CN117461392A - 组合物以及覆金属层叠体及其制造方法 - Google Patents

组合物以及覆金属层叠体及其制造方法 Download PDF

Info

Publication number
CN117461392A
CN117461392A CN202280041658.XA CN202280041658A CN117461392A CN 117461392 A CN117461392 A CN 117461392A CN 202280041658 A CN202280041658 A CN 202280041658A CN 117461392 A CN117461392 A CN 117461392A
Authority
CN
China
Prior art keywords
composition
metal
inorganic filler
layer
fluoropolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280041658.XA
Other languages
English (en)
Chinese (zh)
Inventor
小野元司
荒井完尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN117461392A publication Critical patent/CN117461392A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/40—Metallic substrate based on other transition elements
    • B05D2202/45—Metallic substrate based on other transition elements based on Cu
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2506/00—Halogenated polymers
    • B05D2506/10—Fluorinated polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Chemistry (AREA)
CN202280041658.XA 2021-06-11 2022-06-03 组合物以及覆金属层叠体及其制造方法 Pending CN117461392A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021097909 2021-06-11
JP2021-097909 2021-06-11
PCT/JP2022/022650 WO2022259981A1 (ja) 2021-06-11 2022-06-03 組成物、並びに、金属張積層体及びその製造方法

Publications (1)

Publication Number Publication Date
CN117461392A true CN117461392A (zh) 2024-01-26

Family

ID=84425980

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280041658.XA Pending CN117461392A (zh) 2021-06-11 2022-06-03 组合物以及覆金属层叠体及其制造方法

Country Status (5)

Country Link
US (1) US20240124698A1 (https=)
JP (1) JPWO2022259981A1 (https=)
KR (1) KR20240019121A (https=)
CN (1) CN117461392A (https=)
WO (1) WO2022259981A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120858023A (zh) 2023-02-07 2025-10-28 索尔维特殊聚合物美国有限责任公司 用于移动电子装置部件的复合膜
KR20260029283A (ko) * 2023-06-29 2026-03-04 에이지씨 가부시키가이샤 수성 프라이머 조성물, 프라이머층의 형성 방법, 및 성형물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286172A (ja) 1988-09-22 1990-03-27 Hitachi Ltd 化合物半導体デバイス
JP4377867B2 (ja) 2005-09-30 2009-12-02 日本ピラー工業株式会社 銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法
JP2017002115A (ja) 2015-06-04 2017-01-05 Ａｐｃ株式会社 フッ素樹脂フィルム、積層体及び積層体の製造方法
KR102353961B1 (ko) * 2016-07-22 2022-01-21 에이지씨 가부시키가이샤 액상 조성물, 그리고 그 액상 조성물을 사용한, 필름 및 적층체의 제조 방법
JP7151140B2 (ja) * 2018-04-11 2022-10-12 Ａｇｃ株式会社 フッ素樹脂シート、積層体及びそれらの製造方法
WO2019203243A1 (ja) * 2018-04-20 2019-10-24 Ａｇｃ株式会社 ロールフィルム、ロールフィルムの製造方法、銅張積層体の製造方法、及びプリント基板の製造方法
WO2020145133A1 (ja) * 2019-01-11 2020-07-16 ダイキン工業株式会社 フッ素樹脂組成物、フッ素樹脂シート、積層体及び回路用基板
KR20220101640A (ko) * 2019-11-11 2022-07-19 에이지씨 가부시키가이샤 비수계 분산액, 적층체의 제조 방법 및 성형물

Also Published As

Publication number Publication date
JPWO2022259981A1 (https=) 2022-12-15
US20240124698A1 (en) 2024-04-18
WO2022259981A1 (ja) 2022-12-15
KR20240019121A (ko) 2024-02-14

Similar Documents

Publication Publication Date Title
JP7368769B2 (ja) 積層体及び回路用基板
JP6819579B2 (ja) プリント基板用材料、金属積層板、それらの製造方法およびプリント基板の製造方法
JP7283208B2 (ja) パウダー分散液、積層体の製造方法、積層体及びプリント基板の製造方法
US20240124698A1 (en) Composition, as well as metal-clad laminate and method for its production
JP2019065061A (ja) プリント基板用樹脂組成物および製造方法
CN108141967A (zh) 配线基板的制造方法
KR20210016322A (ko) 수지가 부착된 금속박의 제조 방법, 수지가 부착된 금속박, 적층체 및 프린트 기판
WO2018043682A1 (ja) 配線基板およびその製造方法
WO2021075504A1 (ja) 非水系分散液及び積層体の製造方法
KR20210137426A (ko) 액상 조성물, 파우더, 및, 파우더의 제조 방법
WO2020184438A1 (ja) 液状組成物、強誘電性絶縁シート及びその製造方法
JP2020146970A (ja) 積層体及び積層体の製造方法
JP7740231B2 (ja) 多層フィルム、その製造方法、金属張積層体及びプリント配線基板の製造方法
US20250358931A1 (en) Dielectric, copper-clad laminate and method for producing same
JP2025049784A (ja) 金属張積層板及びその製造方法
CN114729198B (zh) 粉体组合物、膜和膜的制造方法
JP2025079056A (ja) 組成物、並びに、金属張積層体及びその製造方法
JP7846386B2 (ja) 誘電体、銅張積層体及びそれらの製造方法
KR101797724B1 (ko) 연성 금속 적층체
JP2024030218A (ja) プリント配線板の製造方法
TW202440775A (zh) 介電體、覆銅積層體及其等之製造方法
JP2020093196A (ja) 処理金属基板の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination