CN117086023A - 气体喷射单元和基板处理装置 - Google Patents

气体喷射单元和基板处理装置 Download PDF

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Publication number
CN117086023A
CN117086023A CN202211664652.6A CN202211664652A CN117086023A CN 117086023 A CN117086023 A CN 117086023A CN 202211664652 A CN202211664652 A CN 202211664652A CN 117086023 A CN117086023 A CN 117086023A
Authority
CN
China
Prior art keywords
gas injection
gas
walls
flow path
inflow port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211664652.6A
Other languages
English (en)
Chinese (zh)
Inventor
张震宇
金载烈
申哲榕
金仁浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of CN117086023A publication Critical patent/CN117086023A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CN202211664652.6A 2022-05-19 2022-12-23 气体喷射单元和基板处理装置 Pending CN117086023A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020220061193A KR102622277B1 (ko) 2022-05-19 2022-05-19 기체 분사유닛 및 기판처리장치
KR10-2022-0061193 2022-05-19

Publications (1)

Publication Number Publication Date
CN117086023A true CN117086023A (zh) 2023-11-21

Family

ID=88772404

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211664652.6A Pending CN117086023A (zh) 2022-05-19 2022-12-23 气体喷射单元和基板处理装置

Country Status (3)

Country Link
KR (1) KR102622277B1 (ko)
CN (1) CN117086023A (ko)
TW (1) TW202345985A (ko)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100762371B1 (ko) 2006-04-12 2007-10-02 주식회사 심우 글라스 건조용 에어 나이프
KR101243742B1 (ko) * 2011-06-24 2013-03-13 국제엘렉트릭코리아 주식회사 반도체 제조에 사용되는 분사부재 및 그것을 갖는 기판 처리 장치
KR101777688B1 (ko) * 2013-10-21 2017-09-27 에이피시스템 주식회사 가스 분사 유닛 및 이를 포함하는 열처리 장치
KR20170049962A (ko) * 2015-10-29 2017-05-11 세메스 주식회사 노즐과 이를 포함하는 기판 처리 장치 및 방법
JP6949510B2 (ja) * 2017-02-28 2021-10-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR101874809B1 (ko) * 2018-02-08 2018-07-05 김원기 오염물질 배출 장치
KR102568797B1 (ko) * 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 시스템
KR20200137372A (ko) * 2019-05-30 2020-12-09 주식회사 원익아이피에스 기판처리장치
KR20210047736A (ko) * 2019-10-22 2021-04-30 주식회사 원익아이피에스 기판 처리 장치
KR102357066B1 (ko) * 2019-10-31 2022-02-03 세메스 주식회사 기판 처리 장치
KR102317442B1 (ko) * 2020-01-20 2021-10-26 주성엔지니어링(주) 기판처리방법
KR102336731B1 (ko) * 2020-01-31 2021-12-06 세메스 주식회사 기판 처리 장치
KR102389224B1 (ko) * 2020-03-09 2022-04-21 주식회사 에이치에스하이테크 기판 세정용 2류체 노즐
KR20210113816A (ko) * 2020-03-09 2021-09-17 주식회사 에이치에스하이테크 기판 세정용 2류체 노즐
KR20210133557A (ko) * 2020-04-29 2021-11-08 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Also Published As

Publication number Publication date
KR20230161616A (ko) 2023-11-28
TW202345985A (zh) 2023-12-01
KR102622277B1 (ko) 2024-01-08

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