CN117393486B - 散热盖贴装工艺中的贴装精度控制方法 - Google Patents
散热盖贴装工艺中的贴装精度控制方法 Download PDFInfo
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- CN117393486B CN117393486B CN202311684576.XA CN202311684576A CN117393486B CN 117393486 B CN117393486 B CN 117393486B CN 202311684576 A CN202311684576 A CN 202311684576A CN 117393486 B CN117393486 B CN 117393486B
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 238000001514 detection method Methods 0.000 claims description 22
- 230000005855 radiation Effects 0.000 claims description 16
- 238000005259 measurement Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 abstract description 14
- 238000012797 qualification Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 14
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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CN202311684576.XA CN117393486B (zh) | 2023-12-11 | 2023-12-11 | 散热盖贴装工艺中的贴装精度控制方法 |
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CN202311684576.XA CN117393486B (zh) | 2023-12-11 | 2023-12-11 | 散热盖贴装工艺中的贴装精度控制方法 |
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CN117393486A CN117393486A (zh) | 2024-01-12 |
CN117393486B true CN117393486B (zh) | 2024-03-15 |
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CN202311684576.XA Active CN117393486B (zh) | 2023-12-11 | 2023-12-11 | 散热盖贴装工艺中的贴装精度控制方法 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108598025A (zh) * | 2018-05-25 | 2018-09-28 | 深圳市朝阳光科技有限公司 | 一种独立自动校正机构及贴片机 |
CN112908895A (zh) * | 2021-01-20 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | 一种基板平面矫正方法、系统及贴合设备 |
CN112992764A (zh) * | 2021-02-07 | 2021-06-18 | 微见智能封装技术(深圳)有限公司 | 一种吸料装置、固晶机和固晶方法 |
CN113819839A (zh) * | 2020-10-13 | 2021-12-21 | 常州铭赛机器人科技股份有限公司 | 贴装自动校准方法、装置及设备 |
CN116313993A (zh) * | 2023-03-13 | 2023-06-23 | 华南理工大学 | 一种供晶装置及实时矫正方法 |
CN116615020A (zh) * | 2023-07-19 | 2023-08-18 | 合肥安迅精密技术有限公司 | 基于机器视觉的吸嘴位姿误差标定与补偿方法、系统 |
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2023
- 2023-12-11 CN CN202311684576.XA patent/CN117393486B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108598025A (zh) * | 2018-05-25 | 2018-09-28 | 深圳市朝阳光科技有限公司 | 一种独立自动校正机构及贴片机 |
CN113819839A (zh) * | 2020-10-13 | 2021-12-21 | 常州铭赛机器人科技股份有限公司 | 贴装自动校准方法、装置及设备 |
CN112908895A (zh) * | 2021-01-20 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | 一种基板平面矫正方法、系统及贴合设备 |
CN112992764A (zh) * | 2021-02-07 | 2021-06-18 | 微见智能封装技术(深圳)有限公司 | 一种吸料装置、固晶机和固晶方法 |
CN116313993A (zh) * | 2023-03-13 | 2023-06-23 | 华南理工大学 | 一种供晶装置及实时矫正方法 |
CN116615020A (zh) * | 2023-07-19 | 2023-08-18 | 合肥安迅精密技术有限公司 | 基于机器视觉的吸嘴位姿误差标定与补偿方法、系统 |
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Inventor after: Lin Xiang Inventor after: Chen Chen Inventor after: Zhou Dianqiu Inventor after: Qu Dongsheng Inventor after: Wang Jiangkun Inventor after: Li Changfeng Inventor after: Huang Jiming Inventor after: Zhao Fangqun Inventor before: Lin Xiang Inventor before: Chen Chen Inventor before: Zhou Dianqiu Inventor before: Qu Dongsheng Inventor before: Wang Jiangkun Inventor before: Li Changfeng Inventor before: Huang Banming Inventor before: Zhao Fangqun |
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