KR102768296B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR102768296B1
KR102768296B1 KR1020230092994A KR20230092994A KR102768296B1 KR 102768296 B1 KR102768296 B1 KR 102768296B1 KR 1020230092994 A KR1020230092994 A KR 1020230092994A KR 20230092994 A KR20230092994 A KR 20230092994A KR 102768296 B1 KR102768296 B1 KR 102768296B1
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KR
South Korea
Prior art keywords
substrate
gas
airflow
opening
airflow forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230092994A
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English (en)
Korean (ko)
Other versions
KR20240018364A (ko
Inventor
다카히로 하마다
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20240018364A publication Critical patent/KR20240018364A/ko
Application granted granted Critical
Publication of KR102768296B1 publication Critical patent/KR102768296B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H01L21/67051—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/06—Carrying-off electrostatic charges by means of ionising radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching

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  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020230092994A 2022-08-02 2023-07-18 기판 처리 장치 Active KR102768296B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022123167A JP2024020745A (ja) 2022-08-02 2022-08-02 基板処理装置
JPJP-P-2022-123167 2022-08-02

Publications (2)

Publication Number Publication Date
KR20240018364A KR20240018364A (ko) 2024-02-13
KR102768296B1 true KR102768296B1 (ko) 2025-02-13

Family

ID=89667826

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230092994A Active KR102768296B1 (ko) 2022-08-02 2023-07-18 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2024020745A (https=)
KR (1) KR102768296B1 (https=)
CN (1) CN117497446A (https=)
TW (1) TWI890098B (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021086994A (ja) * 2019-11-29 2021-06-03 株式会社Ｓｃｒｅｅｎホールディングス 現像装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100612421B1 (ko) * 2004-10-27 2006-08-16 삼성전자주식회사 기판 이송 시스템
JP6045840B2 (ja) 2012-07-30 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7149118B2 (ja) * 2018-07-03 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102649167B1 (ko) * 2020-09-09 2024-03-19 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021086994A (ja) * 2019-11-29 2021-06-03 株式会社Ｓｃｒｅｅｎホールディングス 現像装置

Also Published As

Publication number Publication date
KR20240018364A (ko) 2024-02-13
CN117497446A (zh) 2024-02-02
JP2024020745A (ja) 2024-02-15
TWI890098B (zh) 2025-07-11
TW202407793A (zh) 2024-02-16

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