TW202345985A - 氣體噴射單元和基板處理裝置 - Google Patents
氣體噴射單元和基板處理裝置 Download PDFInfo
- Publication number
- TW202345985A TW202345985A TW112103164A TW112103164A TW202345985A TW 202345985 A TW202345985 A TW 202345985A TW 112103164 A TW112103164 A TW 112103164A TW 112103164 A TW112103164 A TW 112103164A TW 202345985 A TW202345985 A TW 202345985A
- Authority
- TW
- Taiwan
- Prior art keywords
- gas injection
- gas
- cavity
- flow path
- opening
- Prior art date
Links
- 238000002347 injection Methods 0.000 title claims abstract description 445
- 239000007924 injection Substances 0.000 title claims abstract description 445
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 claims description 34
- 230000008569 process Effects 0.000 claims description 32
- 230000032258 transport Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
- B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020220061193A KR102622277B1 (ko) | 2022-05-19 | 2022-05-19 | 기체 분사유닛 및 기판처리장치 |
KR10-2022-0061193 | 2022-05-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202345985A true TW202345985A (zh) | 2023-12-01 |
Family
ID=88772404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112103164A TW202345985A (zh) | 2022-05-19 | 2023-01-30 | 氣體噴射單元和基板處理裝置 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102622277B1 (ko) |
CN (1) | CN117086023A (ko) |
TW (1) | TW202345985A (ko) |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100762371B1 (ko) | 2006-04-12 | 2007-10-02 | 주식회사 심우 | 글라스 건조용 에어 나이프 |
KR101243742B1 (ko) * | 2011-06-24 | 2013-03-13 | 국제엘렉트릭코리아 주식회사 | 반도체 제조에 사용되는 분사부재 및 그것을 갖는 기판 처리 장치 |
KR101777688B1 (ko) * | 2013-10-21 | 2017-09-27 | 에이피시스템 주식회사 | 가스 분사 유닛 및 이를 포함하는 열처리 장치 |
KR20170049962A (ko) * | 2015-10-29 | 2017-05-11 | 세메스 주식회사 | 노즐과 이를 포함하는 기판 처리 장치 및 방법 |
JP6949510B2 (ja) * | 2017-02-28 | 2021-10-13 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
KR101874809B1 (ko) * | 2018-02-08 | 2018-07-05 | 김원기 | 오염물질 배출 장치 |
KR102568797B1 (ko) * | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 시스템 |
KR20200137372A (ko) * | 2019-05-30 | 2020-12-09 | 주식회사 원익아이피에스 | 기판처리장치 |
KR20210047736A (ko) * | 2019-10-22 | 2021-04-30 | 주식회사 원익아이피에스 | 기판 처리 장치 |
KR102357066B1 (ko) * | 2019-10-31 | 2022-02-03 | 세메스 주식회사 | 기판 처리 장치 |
KR102317442B1 (ko) * | 2020-01-20 | 2021-10-26 | 주성엔지니어링(주) | 기판처리방법 |
KR102336731B1 (ko) * | 2020-01-31 | 2021-12-06 | 세메스 주식회사 | 기판 처리 장치 |
KR102389224B1 (ko) * | 2020-03-09 | 2022-04-21 | 주식회사 에이치에스하이테크 | 기판 세정용 2류체 노즐 |
KR20210113816A (ko) * | 2020-03-09 | 2021-09-17 | 주식회사 에이치에스하이테크 | 기판 세정용 2류체 노즐 |
KR20210133557A (ko) * | 2020-04-29 | 2021-11-08 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
-
2022
- 2022-05-19 KR KR1020220061193A patent/KR102622277B1/ko active IP Right Grant
- 2022-12-23 CN CN202211664652.6A patent/CN117086023A/zh active Pending
-
2023
- 2023-01-30 TW TW112103164A patent/TW202345985A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230161616A (ko) | 2023-11-28 |
KR102622277B1 (ko) | 2024-01-08 |
CN117086023A (zh) | 2023-11-21 |
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