & Co.Kg Kommunikationssystem für verkaufsräume
KR20100030126A (ko) 2008-09-09 2010-03-18 삼성전자주식회사 메모리 장치 및 그를 포함하는 전자 장치
USD794643S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794644S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795261S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD794034S1 (en) * 2009-01-07 2017-08-08 Samsung Electronics Co., Ltd. Memory device
USD794642S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794641S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795262S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
CN102338142A (zh) * 2010-07-16 2012-02-01 深圳富泰宏精密工业有限公司 卡合结构及应用该卡合结构的电子装置
KR20130027304A (ko) * 2011-09-07 2013-03-15 삼성전자주식회사 컨트롤 패널 어셈블리 및 이를 구비한 세탁물 처리 장치
US9606589B2 (en) * 2011-11-29 2017-03-28 Intel Corporation Expansion card having synergistic cooling, structural and volume reduction solutions
US8971038B2 (en) * 2012-05-22 2015-03-03 Lear Corporation Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)
JP6613130B2 (ja) * 2015-12-22 2019-11-27 モレックス エルエルシー カード保持部材及びカード用コネクタセット
CN108966579A (zh) * 2018-08-22 2018-12-07 芜湖飞龙汽车电子技术研究院有限公司 一种电子水泵控制板固定用壳体装置
CN110708914B (zh) * 2019-08-30 2021-06-01 华为技术有限公司 卡扣组件、板卡以及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631299A (en) * 1970-05-21 1971-12-28 Square D Co Printed circuit board module and support with circuit board supporting posts
JPS5818299Y2 (ja) * 1978-04-28 1983-04-13 富士通株式会社 プリント基板ユニット内蔵型電子機器
JPS5996874U (ja) * 1982-12-21 1984-06-30 オムロン株式会社 電子機器の組立構造
US5838542A (en) * 1996-09-30 1998-11-17 Intel Corporation Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage
US5856910A (en) * 1996-10-30 1999-01-05 Intel Corporation Processor card assembly having a cover with flexible locking latches
US5894408A (en) * 1998-02-17 1999-04-13 Intel Corporation Electronic cartridge which allows differential thermal expansion between components of the cartridge

Also Published As

Publication number Publication date
CN1179618C (zh) 2004-12-08
AU1344600A (en) 2000-05-29
JP2002529941A (ja) 2002-09-10
KR100402399B1 (ko) 2003-10-22
MXPA01004112A (es) 2002-04-24
KR20010089438A (ko) 2001-10-06
WO2000028801A1 (en) 2000-05-18
US6028771A (en) 2000-02-22
CN1325611A (zh) 2001-12-05

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