CN107452666B - 顶杆组件和具有该顶杆组件的裸芯顶出装置 - Google Patents
顶杆组件和具有该顶杆组件的裸芯顶出装置 Download PDFInfo
- Publication number
- CN107452666B CN107452666B CN201710379488.7A CN201710379488A CN107452666B CN 107452666 B CN107452666 B CN 107452666B CN 201710379488 A CN201710379488 A CN 201710379488A CN 107452666 B CN107452666 B CN 107452666B
- Authority
- CN
- China
- Prior art keywords
- height
- rod
- support member
- die
- jack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Automatic Assembly (AREA)
Abstract
顶杆组件可包括垂直方向设置的顶杆、垂直方向设置供顶杆下部插入其中的圆柱形杆罩壳、配置成可在杆罩壳中转动和垂直移动并支撑顶杆的支撑元件、弹性支撑杆罩壳内的支撑元件的弹性元件以及垂直引导顶杆和支撑元件的导向凸起。顶杆、支撑元件和导向凸起可以按压开关的方式配置以使顶杆可通过下推顶杆的方式从第一高度改变为低于第一高度的第二高度。
Description
技术领域
本发明涉及顶杆组件和具有该顶杆组件的裸芯顶出装置。更具体地,本发明涉及在裸芯粘合工艺中将裸芯从加框晶圆的切割带中分离开来的顶杆组件,其中裸芯被粘合至如引线框架和印刷版电路等基底上,且裸芯顶出装置包括多个顶杆组件。
背景技术
通常,半导体器件可通过重复执行一系列的制备工艺在硅晶圆半导体基底上形成。如上所述形成的半导体器件可通过分割工艺分割且可通过粘合工艺粘合至基底。
用于执行裸芯粘合工艺的装置包括拾起模块和粘合模块,拾起模块用于将裸芯从包括通过分割工艺分成一个个的多个裸芯的加框晶圆中拾起,且粘合模块用于将裸芯粘合在基底上。拾起模块包括用于支撑加框晶圆的载台单元、用于将裸芯从加框晶圆的切割带上分离的裸芯顶出装置以及用于拾起裸芯的拾起单元。
裸芯顶出装置可包括用于将裸芯从切割带中分离的多个顶杆、容纳顶杆的罩、用于在垂直方向上移动顶杆的垂直驱动部等。
当裸芯的大小改变时,需根据裸芯的大小改变顶杆的数目和位置。顶杆的数目和位置可由操作者改变,但所需的时间可根据操作者的技术极大地增加。此外,当顶杆的位置出错时,裸芯粘合工艺中的裸芯拾起可能无法正常进行。
发明内容
本发明提供一种无需替换的顶杆组件并还提供一种包括多个顶杆组件的裸芯顶出装置。
根据本发明的一个方面,顶杆组件可包括垂直方向设置的顶杆、垂直方向设置供顶杆下部插入其中的圆筒形杆罩壳、配置成可在杆罩壳中转动和垂直移动并支撑顶杆的支撑元件、在杆罩中弹性支撑该支撑元件的弹性元件和垂直引导顶杆和支撑元件的多个导向凸起。特别地,顶杆、支撑元件和导向凸起可以按压开关的方式配置以使顶杆的高度可通过下推顶杆的方式从第一高度改变为低于第一高度的第二高度。
根据本发明的某些示范实施例,锯齿形第一凸轮可周向设置在顶杆的下端部,锯齿形第二凸轮可周向设置在支撑元件的上端部且与第一凸轮以未对齐的方式卡合,且支撑元件可通过下推顶杆被降低,从而与导向凸起分离,通过第一和第二凸轮之间的未对齐卡合被转动,且随后由导向凸起防止上升。
根据本发明的某些示范实施例,顶杆可包括头部,凸轮在头部上形成。
根据本发明的某些示范实施例,顶杆组件还可包括第二弹性元件,其设置在杆罩壳内且对顶杆施加向下的弹力。
根据本发明的某些示范实施例,裸芯顶出装置可包括用于将附装在切割带上的多个裸芯从切割带上分离的多个顶杆组件以及具有多个插入孔以便于顶杆组件插入其中并支撑顶杆组件的杆保持器。每个顶杆组件可包括垂直方向设置的顶杆、垂垂直方向设置供顶杆下部插入其中的圆柱形杆罩壳、配置成可在杆罩壳中转动和垂直移动并支撑顶杆的支撑元件、弹性支撑杆罩壳内的支撑元件的弹性元件以及垂直引导顶杆和支撑元件的导向凸起。尤其地,顶杆、支撑元件和导向凸起可以按压开关的方式配置以使顶杆可通过下推顶杆的方式从第一高度改变为低于第一高度的第二高度。
根据本发明某些示范实施例,锯齿形第一凸轮可周向设置在顶杆的下端部,锯齿形第二凸轮可周向设置在支撑元件的上端部且与第一凸轮以未对齐的方式卡合,且支撑元件可通过下推顶杆被降低,从而与导向凸起分离,通过第一和第二凸轮之间的未对齐卡合被转动,且随后由导向凸起防止上移。
根据本发明的某些示范实施例,顶杆可包括头部,第一凸轮在头部上形成。
根据本发明的某些示范实施例,每一顶杆组件还可包括第二弹性元件,其设置在杆罩壳内且对顶杆施加向下的弹力。
根据本发明的某些示范实施例,裸芯顶出装置还可包括高度调节单元,其用于将顶杆组件中的除了与裸芯相对应的至少一个顶杆组件以外的剩余顶杆组件中的顶杆从第一高度降低至第二高度。
根据本发明的某些示范实施例,高度调节单元还可包括推杆,用于将剩余顶杆组件的顶杆按下,且推杆可安装在用于拾起裸芯的拾取器上。
根据本发明的某些示范实施例,高度调节单元还可包括旋转驱动部,用于转动推杆以调节推杆的角度。
根据本发明的某些示范实施例,高度调节单元还可包括负载传感器,用于测量使用推杆下推顶杆时所施加到所述推杆的负载。
根据本发明的某些示范实施例,裸芯顶出装置还可包括检查相机,用于在通过高度调节单元调节顶杆高度之后检查顶杆的高度。
根据本发明的某些示范实施例,裸芯顶出装置还可包括具有多个穿孔的罩和垂直驱动部,其中顶杆组件插入穿孔中且垂直驱动部上推杆保持器以将裸芯从切割带上分离。
根据本发明的某些示范实施例,垂直驱动部可上推杆保持器至第三高度,以使顶杆组件的所有顶杆从罩的上表面凸起,将杆保持器降低至第四高度以使在顶杆的高度被调节后所有顶杆定位在罩的穿孔中,且下推杆保持器以使至少一个顶杆组件的顶杆从罩的上表面凸起从而将裸芯从切割带上分离。
上述发明内容不意图描述本发明的每一所示实施例或每一实施方式。以下详细说明和权利要求更具体地展示了这些实施例。
附图说明
参照附图可从以下说明中更详细地理解示范实施例,附图为:
图1是显示包括如本发明一示范实施例中的裸芯顶出装置的裸芯粘合装置的示意图;
图2是显示图1所示的裸芯顶出装置的截面图;
图3是显示图2中所示的顶杆组件的示意图;
图4和5是显示图3中所示的顶杆组件的操作的示意图;
图6-10是显示高度调节单元和使用高度调节单元调节顶杆组件的高度的方法的示意图;
图11和12是显示使用顶杆组件顶出裸芯的方法的示意图;
图13是显示图2中所示的杆保持器的另一示范例的示意图;
图14是显示图13中所示的上板的平面图;
图15是显示图13中所示的中板的平面图;
尽管多个实施例可修改成各种修改和替换形式,其具体实施例已通过附图中的示范例予以示出并将详细说明。然而,应理解,其意图不在于将所主张的发明限定在所述的特定实施例。相反,其意图在于涵盖落入由权利要求所限定的主题的实质和范围内的所有修改、等值和替代。
具体实施例
以下,将参照附图对本发明的实施例予以说明。但是,本发明不限于以下所述的实施例且可以各种其他形式实施。以下实施例的提供并非用于完整地完成本发明而是用于将本发明的范围完整地传达给本领域的技术人员。
在说明书中,当一个元件被称为在另一元件或层之上或连接至另一元件或层,其可直接位于另一元件或层之上或连接至另一元件或层,或还可存在中间元件或层。与此不同,应理解当一元件被称为直接位于另一元件或层之上或直接连接至另一元件或层,其意思是不存在中间元件。同样,尽管如第一、第二和第三之类的术语被用于描述本发明各实施例的各区或层,该区或层不限于所述术语。
以下所用的术语仅用于描述特定实施例,但不限制本发明。此外,除非本文另有定义,包括技术或科学术语在内的所有术语可具有与本领域技术人员通常理解的含义相同的含义。
本发明的实施例参照理想实施例的示意图予以说明。相应地,从附图的形式中可预期制备方法的修改和/或允许的错误。相应地,本发明的实施例的描述不限于附图中的特定形式和区域,且包括所述形式的偏差。该区域可以完全是示意性的,且其形式可不描述或刻画任何指定区域的精确形式或结构,且不意图限制本发明的范围。
图1是显示包括如本发明一示范实施例中的裸芯顶出装置的裸芯粘合装置的示意图;且图2是显示图1所示的裸芯顶出装置的截面图。
参照图1,根据本发明一实施例的裸芯顶出装置100可用于在裸芯粘合工艺中拾起半导体裸芯12用于制备半导体器件。
用于执行裸芯粘合工艺的装置可包括载台单元20、裸芯顶出装置100、拾取器30和拾取器驱动部40,其中载台单元20用于支撑晶圆10,晶圆10包括由切割工艺分成一个个的多个裸芯12;裸芯顶出装置100用于选择性地将裸芯12与晶圆10分离,拾取器30用于将由裸芯顶出装置100分离的裸芯12拾起,且拾取器驱动部40用于移动拾取器30。
晶圆10可附装在切割带14上,且切割带14可安装至圆环形的安装框16上。载台单元20可包括载台22、扩张环24和夹钳26,其中载台22配置成可在水平方向上移动,扩张环24设置在载台22上用于支撑切割带14的边缘部,且夹钳26用于通过降低安装框16来扩张切割带14。
拾取器30可设置在由载台单元20支撑的晶圆10上方且可安装在拾取器驱动部40上。拾取器驱动部40可水平和垂直移动拾取器30以拾起由裸芯顶出装置100从切割带14中分离的裸芯12。此外,尽管未示出,载台单元20可通过载台驱动部(未示出)在水平方向上移动以选择性地拾起裸芯12。
参照图2,裸芯顶出装置100可包括用于将裸芯12从切割带14上分离的多个顶杆组件110和具有供顶杆组件110插入的多个插入孔132并支撑顶杆组件110的杆保持器130。
此外,裸芯顶出装置100还可包括高度调节单元140(见图6),用于调节顶杆组件110的高度。尤其地,顶杆组件110可以按压开关的方式配置,且高度调节单元140可通过下推顶杆组件110的方式调整顶杆组件的高度。例如,高度调节单元140可将除了顶杆组件110中的一部分110A(见图8)或至少一个顶杆组件110A之外的剩余顶杆组件110B(见图8)从第一高度降低至低于第一高度的第二高度。因此,裸芯12可通过保持在第一高度的顶杆组件中的一部分110A从切割带14中分离。
图3是显示图2中所示的顶杆组件的示意图,且图4和5是显示图3中所示的顶杆组件的操作的示意图。
参照图3,每个顶杆组件110可配置成使用按压开关的方式调节高度,该方式通常被用于按压式圆珠笔。例如,顶杆组件110的高度可通过第一下推操作下推顶杆组件110的上端部从第一高度降低为第二高度,且可通过第二下推操作从第二高度回复至第一高度。
根据本发明一示范实施例,顶杆组件110可包括垂直方向设置的顶杆112、垂直方向设置并具有圆柱形状(顶杆112的下部插入其中)的杆罩壳116、配置成可在杆罩壳116中转动和垂直移动并支撑顶杆112的支撑元件118、在杆罩壳116中弹性支撑该支撑元件118的弹性元件120和垂直引导顶杆112和支撑元件118的多个导向凸起122。
特别地,顶杆112、支撑元件118和导向凸起122可以按压开关的方式配置以使顶杆112的高度可通过第一下推操作从第一高度改变为第二高度。
例如,锯齿形第一凸轮可周向设置在顶杆112的下端部,且锯齿形第二凸轮可周向设置在支撑元件118的上端部。例如,顶杆可包括头部114,第一凸轮在头部上形成,且第一凸轮可以图3所示的非对齐的方式与第二凸轮卡合。尤其地,由于第一凸轮和第二凸轮设置为彼此偏离,当导向凸起122的周向约束通过第一或第二下推操作被移除时,支撑元件118可转动预定的角度,如图4和5所示。
导向凸起122可设置在杆罩壳116的内表面,且头部114和支撑元件118可具有导槽,导向凸起122插入导槽中。
弹性元件120可包括螺旋弹簧。弹性元件120可设置在支撑元件118和杆罩壳116的下端部之间,且可用于在支撑元件118上施加向上的弹力。此外,顶杆组件110可包括第二弹性元件124,其设置在杆罩壳内且用于向顶杆112施加向下的弹力。第二弹性元件124可用于使顶杆112的头部114紧密接触支撑元件118。尤其地,由于第二弹性元件124对顶杆112施加向下的弹力,顶杆112可稳定地保持在第一高度或第二高度。例如,螺旋弹簧可用作第二弹性元件且可设置在头部114和杆罩壳116的上端部之间。
顶杆112可垂直延伸穿过杆罩壳116的上端部且可通过高度调节单元140被降低。当顶杆112通过高度调节单元140被降低时,支撑元件118可与顶杆112一起被降低。尤其地,当支撑元件118与顶杆112一起被降低时,支撑元件118可以在预定的高度上从导向凸起122中分离。相应地,导向凸起122对支撑元件118的周向约束可被消除,且随后支撑元件118可通过第一和第二凸轮之间的非对齐卡合转动预定的角度,如图4所示。之后,如图5所示,在第一下推操作完成后,支撑元件118的向上移动可由导向凸起122限制。
因此,顶杆组件110的高度可通过第一下推操作从第一高度调节至第二高度。此外,支撑元件118可转动且通过第二下推操作升高以使顶杆组件110的高度可从第二高度调节至第一高度。
参照图2,裸芯顶出装置100可包括罩150和垂直驱动部160,其中罩150具有多个穿孔152,顶杆组件110被插入穿孔152中,垂直驱动部160推高杆保持器130以将裸芯12从切割带14中分离。
例如,罩150可具有圆盖形,且顶杆112所插入的穿孔152可形成为穿透罩150的上部。杆保持器130可设置在罩150中,且用于防止杆保持器130从罩150上脱离的限位器154(例如,卡环)可安装在罩150的内表面上。
例如,垂直驱动部160可包括驱动头162、驱动轴164、凸轮166和马达168,其中驱动头162用于抓持杆保持器130,驱动轴164从驱动头162垂直向下延伸,凸轮166在垂直方向上移动驱动轴164,且马达168转动凸轮166。
用于抓持杆保持器130的永磁铁170可设置在驱动头162中。杆保持器130可包括上盘134和下盘136,其中插入孔132在上盘134中穿透形成,下盘136用于支撑插入插入孔132中的顶杆组件110。下盘136可由磁性材料制成以便于与驱动头耦合。
替代性地,垂直驱动部160可配置成使用齿条和小齿轮而不是凸轮166。在此情况下,马达168可转动小齿轮。然而,垂直驱动部160的配置可作多种修改,且因此本发明的范围不限于垂直驱动部160的配置。
裸芯顶出装置100可包括连接至罩150的圆柱形主体174,且驱动轴164可垂直延伸穿过主体174的下部。此外,尽管附图中未示出,主体174可连接至真空泵(未示出),且罩150的穿孔152可用作吸附切割带14的下表面的真空孔。
图6-10是显示高度调节单元和使用该高度调节单元调节顶杆组件的高度的方法的示意图,且图11和12是显示使用顶杆组件顶出裸芯的方法的示意图。
参照图6,高度调节单元140可安装在拾取器130上。例如,高度调节单元140可包括用于下推顶杆112的推杆142。推杆142的下端部应定位为低于拾取器30的下端部以便于下推顶杆112。在此情况下,使用拾取器130拾起裸芯12可能很困难。
根据本发明一示范实施例,高度调节单元140可包括旋转驱动部144用以转动推杆142以调节推杆142的角度。旋转驱动部144可包括马达且可转动推杆142以使推杆142垂直设置以调节顶杆组件110的高度。
此外,高度调节单元140可包括负载传感器146用于测量使用推杆142下推顶杆时施加在推杆142上的负载。例如,负载传感器146可安装在拾取器130上且用于防止在顶杆112上施加过大的负载。
垂直驱动部160可通过调节凸轮166的角度将杆保持器130上推至第三高度以使所有的顶杆112向上凸起出罩150的上表面。
参照图7和8,在推杆142被设置在垂直方向且顶杆112凸起出罩150之后,高度调节单元140可调节顶杆112的高度。具体地,高度调节单元140可将除了与裸芯12对应的顶杆组件110中的一部分110A以外的剩余顶杆组件110B的高度从第一高度调节至第二高度。此时,用于调节剩余顶杆组件110B的高度的第一下推操作可通过拾取器驱动部40进行。
参照图9,裸芯顶出装置100可包括检查相机180,用于在通过高度调节单元140调节顶杆112的高度之后检查顶杆112的高度。
尤其地,在调节顶杆组件110的高度之后,高度调节单元140可通过拾取器驱动部40移动至一侧,且检查相机180随后可通过另外的驱动部(未示出)在顶杆组件110上方移动。检查相机180可检查剩余顶杆组件110B的高度是否被正常调节至第二高度且顶杆组件110的一部分110A的高度是否保持在第一高度。
参照图10,在将剩余顶杆组件110B的高度调节至第二高度之后,旋转驱动部144可在水平方向上转动推杆142。垂直驱动部160可通过调节凸轮166的角度将杆保持器130降低至第四高度,以使所有顶杆112被定位在罩150的穿孔152中。
参照图11,罩150可与切割带14的下表面紧密接触,且切割带14可通过主体174内的真空而被真空吸附在罩150的上表面上。
参照图12,垂直驱动部169可通过调节凸轮166的角度上推杆保持器130至第五高度,以使顶杆组件110的一部分110A的顶杆112向上凸起出罩150的上表面。裸芯12可通过顶杆112上移,部分与切割带14分离,且随后被拾取器30拾起。
图13是显示图12中所示的杆保持器的另一示范例的示意图,图14是显示图13中所示的上盘的平面图,且图15是显示图13中所示的中盘的平面图。
参照图13-15,顶杆组件110所安装的杆保持器180可包括上盘182、中盘188和下盘192。例如,上盘182和中盘188可具有插入孔184和190,顶杆组件110C和110D的杆罩壳116插入在插入孔184和190中。插入上盘182的插入孔184中的杆罩壳116可由中盘188支撑,且插入中盘188的插入孔190中的杆罩壳116可由下盘192支撑。此外,上盘182可具有穿孔186,且插入中盘188的插入孔190中的顶杆组件110D的顶杆112可穿过穿孔186。
尤其地,当顶杆组件110之间的距离相对小时,杆保持器180可用于固定杆罩壳116之间的距离。例如,顶杆组件110C和110D可设置成多个行和列。上盘182的插入孔184和穿孔186可在行方向和列方向交替设置,且中盘188的插入孔190可与上盘182的穿孔186连接。
根据如上所述的本发明的示范实施例,顶杆组件110可包括垂直方向设置的顶杆112、垂直方向设置且具有供顶杆112的下部插入其中的圆柱形的杆罩壳116、配置成可在杆罩壳中转动和垂直移动并支撑顶杆112的支撑元件118、弹性支撑杆罩壳116中的支撑元件118的弹性元件120以及垂直引导顶杆112和支撑元件118的多个导向凸起122。尤其地,顶杆112、支撑元件118和导向凸起122可以按压开关的方式配置以使顶杆112的高度可通过下推顶杆112的方式从第一高度改变至低于第一高度的第二高度。
此外,多个顶杆组件110可预先制备且顶杆组件110的高度可根据裸芯112的大小调节。因此,即使裸芯12的大小改变,也无需替换顶杆组件110,且可快速地应对裸芯12的大小改变。因此,与手动改变顶杆的现有技术相比,裸芯粘合工艺所需的总时间可大大地缩短,且裸芯拾起错误可大大地减少。
此外,用于调节顶杆组件110的高度的高度调节单元140可安装在裸芯拾起单元上,且因此提供高度调节单元140所需的费用可大大地减少。
尽管包括多个顶杆组件110的裸芯顶出装置100是参照特定实施例来描述的,但它们不限于所述实施例。因此,本领域的技术人员将理解可对上述实施例作出多种修改和变化而不背离由所附权利要求限定的本发明的实质和范围。
Claims (13)
1.顶杆组件,包括:
垂直方向设置的顶杆;
垂直方向设置并供所述顶杆的下部插入的圆筒形杆罩壳;
配置成可在所述杆罩壳中转动和垂直移动并支撑所述顶杆的支撑元件;
弹性支撑所述杆罩壳中的所述支撑元件的弹性元件;
垂直引导所述顶杆和所述支撑元件的多个导向凸起,
其中所述顶杆、所述支撑元件和所述导向凸起以按压开关的方式配置,以使所述顶杆的高度可通过下推所述顶杆的方式从第一高度改变为低于所述第一高度的第二高度,并且
锯齿形第一凸轮周向设置在所述顶杆的下端部;
锯齿形第二凸轮周向设置在所述支撑元件的上端部且与所述第一凸轮以未对齐的方式卡合;且
所述支撑元件可通过下推所述顶杆被降低,从而与所述导向凸起分离,通过所述第一和第二凸轮之间的未对齐卡合被转动,且随后由所述导向凸起防止上升。
2.如权利要求1中所述的顶杆组件,其中所述顶杆包括头部,所述第一凸轮在所述头部上形成。
3.如权利要求1中所述的顶杆组件,还包括第二弹性元件,其设置在所述杆罩壳内且对所述顶杆施加向下的弹力。
4.裸芯顶出装置,包括:
用于将附装在切割带上的裸芯从切割带上分离的多个顶杆组件;以及
具有多个插入孔以便于所述顶杆组件插入其中并支撑所述顶杆组件的杆保持器,
其中,每个所述顶杆组件包括:
垂直方向设置的顶杆;
垂直方向设置并供所述顶杆的下部插入的圆柱形杆罩壳;
配置成可在所述杆罩壳中转动和垂直移动并支撑所述顶杆的支撑元件;
弹性支撑所述杆罩壳中的所述支撑元件的弹性元件;
垂直引导所述顶杆和所述支撑元件的多个导向凸起,
所述顶杆、所述支撑元件和所述导向凸起以按压开关的方式配置,以使所述顶杆的高度可通过下推所述顶杆的方式从第一高度改变为低于所述第一高度的第二高度,并且
锯齿形第一凸轮周向设置在所述顶杆的下端部;
锯齿形第二凸轮周向设置在所述支撑元件的上端部且与所述第一凸轮以未对齐的方式卡合;且
所述支撑元件可通过下推所述顶杆被降低,从而与所述导向凸起分离,通过所述第一和第二凸轮之间的未对齐卡合被转动,且随后由所述导向凸起防止上升。
5.如权利要求4中所述的裸芯顶出装置,其中所述顶杆包括头部,所述第一凸轮在所述头部上形成。
6.如权利要求4中所述的裸芯顶出装置,其中每一所述顶杆组件还包括第二弹性元件,其设置在所述杆罩壳内且对所述顶杆施加向下的弹力。
7.如权利要求4中所述的裸芯顶出装置,还包括高度调节单元,其用于将所述顶杆组件中除了与所述裸芯相对应的至少一个顶杆组件以外的剩余顶杆组件中的顶杆从所述第一高度降低至所述第二高度。
8.如权利要求7中所述的裸芯顶出装置,其中所述高度调节单元包括推杆,用于将所述剩余顶杆组件的顶杆下推,且所述推杆安装在用于拾起所述裸芯的拾取器上。
9.如权利要求8中所述的裸芯顶出装置,其中所述高度调节单元还包括旋转驱动部,用于转动所述推杆以调节所述推杆的角度。
10.如权利要求8中所述的裸芯顶出装置,其中所述高度调节单元还包括负载传感器,用于测量使用所述推杆下推所述顶杆时施加到所述推杆的负载。
11.如权利要求7中所述的裸芯顶出装置,还包括检查相机,用于在通过所述高度调节单元调节所述顶杆高度之后检查所述顶杆的高度。
12.如权利要求7中所述的裸芯顶出装置,还包括:
具有多个穿孔的罩,其中所述顶杆组件插入所述穿孔中;和
垂直驱动部,所述垂直驱动部上推所述杆保持器以将所述裸芯从所述切割带上分离。
13.如权利要求12中所述的裸芯顶出装置,其中所述垂直驱动部上推所述杆保持器至第三高度,以使所述顶杆组件的所有顶杆从所述罩的上表面凸起;
将所述杆保持器降低至第四高度以使在所述顶杆的高度被调节后所有所述顶杆定位在所述罩的穿孔中;且
上推所述杆保持器以使所述至少一个顶杆组件的顶杆从所述罩的上表面凸起从而将所述裸芯从所述切割带上分离。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160065588A KR101791787B1 (ko) | 2016-05-27 | 2016-05-27 | 이젝터 핀 조립체 및 이를 포함하는 다이 이젝팅 장치 |
KR10-2016-0065588 | 2016-05-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107452666A CN107452666A (zh) | 2017-12-08 |
CN107452666B true CN107452666B (zh) | 2020-10-23 |
Family
ID=60301218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710379488.7A Active CN107452666B (zh) | 2016-05-27 | 2017-05-25 | 顶杆组件和具有该顶杆组件的裸芯顶出装置 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101791787B1 (zh) |
CN (1) | CN107452666B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101935097B1 (ko) | 2016-08-10 | 2019-01-03 | 세메스 주식회사 | 다이 이젝팅 장치 |
CH715447B1 (de) * | 2018-10-15 | 2022-01-14 | Besi Switzerland Ag | Chip-Auswerfer. |
KR102165569B1 (ko) * | 2018-10-15 | 2020-10-14 | 세메스 주식회사 | 다이 이젝팅 장치 |
KR102650876B1 (ko) * | 2018-10-31 | 2024-03-26 | 세메스 주식회사 | 다이 이젝터의 높이 설정 방법 |
KR102594542B1 (ko) * | 2018-10-31 | 2023-10-26 | 세메스 주식회사 | 다이 이젝팅 장치 |
KR102145848B1 (ko) * | 2018-11-02 | 2020-08-19 | 세메스 주식회사 | 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치 |
CN112447579B (zh) * | 2019-09-04 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理器、晶片顶升装置及其方法 |
KR102431828B1 (ko) | 2021-08-09 | 2022-08-11 | 김원식 | 세라믹 분말을 이용한 성형품의 제조방법 |
CN115223918A (zh) * | 2022-07-06 | 2022-10-21 | 拓荆键科(海宁)半导体设备有限公司 | 用于托举晶圆的顶针固定结构及半导体处理设备 |
CN117373993B (zh) * | 2023-10-30 | 2024-10-18 | 深圳市路远智能装备有限公司 | 一种顶料机构及方法 |
CN117810159B (zh) * | 2023-12-29 | 2024-05-31 | 江苏新智达新能源设备有限公司 | 一种取芯用可切换的蓝膜顶针装置 |
CN118763050A (zh) * | 2023-12-29 | 2024-10-11 | 江苏新智达新能源设备有限公司 | 一种固晶机 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH098101A (ja) * | 1995-06-19 | 1997-01-10 | Matsushita Electric Ind Co Ltd | ダイエジェクタ装置 |
CN101383309A (zh) * | 2007-09-06 | 2009-03-11 | 上海华虹Nec电子有限公司 | 硅片顶针 |
CN202003972U (zh) * | 2010-07-13 | 2011-10-05 | 江门市新侨光电科技有限公司 | 一种用于固晶机的晶圆推顶装置 |
TW201142971A (en) * | 2010-05-21 | 2011-12-01 | Taiwan Semiconductor Mfg | Semiconductor chip pickup apparatus and pickup method |
CN202221753U (zh) * | 2011-09-19 | 2012-05-16 | 广东宝丽华服装有限公司 | 贴片机用可调节顶针座 |
CN103794531A (zh) * | 2012-10-30 | 2014-05-14 | 细美事有限公司 | 裸芯排出装置 |
CN204792868U (zh) * | 2015-05-29 | 2015-11-18 | 中建材浚鑫科技股份有限公司 | 硅片顶片机构 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101397750B1 (ko) * | 2012-07-25 | 2014-05-21 | 삼성전기주식회사 | 칩 이젝터 및 이를 이용한 칩 탈착 방법 |
US9412629B2 (en) * | 2012-10-24 | 2016-08-09 | Globalfoundries Inc. | Wafer bonding for 3D device packaging fabrication |
KR101621666B1 (ko) * | 2015-10-28 | 2016-05-16 | (주) 에스에스피 | 원터치 결합형 피커 어셈블리 |
-
2016
- 2016-05-27 KR KR1020160065588A patent/KR101791787B1/ko active IP Right Grant
-
2017
- 2017-05-25 CN CN201710379488.7A patent/CN107452666B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH098101A (ja) * | 1995-06-19 | 1997-01-10 | Matsushita Electric Ind Co Ltd | ダイエジェクタ装置 |
CN101383309A (zh) * | 2007-09-06 | 2009-03-11 | 上海华虹Nec电子有限公司 | 硅片顶针 |
TW201142971A (en) * | 2010-05-21 | 2011-12-01 | Taiwan Semiconductor Mfg | Semiconductor chip pickup apparatus and pickup method |
CN202003972U (zh) * | 2010-07-13 | 2011-10-05 | 江门市新侨光电科技有限公司 | 一种用于固晶机的晶圆推顶装置 |
CN202221753U (zh) * | 2011-09-19 | 2012-05-16 | 广东宝丽华服装有限公司 | 贴片机用可调节顶针座 |
CN103794531A (zh) * | 2012-10-30 | 2014-05-14 | 细美事有限公司 | 裸芯排出装置 |
CN204792868U (zh) * | 2015-05-29 | 2015-11-18 | 中建材浚鑫科技股份有限公司 | 硅片顶片机构 |
Also Published As
Publication number | Publication date |
---|---|
CN107452666A (zh) | 2017-12-08 |
KR101791787B1 (ko) | 2017-10-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107452666B (zh) | 顶杆组件和具有该顶杆组件的裸芯顶出装置 | |
US9455165B2 (en) | Die bonding device | |
US7624498B2 (en) | Apparatus for detaching a semiconductor chip from a tape | |
EP1907868B1 (en) | Integrated circuit test socket | |
KR100799896B1 (ko) | 캐리어 상에 디바이스를 정렬하기 위한 장치 및 방법 | |
KR102084792B1 (ko) | 포일로부터 반도체 칩을 탈착시키기 위한 방법 | |
JP5488966B2 (ja) | ダイエジェクタ | |
CN112020767B (zh) | 用于转移半导体器件的可变节距多针头 | |
KR200466085Y1 (ko) | 다이 이젝팅 장치 | |
JP6101361B2 (ja) | ピックアップ装置および突き上げポット | |
KR102512045B1 (ko) | 다이 이젝팅 장치 | |
KR101248313B1 (ko) | 헤드 교체 장치 및 이를 포함하는 다이 본딩 시스템 | |
CN108028205B (zh) | 具有转台的裸片放置头 | |
CN107731723B (zh) | 裸芯顶出装置 | |
US20050224186A1 (en) | Method for processing electrical parts, particularly for processing semiconductor chips and electrical components, and device for carrying out said method | |
KR102371543B1 (ko) | 다이 픽업을 위한 정렬 좌표 설정 방법 및 이를 이용하는 다이 픽업 방법 | |
JPWO2013145114A1 (ja) | ダイ供給装置 | |
KR102430473B1 (ko) | 이젝터 핀 및 이를 포함하는 다이 이젝팅 장치 | |
KR20200042329A (ko) | 다이 이젝팅 장치 | |
KR102650876B1 (ko) | 다이 이젝터의 높이 설정 방법 | |
KR20190054293A (ko) | 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치 | |
CN108878315B (zh) | 检查顶针的方法 | |
JP4230178B2 (ja) | 半導体チップ剥離装置およびその方法 | |
JP7184006B2 (ja) | 半導体チップのピックアップ治具、半導体チップのピックアップ装置およびピックアップ治具の調節方法 | |
EP3553534B1 (en) | Testing apparatus for singulated semiconductor dies with sliding layer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |