CN107731723B - 裸芯顶出装置 - Google Patents

裸芯顶出装置 Download PDF

Info

Publication number
CN107731723B
CN107731723B CN201710680374.6A CN201710680374A CN107731723B CN 107731723 B CN107731723 B CN 107731723B CN 201710680374 A CN201710680374 A CN 201710680374A CN 107731723 B CN107731723 B CN 107731723B
Authority
CN
China
Prior art keywords
cover
die
holes
ejection apparatus
die ejection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710680374.6A
Other languages
English (en)
Other versions
CN107731723A (zh
Inventor
李喜澈
崔一洛
李在卿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of CN107731723A publication Critical patent/CN107731723A/zh
Application granted granted Critical
Publication of CN107731723B publication Critical patent/CN107731723B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Abstract

一种裸芯顶出装置包括柱形罩壳、可转动地安装在罩壳上部且具有多个通孔的盘形盖、插入通孔的一部分中且用来从切割带中分离裸芯的顶针以及垂直移动顶针以从切割带上分离裸芯的驱动部。尤其地，通孔设置成多行多列，且通孔的中心与盖的中心分开预定的距离。

Description

裸芯顶出装置
技术背景
本发明涉及裸芯顶出装置。更具体地说，本发明涉及用于在裸芯接合工艺中将裸芯从加框晶圆的切割带中分开的一种裸芯顶出装置，其中，该裸芯被粘接到诸如引线框架和印刷电路板之类的基底上。
通常，半导体器件可由硅晶圆作为半导体基底通过重复执行一系列制备工艺而形成的。通过如上所述的方式形成的半导体器件可通过切割工艺切割且可通过裸芯粘合工艺粘合至基底。
用于执行裸芯粘合工艺的装置可包括拾取模块和粘合模块，拾取模块用于从包括通过切割工艺分成一个个的裸芯的加框晶圆中拾取裸芯，且粘合模块用于将裸芯粘合至诸如引线框架或印刷电路板的基底上。拾取模块包括用于支撑加框晶圆的载台单元、用于从加框晶圆的切割带上分离裸芯的裸芯顶出单元和用于从切割带中拾取裸芯的拾取单元。
裸芯顶出装置可包括具有圆柱帽型的罩、与罩耦接的柱形体和设置在穿过罩中形成的通孔的垂直方向的可移动顶针。罩的通孔可设置成多行多列，且顶针可插入与待拾取的裸芯大小相对应的通孔的一部分中。此外，支撑元件可设置在罩中以支撑顶针。
具体地，裸芯的大小和形状可根据半导体器件的种类进行各种改变，且顶针可插入与待拾取的裸芯大小相对应的通孔的一部分中。近年来，随着裸芯厚度的逐渐变薄，通孔的间距被减小，以使用更多的顶针来防止在裸芯顶出步骤中损坏裸芯。但是，减小通孔的间距存在一个机械限制，且因此积极应对裸芯的大小和形状具有一定难度。
发明内容
本发明提供一种可更有效地设置用于从切割带中顶出裸芯的顶针的裸芯顶出装置。
根据本发明的一些示范实施例，裸芯顶出装置可包括柱形罩壳、盘形盖、顶针和驱动部，其中盘状盖可转动地安装在罩壳上部且具有多个通孔，顶针插入通孔的一部分中且用于从切割带中分离裸芯，且驱动部垂直移动顶针以从切割带中分离裸芯。尤其地，通孔可设置成多行多列，且通孔的中心可与盖的中心分开预定的距离。
根据本发明的一些示范实施例，通孔可具有在X轴方向和Y轴方向具有相同的间距，且通孔的中心可在X轴和Y轴方向上分别与盖的中心分离0.2-0.3倍的间距。
根据本发明的一些示范实施例，多个球头柱塞可以均匀的间隔安装在盖的外周表面上，盖所插入的台阶部可设置在罩壳的上部，且球头柱塞的球头所插入的凹陷可设置在台阶部的内表面。
根据本发明的一些示范实施例，槽可设置在台阶部的内表面以在盖转动时引导球头柱塞的球头。
根据本发明的一些示范实施例，四个球头柱塞可安装在盖的外周表面上，且四个凹陷可设置在台阶部的内表面上。
根据本发明的某些示范实施例，用于转动盖的工具所插入的第二凹陷可设置在盖的上表面的边缘部。
根据本发明的一些示范实施例，裸芯顶出装置还可包括设置在罩壳中以支撑顶针的支撑元件和与罩壳的下部耦接的柱形体。
根据本发明的一些示范实施例，驱动部可包括与支撑元件耦接的头和与头连接且向下延伸穿过主体的驱动轴。
根据本发明的一些示范实施例，永磁体可设置在支撑元件中以保持顶针和与头耦接。
根据本发明的一些示范实施例，挡块可安装在罩壳的内表面上以防止支撑元件与罩壳脱离。
根据本发明的一些示范实施例，通孔的设置可根据盖的转动进行改变，且因此顶针的设置可以多样化配置。因此，顶针可更有效地设置，以使得可应对具有各种大小和形状的裸芯。
以上关于本发明的概述不意在描述本发明的每一所示实施例或每一实施方式。以下详细说明和权利要求更具体地诠释了这些实施例。
附图说明
从以下参照附图的说明可更详细地理解示范实施例，其中：
图1是显示包含根据本发明示范实施例的裸芯顶出装置的裸芯接合装置的示意图；
图2是显示图1中所示的裸芯顶出装置的截面图；
图3是显示图2中所示的罩的放大截面图；
图4是显示图2中所示的罩的放大平面图；
图5-7是显示图2中所示的盖的转动的放大平面图；
尽管各实施例可修改成各种修改和替换形式，其特定细节已通过附图中的示例予以展示并将予以详细说明。但是应理解，其意图不在于将所主张的发明限定在所述的特定实施例。相反，其意图在于涵盖落入权利要求所限定的主题的实质和范围内的所有修改、等值和替代。
具体实施例
以下，将参照附图对本发明的实施例予以说明。但是，本发明不限于以下所述的实施例且可以各种其他形式实施。以下实施例的提供并非用于完整地完成本发明而是用于将本发明的范围完整地传达给本领域的技术人员。
在说明书中，当一个元件被称为在另一元件或层之上或连接至另一元件或层，其可直接位于另一元件或层之上或连接至另一元件或层，或还可存在中间元件或层。与此不同，应理解当一元件被称为直接位于另一元件或层之上或直接连接至另一元件或层，其意思是不存在中间元件。同样，尽管如第一、第二和第三之类的术语被用于描述本发明各实施例的各区或层，该区或层不限于所述术语。
以下所用的术语仅用于描述特定实施例，但不限制本发明。此外，除非本文另有定义，包括技术或科学术语在内的所有术语可具有与本领域技术人员通常理解的含义相同的含义。
本发明的实施例参照理想实施例的示意图予以说明。相应地，从附图的形式中可预期制备方法的修改和/或允许的误差。相应地，本发明的实施例的描述不限于附图中的特定形式和区域，且包括所述形式的偏差。该区域可以完全是示意性的，且其形式可不描述或刻画任何指定区域的精确形式或结构，且不意图限制本发明的范围。
图1是显示根据本发明示范实施例的包含裸芯顶出装置的裸芯接合装置的示意图，且图2是显示图1中所示的裸芯顶出装置的截面图。
参照图1和2，根据本发明一示范实施例的裸芯顶出装置100可用于在制备半导体器件的裸芯接合工艺中从切割带14上拾起半导体裸芯12。
用于进行裸芯接合工艺的装置可包括载台单元20、裸芯顶出装置100、拾取器30和拾取器驱动部40，其中载台单元20用于支撑晶圆10，晶圆10包括由切割工艺被分成一个个的多个裸芯12；裸芯顶出装置100用于选择性地将裸芯12与晶圆10分离，拾取器30用于将由裸芯顶出装置100分离的裸芯12拾起，且拾取器驱动部40用于移动拾取器30。
晶圆10可附装在切割带14上，且切割带14可安装至圆环形的安装框16上。载台单元20可包括晶圆载台22、扩张环24和夹钳26，其中晶圆载台22配置成可在水平方向上移动，扩张环24设置在晶圆载台22上用于支撑切割带14的边缘部，且夹钳26用于通过降低安装框16来扩张切割带14。
拾取器30可设置在由载台单元20支撑的晶圆10上方且可安装至拾取器驱动部40。拾取器驱动部40可在水平和垂直方向上移动拾取器30以拾起由裸芯顶出装置100从切割带14中分离出的裸芯12。
另外，用于检测裸芯12的位置的视觉单元50可设置在载台单元20所支撑的晶圆10的上方。视觉单元50可获得待拾取的裸芯12的图像并可从图像中检测裸芯12的位置坐标。
裸芯顶出装置100可设置在载台单元20下。例如，裸芯顶出装置100可设置成在垂直方向上面向视觉单元50，且载台单元20可配置成可由位于裸芯顶出装置100和视觉单元50之间的载台驱动单元(未示出)在水平方向上移动。
参照图2，裸芯顶出装置100可包括用于将裸芯12从切割带14中分离的顶针102和具有供顶针插入的通孔122的罩110。
罩110可包括柱形罩壳112和可转动地安装在罩壳112的上部的盘形盖120。通孔122可形成以在垂直方向上穿透盖120且可设置成多行多列。
图3是显示图2中所示的罩的放大截面图，图4是显示图2中所示的罩的放大平面图，且图5-7是显示图2中所示的盖的转动的放大平面图。
参照图2-7，盖120可以可转动的方式安装在罩壳112的上部。例如，供盖120插入的台阶部114可设置在罩壳112的上部。
根据本发明一示范实施例，通孔122的中心C2可与盖120的中心C1分开预定的距离。例如，通孔122可在X轴方向和Y轴方向具有相同的间距，且通孔122的中心C2可在X轴和Y轴方向上分别与盖120的中心C1分开0.2-0.3倍的间距。
此外，多个球头柱塞124可以均匀的间隔安装在盖120的外周表面上，且供球头柱塞124的球头插入的凹陷116可设置在台阶部114的内表面上。
例如，四个球头柱塞124可以均匀的间隔安装在盖120的外周表面上，且四个凹陷116可设置在台阶部114的内表面上以对应四个球头柱塞124。因此，盖120可通过凹陷116转动90度。尤其地，因为通孔122的中心C2与盖120的中心C1分离，通孔122的设置可通过盖120的转动改变。
例如，图4显示盖120未转动下的初始状态，也就是说，盖120的转动角度为0度，且图5、6和7显示盖120的转动角度分别为90度、180度和270度的情况。如图所示，通孔122的设置可通过盖120的转动角度改变。因此，裸芯顶出装置100的使用可通过根据裸芯12的大小和形状改变通孔122的设置得以极大地改善。
也就是说，顶针102的设置可通过改变通孔122的设置而变得更高效，且因此可积极地应对各种类型的裸芯12。
再次参照图3，槽118可设置在台阶部114的内表面上，以在盖120转动时从周向上引导球头柱塞124。此外，供盖120的转动工具(未示出)插入的第二凹陷126可设置在盖120的上表面的边缘部，如图4所示。
再次参照图2，裸芯顶出装置100可包括驱动部130，驱动部130垂直移动顶针102以将裸芯12从切割带14上分离。
此外，用于支撑顶针102的支撑元件140可设置在罩壳112中，且柱形体150可耦接至罩壳112的下部。
驱动部130可包括耦接至支撑元件140的头132和连接至头132且向下延伸穿过主体150的驱动轴134。例如，永磁体142可设置在支撑元件140中以保持顶针102并耦接至头132。此外，挡块144可安装在罩壳112的内表面上以防止支撑元件140与罩壳112脱离。例如，用作挡块144的止动环可安装在罩壳112的内表面上，且因此罩110和支撑元件140可同时与主体150和驱动部130脱离。
驱动轴134可连接至电源用于提供驱动力，且电源单元可使用马达、气缸、动力传动元件等以各种方法配置而成。例如，驱动部130可包括用于提供驱动力的马达136、连接至马达136的转动轴的凸轮盘138和设置在凸轮盘138上且安装至驱动轴134下部的凸轮从动件139。
主体150可连接至真空泵160，且通孔122可用作用于吸附切割带14的下表面的真空孔。
例如，载台单元20可在水平方向移动，使得待拾取的裸芯12被定位在裸芯顶出装置100的上方，且随后裸芯顶出装置100可通过附加的驱动部(未示出)向上移动，以使盖120的上表面与切割带14的下表面紧密接触。然后，切割带14可通过真空泵160在主体174中设置的真空被真空吸附在盖120的上表面上。
驱动部130可上推支撑元件140，使得顶针102向上凸出盖120的上表面。裸芯12可通过顶针102从切割带14上部分分离，并随后由拾取器30拾起。
根据本发明的示范实施例，裸芯顶出装置100可包括柱形罩壳112和可转动地安装在罩壳112的上部的盘形盖120。盖120可具有设置成多行多列的通孔122，且用于将裸芯12从切割带14上分离的顶针102可插入通孔122中。尤其地，通孔122的中心C2可与盖120的中心C1分离。
因此，通孔122的设置可根据盖120的转动角度改变，且顶针102的设置可因此被更多样化地配置。结果，顶针102能被更有效率地设置，使得可应对具有各种大小和形状的裸芯。
尽管裸芯顶出装置100是参照特定的实施例来说明的，它们并不限于所述实施例。因此，本领域的技术人员应理解可对其作出各种修改和变更而不背离由所附权利要求限定的本发明的实质和范围。

Claims (10)

1.一种裸芯顶出装置，包括：
柱形罩壳；
盘形盖，所述盘形盖可转动地安装在所述罩壳的上部且具有多个通孔；
顶针，所述顶针插入所述通孔的一部分中且用来从切割带中分离裸芯；和
驱动部，所述驱动部垂直移动所述顶针以从所述切割带中分离所述裸芯，
其中，所述通孔设置成多行多列，且由所述通孔组成的图案的中心与所述盖的中心分开预定的距离。
2.如权利要求1中所述的裸芯顶出装置，其中所述通孔在X轴方向和Y轴方向上具有相同的间距，且
由所述通孔组成的图案的中心在所述X轴和Y轴方向上分别与所述盖的中心分开0.2-0.3倍的所述间距。
3.如权利要求1中所述的裸芯顶出装置，其中多个球头柱塞以均匀的间隔安装在所述盖的外周表面上，
供所述盖插入的台阶部设置在所述罩壳的上部，且
供所述球头柱塞的球头插入的凹陷设置在所述台阶部的内表面上。
4.如权利要求3中所述的裸芯顶出装置，其中槽被设置在所述台阶部的内表面上以在所述盖转动时引导所述球头柱塞的球头。
5.如权利要求3中所述的裸芯顶出装置，其中四个所述球头柱塞被安装在所述盖的外周表面上，且四个所述凹陷设置在所述台阶部的内表面。
6.如权利要求3中所述的裸芯顶出装置，其中供传动所述盖的工具插入的第二凹陷设置在所述盖的上表面的边缘部。
7.如权利要求1中所述的裸芯顶出装置，还包括：
设置在所述罩壳中以支撑所述顶针的支撑元件；和
耦接至所述罩壳的下部的柱形体。
8.如权利要求7中所述的裸芯顶出装置，其中所述驱动部包括：
耦接至所述支撑元件的头，和
连接至所述头且向下延伸穿过所述柱形体的驱动轴。
9.如权利要求8中所述的裸芯顶出装置，其中永磁体被设置在所述支撑元件中以保持所述顶针并耦接所述头。
10.如权利要求7中所述的裸芯顶出装置，其中挡块被安装在所述罩壳的内表面上以防止所述支撑元件与所述罩壳脱离。
CN201710680374.6A 2016-08-10 2017-08-10 裸芯顶出装置 Active CN107731723B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0101664 2016-08-10
KR1020160101664A KR101935097B1 (ko) 2016-08-10 2016-08-10 다이 이젝팅 장치

Publications (2)

Publication Number Publication Date
CN107731723A CN107731723A (zh) 2018-02-23
CN107731723B true CN107731723B (zh) 2021-08-13

Family

ID=61205081

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710680374.6A Active CN107731723B (zh) 2016-08-10 2017-08-10 裸芯顶出装置

Country Status (2)

Country Link
KR (1) KR101935097B1 (zh)
CN (1) CN107731723B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102594542B1 (ko) * 2018-10-31 2023-10-26 세메스 주식회사 다이 이젝팅 장치
KR102221703B1 (ko) * 2019-04-19 2021-03-02 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 픽업 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100290869A1 (en) * 2008-02-08 2010-11-18 Panasonic Corporation Chip supply pallet and chip supply apparatus
CN103681411A (zh) * 2012-08-31 2014-03-26 细美事有限公司 裸芯排出装置
CN103794531A (zh) * 2012-10-30 2014-05-14 细美事有限公司 裸芯排出装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270100B2 (ja) 2004-10-20 2009-05-27 パナソニック株式会社 チップのピックアップ装置およびピックアップ方法
US8470130B2 (en) * 2009-10-20 2013-06-25 Asm Assembly Automation Ltd Universal die detachment apparatus
KR101791787B1 (ko) 2016-05-27 2017-10-30 세메스 주식회사 이젝터 핀 조립체 및 이를 포함하는 다이 이젝팅 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100290869A1 (en) * 2008-02-08 2010-11-18 Panasonic Corporation Chip supply pallet and chip supply apparatus
CN103681411A (zh) * 2012-08-31 2014-03-26 细美事有限公司 裸芯排出装置
CN103794531A (zh) * 2012-10-30 2014-05-14 细美事有限公司 裸芯排出装置

Also Published As

Publication number Publication date
CN107731723A (zh) 2018-02-23
KR101935097B1 (ko) 2019-01-03
KR20180017595A (ko) 2018-02-21

Similar Documents

Publication Publication Date Title
KR102459402B1 (ko) 다이 이젝팅 장치
US8561664B2 (en) Die bonder, pickup method, and pickup device
CN107533965B (zh) 吸附机构、吸附方法、制造装置及制造方法
CN107452666B (zh) 顶杆组件和具有该顶杆组件的裸芯顶出装置
US20210060798A1 (en) Die pickup module and die bonding apparatus including the same
CN107731723B (zh) 裸芯顶出装置
KR102512045B1 (ko) 다이 이젝팅 장치
KR102330577B1 (ko) 전자 부품의 픽업 장치 및 실장 장치
CN111128841B (zh) 裸片顶出设备
KR20060094387A (ko) 칩 분리장치
KR102654600B1 (ko) 다이 이젝터 및 이를 포함하는 다이 본딩 장치
KR102594541B1 (ko) 다이 이젝팅 장치
KR102371543B1 (ko) 다이 픽업을 위한 정렬 좌표 설정 방법 및 이를 이용하는 다이 픽업 방법
CN108878315B (zh) 检查顶针的方法
KR20240008561A (ko) 다이 이젝터 및 다이 이젝팅 장치
KR102220346B1 (ko) 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
CN109524319B (zh) 裸芯台单元及具有其的裸芯粘合装置
KR20190054293A (ko) 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
KR102330661B1 (ko) 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
KR102189277B1 (ko) 스테이지 모듈 및 이를 포함하는 다이 본딩 장치
KR20110050027A (ko) 반도체 다이의 픽업 장치
KR102220338B1 (ko) 칩 본딩 장치 및 방법
KR102503285B1 (ko) 다이 이젝팅 장치
CN117581344A (zh) 元件拾取装置、元件安装装置
JP2021057533A (ja) 半導体チップのピックアップ治具、半導体チップのピックアップ装置およびピックアップ治具の調節方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant