JPWO2022254703A1 - - Google Patents

Info

Publication number
JPWO2022254703A1
JPWO2022254703A1 JP2023525321A JP2023525321A JPWO2022254703A1 JP WO2022254703 A1 JPWO2022254703 A1 JP WO2022254703A1 JP 2023525321 A JP2023525321 A JP 2023525321A JP 2023525321 A JP2023525321 A JP 2023525321A JP WO2022254703 A1 JPWO2022254703 A1 JP WO2022254703A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023525321A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022254703A1 publication Critical patent/JPWO2022254703A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023525321A 2021-06-04 2021-06-04 Pending JPWO2022254703A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/021405 WO2022254703A1 (ja) 2021-06-04 2021-06-04 部品ピックアップ装置、部品実装装置

Publications (1)

Publication Number Publication Date
JPWO2022254703A1 true JPWO2022254703A1 (de) 2022-12-08

Family

ID=84322990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525321A Pending JPWO2022254703A1 (de) 2021-06-04 2021-06-04

Country Status (6)

Country Link
JP (1) JPWO2022254703A1 (de)
KR (1) KR20230156402A (de)
CN (1) CN117581344A (de)
DE (1) DE112021007233T5 (de)
TW (1) TWI793882B (de)
WO (1) WO2022254703A1 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3885446B2 (ja) * 2000-02-17 2007-02-21 松下電器産業株式会社 半導体チップのピックアップ方法
JP2005251986A (ja) * 2004-03-04 2005-09-15 Disco Abrasive Syst Ltd ウエーハの分離検出方法および分離検出装置
JP5730537B2 (ja) 2010-11-03 2015-06-10 富士機械製造株式会社 ダイ供給システム
JP5885230B2 (ja) * 2011-04-05 2016-03-15 富士機械製造株式会社 ダイ位置判定システム。
JP5936847B2 (ja) * 2011-11-18 2016-06-22 富士機械製造株式会社 ウエハ関連データ管理方法及びウエハ関連データ作成装置
JP6101361B2 (ja) * 2013-10-21 2017-03-22 富士機械製造株式会社 ピックアップ装置および突き上げポット

Also Published As

Publication number Publication date
TW202249586A (zh) 2022-12-16
TWI793882B (zh) 2023-02-21
DE112021007233T5 (de) 2024-01-11
KR20230156402A (ko) 2023-11-14
CN117581344A (zh) 2024-02-20
WO2022254703A1 (ja) 2022-12-08

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230927