CN117497446A - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN117497446A
CN117497446A CN202310872827.0A CN202310872827A CN117497446A CN 117497446 A CN117497446 A CN 117497446A CN 202310872827 A CN202310872827 A CN 202310872827A CN 117497446 A CN117497446 A CN 117497446A
Authority
CN
China
Prior art keywords
gas
substrate
opening
liquid receiving
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310872827.0A
Other languages
English (en)
Chinese (zh)
Inventor
滨田崇広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN117497446A publication Critical patent/CN117497446A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/06—Carrying-off electrostatic charges by means of ionising radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching

Landscapes

  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN202310872827.0A 2022-08-02 2023-07-17 基板处理装置 Pending CN117497446A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022123167A JP2024020745A (ja) 2022-08-02 2022-08-02 基板処理装置
JP2022-123167 2022-08-02

Publications (1)

Publication Number Publication Date
CN117497446A true CN117497446A (zh) 2024-02-02

Family

ID=89667826

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310872827.0A Pending CN117497446A (zh) 2022-08-02 2023-07-17 基板处理装置

Country Status (4)

Country Link
JP (1) JP2024020745A (https=)
KR (1) KR102768296B1 (https=)
CN (1) CN117497446A (https=)
TW (1) TWI890098B (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100612421B1 (ko) * 2004-10-27 2006-08-16 삼성전자주식회사 기판 이송 시스템
JP6045840B2 (ja) 2012-07-30 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7149118B2 (ja) * 2018-07-03 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7335797B2 (ja) * 2019-11-29 2023-08-30 株式会社Ｓｃｒｅｅｎホールディングス 現像装置
KR102649167B1 (ko) * 2020-09-09 2024-03-19 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법

Also Published As

Publication number Publication date
KR102768296B1 (ko) 2025-02-13
KR20240018364A (ko) 2024-02-13
JP2024020745A (ja) 2024-02-15
TWI890098B (zh) 2025-07-11
TW202407793A (zh) 2024-02-16

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