CN117581344A - 元件拾取装置、元件安装装置 - Google Patents
元件拾取装置、元件安装装置 Download PDFInfo
- Publication number
- CN117581344A CN117581344A CN202180098046.XA CN202180098046A CN117581344A CN 117581344 A CN117581344 A CN 117581344A CN 202180098046 A CN202180098046 A CN 202180098046A CN 117581344 A CN117581344 A CN 117581344A
- Authority
- CN
- China
- Prior art keywords
- ejector
- support ring
- component
- tray
- control unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000003860 storage Methods 0.000 description 29
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 101000860173 Myxococcus xanthus C-factor Proteins 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/021405 WO2022254703A1 (ja) | 2021-06-04 | 2021-06-04 | 部品ピックアップ装置、部品実装装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117581344A true CN117581344A (zh) | 2024-02-20 |
Family
ID=84322990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180098046.XA Pending CN117581344A (zh) | 2021-06-04 | 2021-06-04 | 元件拾取装置、元件安装装置 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2022254703A1 (de) |
| KR (1) | KR20230156402A (de) |
| CN (1) | CN117581344A (de) |
| DE (1) | DE112021007233T5 (de) |
| TW (1) | TWI793882B (de) |
| WO (1) | WO2022254703A1 (de) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3885446B2 (ja) * | 2000-02-17 | 2007-02-21 | 松下電器産業株式会社 | 半導体チップのピックアップ方法 |
| JP2005251986A (ja) * | 2004-03-04 | 2005-09-15 | Disco Abrasive Syst Ltd | ウエーハの分離検出方法および分離検出装置 |
| JP5730537B2 (ja) | 2010-11-03 | 2015-06-10 | 富士機械製造株式会社 | ダイ供給システム |
| JP5885230B2 (ja) * | 2011-04-05 | 2016-03-15 | 富士機械製造株式会社 | ダイ位置判定システム。 |
| JP5936847B2 (ja) * | 2011-11-18 | 2016-06-22 | 富士機械製造株式会社 | ウエハ関連データ管理方法及びウエハ関連データ作成装置 |
| JP6101361B2 (ja) * | 2013-10-21 | 2017-03-22 | 富士機械製造株式会社 | ピックアップ装置および突き上げポット |
-
2021
- 2021-06-04 CN CN202180098046.XA patent/CN117581344A/zh active Pending
- 2021-06-04 DE DE112021007233.1T patent/DE112021007233T5/de active Pending
- 2021-06-04 KR KR1020237035021A patent/KR20230156402A/ko unknown
- 2021-06-04 JP JP2023525321A patent/JPWO2022254703A1/ja active Pending
- 2021-06-04 WO PCT/JP2021/021405 patent/WO2022254703A1/ja active Application Filing
- 2021-11-29 TW TW110144365A patent/TWI793882B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202249586A (zh) | 2022-12-16 |
| TWI793882B (zh) | 2023-02-21 |
| DE112021007233T5 (de) | 2024-01-11 |
| KR20230156402A (ko) | 2023-11-14 |
| JPWO2022254703A1 (de) | 2022-12-08 |
| WO2022254703A1 (ja) | 2022-12-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |