TW202345985A - Gas injection unit and apparatus for treating substrate - Google Patents

Abstract

The present invention provides a gas injection unit and an apparatus for treating a substrate. A gas injection unit of an embodiment of the present invention comprises: a housing including a gas inflow port and a cavity which is connected to the gas inflow port and has an opening formed on one face; and a gas injection section which is arranged within the cavity and is configured to be changeable into various configuration positions relative to the cavity, and has an internal flow path and a plurality of gas injection orifice portions different from each other. The internal flow path is connected to the gas inflow port, and the gas injection orifice portions are connected to the internal flow path and are configured to inject gas toward the opening according to the arrangement position. According to this configuration, the flow rate and flow rate of the gas can be adjusted by a gas injection section having a plurality of gas injection orifice portions. The gas injection section is detachably mounted on the cavity and has a plurality of gas injection walls. The plurality of gas injection orifice portions different from each other are arranged on the gas injection walls.

Description

Gas injection unit and substrate processing device

The present invention relates to a gas injection unit and a substrate processing apparatus including the gas injection unit.

Usually in the semiconductor manufacturing process, substrates are manufactured through processes such as lithography process, etching process, deposition process, metal process, electrical die sorting (EDS) process, and packaging process. In this process, if necessary, a cleaning process to remove impurities such as particles or organic matter attached to the substrate may be performed before and after the process, and a drying process may be performed to remove liquid remaining on the substrate after the cleaning process. For example, in the packaging process, a substrate that is singulated into multiple semiconductor packages through a cutting and sorting process can be classified as a good product or a defective product through inspection after a cleaning and drying process.

In this cleaning or drying process, a gas injection unit such as an air knife for injecting gas is provided to clean or dry the substrate.

Conventionally, the gas injection port of such a gas injection unit is formed in a slit shape, and in order to control the discharge amount of gas, an adjustment means is provided for adjusting the gap size of the slit shape of the gas injection port of such a gas injection unit. . However, although the slit-shaped gap size of the gas injection port can be adjusted by this adjustment method, it is difficult to uniformly adjust the slit-shaped gap size, so the flow rate and flow rate in each area are uneven. Problems such as flow rate and flow deviations may occur.

existing technical documents

patent documents

(Patent Document 1) Korean Patent No. 10-0762371 (September 20, 2007).

Technical issues to be solved

An object of the present invention is to provide a gas injection unit and a substrate processing apparatus capable of adjusting the flow rate and flow rate of gas.

means of solving problems

In order to achieve the above object, according to an embodiment of the present invention, a gas injection unit is provided, including: a housing, including a gas inlet and a cavity, the cavity is connected to the gas inlet and is formed on one surface There is an opening; and a gas injection part arranged in the cavity, configured to be changeable into a variety of configuration positions relative to the cavity, and having an internal flow path and a plurality of mutually different gas injection hole parts, the internal flow path Connected to the gas inlet, the gas injection hole portions are connected to the internal flow path, and are configured to inject gas toward the opening according to the arrangement position.

In one embodiment, the gas injection part can be detachably installed in the cavity.

In addition, the gas injection part may include a plurality of gas injection walls, and mutually different gas injection hole parts are arranged on the gas injection walls.

Further, the outer contour cross-sectional shape of the gas injection part is formed into a polygonal shape, each gas injection wall is defined by each side wall of the gas injection part, and the cavity may be formed to be similar to the outer contour cross-sectional shape of the gas injection part. corresponding shape.

In addition, each gas injection wall may be provided with a connection flow path that connects the gas inlet and the internal flow path.

In one embodiment, the outer contour cross-sectional shape of the gas injection part is formed into a square shape, each gas injection wall is provided with a connecting flow path connecting the gas inlet and the internal flow path, and the cavity is formed on one surface There is the opening, and is formed in a rectangular shape corresponding to the outer surface of at least three gas injection walls of the gas injection part. In the arrangement position, one of the gas injection walls is arranged toward the opening, and the other three gas injection walls are arranged facing the opening. The injection wall can be close to the inner wall of the cavity.

For example, the gas inlet may be disposed at an upper central portion of the housing.

For another example, the gas inlets may be respectively disposed at both ends of the housing.

In addition, the gas injection unit of the present invention may include a cover coupled to the opening and formed with an outlet exposing the gas injection hole portion.

Further, the gas injection part is formed with a plurality of connection flow paths connecting the gas inlet and the internal flow path, and the cover can be configured with a connection flow path inserted into the connection flow path toward the opening among the connection flow paths. Sealing bump for sealing.

In addition, each of the gas injection hole portions may include a plurality of gas injection holes arranged at the same hole diameter and at predetermined intervals.

Specifically, the gas injection hole portions may be configured such that at least one of a hole shape, a hole diameter, and an interval between gas injection holes located on the same gas injection wall and adjacent to each other is different from each other.

On the other hand, according to another embodiment of the present invention, a gas injection unit is further provided, including: a housing including a gas inlet and a cavity, the cavity being connected to the gas inlet and on one surface An opening is formed; a gas injection part is disposed in the cavity, is detachably disposed in a variety of configuration positions relative to the cavity, and has an outer contour cross-sectional shape formed into a rectangular shape; and a cover covering the opening and forming There is an outlet exposing a gas injection hole portion of the gas injection portion. The gas injection portion includes: an internal flow path connected to the gas inlet; and four gas injection walls defined by each side wall of the gas injection portion. ; The plurality of gas injection hole portions that are different from each other include a plurality of gas injection holes connected to the internal flow path and arranged at predetermined intervals in each of the gas injection walls, so that according to the arrangement position is configured to inject gas toward the opening.

On the other hand, according to another embodiment of the present invention, a substrate processing device is also provided, including: a process chamber, in which a transport unit is configured to transport a substrate; and a gas injection unit is configured in the process chamber, And injecting gas to the substrate, the gas injection unit includes: a housing including a gas inlet and a cavity, the cavity is connected to the gas inlet and has an opening formed on one surface; and a gas injection a portion arranged in the cavity, configured to be changeable into a variety of configuration positions relative to the cavity, and having an internal flow path and a plurality of mutually different gas injection hole portions, the internal flow path being connected to the gas inlet, The gas injection hole portions are connected to the internal flow path, and are configured to inject gas toward the opening according to the arrangement position.

Effect of the invention

According to the composition of the gas injection unit and the substrate processing device according to the embodiment of the present invention, through the composition of the gas injection hole, the movement amount transfer effect of the gas can be increased, and when used in the cleaning process, the cleaning area can be increased, which is beneficial The overall flow rate deviation of the gas injection part is reduced. Furthermore, since there are various types of gas injection hole parts, there is no need to install a separate adjustment device for adjusting the gap interval suitable for the slit-shaped injection structure used in the past, and it can be produced It has a simple structure, and the desired gas injection hole can be selected as needed, so that the gas flow rate and flow rate can be adjusted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily implement the present invention. However, when describing the preferred embodiments of the present invention in detail, if it is believed that detailed description of related conventional functions or structures will unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, for parts with similar functions and effects, the same symbols are used throughout the drawings. In this specification, "upper", "upper surface", "upper surface", "upper side", "lower part", "lower surface", "bottom", "lower surface", "lower side", "inner", Terms such as "outside" are used to refer to the "upper part", "upper surface", "upper surface", "upper side", "lower part", "lower surface", "bottom surface", "lower surface" and "lower side" of the component. ", "inside", "outside", etc. are used as the basis. In fact, the direction in which the constituent elements are arranged will differ.

In addition, throughout this specification, when one part is "connected" to another part, this includes not only the case of "direct connection" but also the case of "indirect connection" with other components interposed therebetween. In addition, unless otherwise described to the contrary, "including" certain elements means that other elements may also be included, not the exclusion of other elements.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

1a and 1b are exemplary diagrams respectively illustrating a substrate processing apparatus according to different embodiments of the present invention.

Referring to Figures 1a and 1b, the substrate processing device of the present invention is a device for processing substrates. It can be various process processing devices for processing substrates in the substrate manufacturing process. For example, it can be a substrate cleaning device, a substrate drying device, etc. . In addition, for another example, the substrate processing device of the present invention can also be applied to a cutting and inspection device. As a method of transporting the substrate in such a substrate processing apparatus, not only the rollers described below are used to transport the substrate, but also the gas injection unit of the present invention may be used to inject gas during the process of adsorbing and transporting the substrate by an adsorption plate.

This substrate processing apparatus 10 includes a process chamber 100 and a gas injection unit 200 .

The process chamber 100 is provided with a transport unit 300 that transports the substrate S from the import port 110 to the transport port 120 along the transport direction. The lower part of the process chamber 100 may also be provided with a drain port 130 for discharging the process liquid.

The conveying unit 300 may include a plurality of rotating shafts 310 arranged along the conveying direction, a plurality of rollers 320 arranged on the rotating shaft 310, and a driving part connected to the rotating shaft 310 to drive the rotating shaft 310 to rotate ( not shown).

Such plurality of rotation shafts 310 may be arranged at predetermined intervals in the horizontal direction within the process chamber 100 . The length of the rotation shaft 310 is determined according to the size of the substrate S to be conveyed. When conveying a large-sized substrate S, a rotation shaft 310 with a longer major axis may be used.

A plurality of rollers 320 may be provided at predetermined intervals on each rotation shaft 310. The rollers 320 support the substrate S and rotate in a predetermined direction to transport the substrate S.

As shown in FIG. 1a , a gas injection unit 200 is provided above the substrate S on the roller 320 of the conveyance unit 300 having this structure, and the gas injection unit 200 injects gas onto the upper surface of the conveyed substrate S.

In addition, in another embodiment, as shown in FIG. 1 b , two devices that inject gas respectively to the upper and lower surfaces of the substrate S are provided on the upper and lower parts of the substrate S located on the roller 320 of the transport unit 300 . There are two gas injection units 200, and the two gas injection units 200 are opposite to each other.

The gas injection unit 200 may be formed to have a sufficient length to supply sufficient gas to the conveyed substrate S.

Hereinafter, the gas injection unit 200 of the present invention will be described in detail with reference to the drawings.

Figure 2 is an exploded view of the gas injection unit according to one embodiment of the present invention. Figure 3 is an exploded view of the gas injection unit viewed from the side of Figure 2. Figure 4 is a front view of the gas injection unit according to one embodiment of the present invention. Figure 5a and 5b are cross-sectional views taken along lines AA′ and BB′ of FIG. 4 respectively. FIGS. 6a and 6b illustrate adjacent parts of the gas injection part of the gas injection unit according to an embodiment of the present invention. Diagram of two gas jet walls.

Referring to FIG. 2 , a gas injection unit 200 according to an embodiment of the present invention is disposed in the process chamber 100 of the substrate processing apparatus 10 and is used to inject gas to the substrate S. Specifically, it includes a casing 210 and a cavity 211 disposed in the casing 210 . The gas injection part 220 inside.

The housing 210 includes a cavity 211 .

A gas inlet 212 is formed in the cavity 211 of the housing 210 . The gas inlet 212 is connected to a supply line that supplies gas, so that the gas flows into the cavity 211 . This cavity 211 is connected to the gas inlet 212 and has an opening 213 formed on one surface so that the gas injection hole portion 221 of the gas injection portion 220 described later can be exposed through the opening 213 of the cavity 211 . Therefore, the gas supplied from the supply line can flow to the gas injection part 220 through the gas inflow port 212 formed in the cavity 211 of the housing 210, thereby injecting the gas through the gas injection hole part 221.

This gas inlet 212 can be arranged at various positions of the housing 210 .

For example, as shown in FIG. 2 , the gas inlet 212 may be disposed at the upper center portion of the housing 210 . Therefore, the gas supplied from the supply line flows to both sides of the gas injection part 220 arranged in the cavity 211 through the gas inlet 212 of the housing 210, and can be injected through the gas injection hole part 221 provided in the gas injection part 220 gas, thus helping to reduce the overall flow deviation of the gas injection part 220.

The gas injection unit 220 is arranged in the cavity 211 of the housing 210 and is configured to be changeable into various arrangement positions relative to the cavity 211 . This gas injection part 220 has an internal flow path 222 and a gas injection hole part 221.

The internal flow path 222 of the gas injection part 220 is connected to the gas inflow port 212 of the housing 210 and is connected to the gas injection hole part 221.

The gas injection hole portion 221 may be composed of a plurality of mutually different gas injection hole portions. In other words, the gas injection hole part 221 may be composed of a plurality of mutually different gas injection holes arranged toward the opening 213 of the cavity 211 to inject gas according to the arrangement position of the gas injection part 220 relative to the cavity 211 of the housing 210 Department composition.

Here, the gas injection part is configured to be changeable into a plurality of configuration positions relative to the cavity of the housing. This means that the gas injection part can be located in a variety of configuration positions relative to the cavity of the housing, and in each configuration position, the gas injection part The gas injection hole portion is provided as an opening toward the cavity so that gas can be injected. When the position of the gas injection portion is changed, the position of the gas injection hole portion is changed within the cavity of the housing. Alternatively, the gas injection hole portion can be configured to change the position of the gas injection hole portion in the cavity of the housing. The present invention has no particular limitation on the configuration of being detachably arranged in the cavity of the housing and then reinstalling it into the cavity after the position is changed outside the cavity of the housing.

For example, as shown in the figure, in the present invention, a structure in which the gas injection part 220 is detachably installed in the cavity 211 of the housing 210 is specifically described.

In this case, the coupling structure between the gas injection part 220 and the housing is not particularly limited, and various coupling structures such as bolt coupling and fitting coupling may be applied.

Further, the gas injection part 220 may include a plurality of gas injection walls 223. Each gas injection wall 223 may be provided with a connection flow path 224 that connects the gas inlet 212 and the internal flow path 222 . The plurality of gas injection walls 223 may be provided with mutually different gas injection hole portions 221 . Each gas injection hole portion 221 may include a plurality of gas injection holes 225 arranged at the same hole diameter and at predetermined intervals. Therefore, uniform flow rate and flow rate can be effectively ensured during the injection process of gas.

For example, the gas injection hole portion 221 includes four gas injection hole groups, and the four gas injection hole groups are formed such that a plurality of injection holes are spaced apart along the extending direction of the gas injection portion.

Furthermore, the plurality of mutually different gas injection hole portions 221 may be configured such that the hole shapes, hole diameters, and holes of the gas injection holes 225 of the plurality of gas injection hole portions 221 are located on the same gas injection wall 223 and adjacent to each other. At least one of the intervals between the gas injection holes 225 is different from each other. Here, the interval between the adjacent gas injection holes 225 refers to the interval between the centers of the adjacent gas injection holes 225 .

However, the present invention is not limited to this. Furthermore, in addition to the hole shape and hole diameter of the gas injection holes, and the spacing between the gas injection holes located on the same gas injection wall and adjacent to each other, it is natural that the plurality of injection hole portions are different from each other. Various other elements such as the injection angle of the gas injection holes arranged in the gas injection wall, the linear shape of the holes in the injection direction, the curved shape, and the shape of the holes may be configured differently as necessary.

The outer contour cross-sectional shape of the gas injection part 220 may be formed into a polygonal shape. In this case, each gas injection wall 223 is defined by each side wall of the gas injection portion 220 . Accordingly, the cavity 211 of the housing 210 may be formed into a shape corresponding to the outer contour cross-sectional shape of the gas injection part 220 . In other words, the cavity 211 of the housing 210 may be formed with the opening 213 formed on one surface and connected with other gas injection walls of the plurality of gas injection walls 223 except for the gas injection wall corresponding to the opening 213. The corresponding shape of the outer surface.

For example, referring to FIGS. 3 to 6 b , the gas injection part 220 may be formed in a square shape. Specifically, the outer contour cross-sectional shape of the gas injection part 220 is formed into a square shape, and a connection flow path 224 connecting the gas inlet 212 and the internal flow path 222 may be disposed on each gas injection wall 223 . The cavity 211 of the housing 210 may be formed in a rectangular shape with the opening 213 formed on one surface and corresponding to the outer surfaces of the three gas injection walls 223 of the gas injection part 220 . Therefore, in each configuration position relative to the cavity 211 of the housing 210, one of the four gas injection walls 223 is configured towards the opening 213 of the cavity 211, and the other three gas injection walls 223 can be in close proximity to the cavity The inner wall surface of body 211.

To illustrate specifically, the outer contour cross-sectional shape of the gas injection part 220 is formed into a square shape, and may include four gas injection walls 223 defined by four respective side walls and connected to each other, the four gas injection walls 223 including the first gas injection wall 223a, the second gas injection wall 223b, the third gas injection wall 223c and the fourth gas injection wall 223d. Here, for convenience of explanation, as shown in the figure, the first gas injection wall 223a, the second gas injection wall 223b, the third gas injection wall 223c and the fourth gas injection wall 223d may be respectively defined as a front side wall, a bottom side wall, and a rear side wall. and upper side walls, but is not limited thereto.

The first injection wall 223 a may be provided with a first gas injection hole portion 221 a and a first connection flow path 224 a connecting the gas inlet 212 of the housing 210 and the internal flow path 222 of the gas injection portion 220 . The first gas injection hole portion 221a may include a plurality of first gas injection holes 225a having a first hole diameter and arranged at a first interval. Figure 6a shows that in the first configuration position P1, the gas injection part 220 is positioned in the cavity of the housing such that the first gas injection hole part 221a of the first injection wall 223a faces the opening of the cavity 211 of the housing 210 At 213 , the first injection wall 223 a of the gas injection part 220 is viewed from the front.

The second injection wall 223b connected to the first injection wall 223a may be provided with a second gas injection hole portion 221b and a second connection flow path 224b connecting the gas inlet 212 of the housing 210 and the internal flow path 222 of the gas injection portion 220 . The second gas injection hole portion 221b may include a plurality of second gas injection holes 225b having a second hole diameter and arranged at the same first interval as an interval between adjacent first gas injection holes 225a. Here, the second hole diameter of the second gas injection hole 225b may be smaller than the first hole diameter of the first gas injection hole 225a. FIG. 6b shows that in the second configuration position P2, the gas injection part 220 is positioned in the cavity 211 of the housing 210 so that the second gas injection hole part 221b of the second injection wall 223b faces the cavity of the housing 210. 211, the second injection wall 223b of the gas injection part 220 is viewed from the front.

The third injection wall 223c connected to the second injection wall 223b opposite the first injection wall 223a may be provided with a third gas injection hole portion 221c and an internal flow path connecting the gas inlet 212 of the housing 210 and the gas injection portion 220 The third connecting flow path 224c of 222. The third gas injection hole portion 221c may include a plurality of third gas injection holes 225c having the same first hole diameter as that of the first gas injection hole 225a and arranged at a second interval. Here, the second interval between the third gas injection holes 225c may be smaller than the first interval between the first gas injection holes 225a.

The fourth injection wall 223d connected between the first injection wall 223a and the third injection wall 223c opposite to the second injection wall 223b may be provided with a fourth gas injection hole portion 221d and a gas inflow port 212 connecting the housing 210 and The fourth connection flow path 224d of the internal flow path 222 of the gas injection part 220. The fourth gas injection hole portion 221d may include a plurality of third gas injection holes having the same second hole diameter as that of the second gas injection hole 225b and arranged at the same second interval as the interval between adjacent third gas injection holes 225c. Four gas injection holes 225d.

Here, specifically, the operation process of the gas injection unit of the present invention is explained with reference to FIG. 7 . 7 is a diagram illustrating a structure of a gas injection portion of the gas injection unit in which other gas injection hole portions other than the gas injection hole portion facing the opening are omitted in the gas injection unit according to one embodiment of the present invention.

As shown in FIG. 7 , when the first injection hole portion 221 a provided in the first injection wall 223 a of the gas injection portion 220 is to be used, the gas injection portion 220 is installed into the cavity 211 of the housing 210 and positioned so that The first injection hole portion 221a provided in the first injection wall 223a of the gas injection portion 220 faces the opening 213 of the cavity 211 of the housing 210. In this case, the fourth connection flow path 224d of the fourth injection wall 223d is connected to the gas inlet 212 of the housing 210, and the first to third connection flow paths can be sealed by the inner wall surface of the cavity 211. In addition, here, the first connection flow path provided in the first injection wall 223a may be sealed by other members, for example, it may be sealed by a cover body described below. According to this configuration, the gas supplied from the supply line flows to the internal flow path 222 of the gas injection part 220 through the gas inlet 212 formed in the cavity 211 of the housing 210 and the fourth connection flow path 224d, so that the first gas can pass through The plurality of first gas injection holes 225a of the injection hole portion 221a inject gas.

Therefore, when the gas injection hole part 221 of the gas injection part 220 required for the substrate processing process is to be used, the gas injection part 220 is detached from the cavity 211 of the housing 210, and then the gas injection hole part 221a and the second gas injection hole part 221 are removed. A desired gas injection hole portion is selected from the gas injection hole portion 221b, the third gas injection hole portion 221c, and the fourth gas injection hole portion 221d, is installed in the cavity 211 of the housing 210, and is positioned so that the gas injection hole portion faces The opening 213 of the cavity 211 of the housing 210 allows the substrate to be dried or cleaned.

The structure of the gas injection hole portions arranged in the first gas injection wall to the fourth gas injection wall has been specifically described above, but this is only an example provided for easy understanding of the present invention. The present invention is not limited to this, and can be implemented in various forms. The structure of the gas injection hole is realized in the form.

On the other hand, the gas injection unit 200 of the present invention may further include a cover 230 .

Such a cover 230 may be coupled to the opening 213 of the cavity 211 of the housing 210 . This cover 230 may be coupled to the opening 213 of the cavity 211 of the housing 210 in a detachable or openable and closable manner, so as to detach the gas injection part 220 from the cavity 211 of the housing 210 . In addition, the cover 230 may be formed with an outlet 231 exposing the gas injection hole portion 221 of the gas injection portion 220 . When the gas inlet 212 is disposed at the upper center portion of the housing 210, the outlet 231 may be formed into two outlets 231 connected to the gas injection portion 220 of the gas inlet 212. The connecting flow path 224 is formed to be spaced apart on the left and right sides in the center, and a plurality of gas injection holes 225 arranged on the left and right sides are respectively exposed.

Furthermore, when the gas injection part 220 is formed with a plurality of connection flow paths 224 connecting the gas inlet 212 and the internal flow path 222 , the cover 230 may be configured with a plurality of connection flow paths 224 inserted into the plurality of connection flow paths 224 . A sealing protrusion 232 is provided in the connection flow path 224 of the opening 213 of the cavity 211 of the housing 210 for sealing. Therefore, the gas injection part 220 can be firmly positioned between the housing 210 and the cover 230 , so that the gas injection operation can be stably realized by the gas injection part 220 .

Here, the cover 230 is described as being coupled to the opening 213 of the cavity 211 of the housing 210, but the present invention is not limited thereto. As other embodiments, the cover may also be coupled to the gas injection part.

8a and 8b are views analyzing the gas flow rate during the process of injecting gas to a substrate by a conventional gas injection unit having an integrally formed slit-shaped gas injection port and the gas injection unit of the present invention, respectively.

As shown in FIGS. 8a and 8b , it can be seen that the gas injection unit 400 having the conventional slit-shaped gas injection port and the gas injection unit 200 having the gas injection hole portion of the present invention are respectively used, and the dust-free air is passed through the gas injection unit 400 . The controller (dust free controller) E injects the gas at the same flow rate to the substrate S while sucking the gas. As a result, the gas injection unit 400 having the conventional slit-shaped gas injection port shown in FIG. 8a injects the gas. Compared with the motion amount transmission effect of the gas, the motion amount transmission effect of the gas injected through the gas injection unit 200 having the gas injection hole portion of the present invention shown in FIG. 8b is increased.

9a and 9b are diagrams illustrating the analysis of gas pressure in the process of injecting gas to a substrate by a conventional gas injection unit having an integrally formed slit-shaped injection port and a gas injection unit of the present invention, respectively.

As shown in FIGS. 8a and 8b , it can be seen that the gas injection unit 400 having the conventional slit-shaped gas injection port and the gas injection unit 200 having the gas injection hole portion of the present invention are respectively used, and the dust-free air is passed through the gas injection unit 400 . The controller E injects the gas to the substrate S at the same flow rate while inhaling the gas. As a result, the motion amount of the gas injected through the gas injection unit 400 having the conventional slit-shaped gas injection port shown in FIG. 9a is transmitted. Reduced, it is more affected by the surrounding air flow, so the cleaning area is reduced when the substrate S is cleaned with particles. On the contrary, the gas injected through the gas injection unit 200 having the gas injection hole portion of the present invention shown in FIG. 9b The motion transfer effect is increased, so it is almost not affected by the surrounding air flow, so the cleaning area is significantly increased.

As mentioned above, the structure of the gas injection unit of the present invention can increase the movement amount transmission effect of the gas through the structure of the gas injection hole portion compared with the existing slit-shaped gas injection structure, and when used in the cleaning process , can increase the cleaning area, thereby helping to reduce the overall flow rate deviation of the gas injection part. Furthermore, since there are multiple types of gas injection holes, there is no need to adapt to the slit-shaped injection structure used in the past for adjusting the gap interval. The independent regulating device can be made into a simple structure, and the desired gas injection hole can be selected as needed, so that the gas flow rate and flow rate can be adjusted.

In addition to the square shape, the outer contour cross-sectional shape of such a gas injection part may also be a polygonal shape such as a triangle, a pentagon, or a hexagon. However, it is not limited thereto. In addition to the polygonal shape, the gas injection part may also be formed in a polygonal shape. Various shapes, for example, the outer contour cross-sectional shape of the gas injection part may be formed into a circular shape. In this case, the gas injection hole portions may be formed at predetermined intervals in the circumferential direction along the circular outer contour surface. According to this configuration, when a desired gas injection hole portion is to be selected, the gas injection portion can be rotated within the cavity of the housing to change position and be positioned toward the opening of the cavity of the housing without disassembly. In addition, for another example, the outer contour cross-sectional shape of the gas injection part may be a shape that is symmetrical about the center, such as a curved shape, a spline shape, etc. In this case, in order to achieve easy detachment of the gas injection part relative to the cavity of the housing, a detachment port may be formed at one end of the cavity of the housing. Therefore, when the arrangement position of the gas injection part is to be changed, the gas injection part can be disassembled from one end of the cavity of the casing, and then the desired gas injection hole part is selected and installed into the cavity of the casing so that the gas injection part is The gas injection hole portion faces the opening.

The structure in which the gas inlet of the casing is disposed in the upper center portion of the casing has been specifically described above. However, the present invention is not limited to this, as long as it is a structure that can cause the gas to flow into the internal flow path of the gas injection part and minimize the flow velocity deviation. , it can be configured at an appropriate location on the housing.

Here, the flow rate deviation of the gas can be minimized not only by changing the arrangement position of the gas inlet of the housing, but also by setting the size of the apertures of the plurality of gas injection holes provided in the gas injection hole portion of the gas injection portion to have a fine diameter. The difference in gas flow rate can also be minimized by finely adjusting the spacing between adjacent gas injection holes formed in the same gas injection hole portion.

For example, another example of a structure in which the gas inlets of the housing are arranged at both ends of the cavity of the housing will be described below.

Fig. 10 is a front view of a gas injection unit according to another embodiment of the present invention.

In this embodiment, except for the arrangement position of the gas inlet and the connection flow path, which are different from the above-mentioned embodiment, the configuration applied to the above-mentioned embodiment can be equally applied to this embodiment, and repeated description will be omitted here.

Referring to FIG. 10 , the gas inflow ports 212 a of the housing 210 may be disposed at both ends of the housing 210 .

In this case, the connection flow path 224 that connects the gas inlet 212 of the housing 210 and the internal flow path 222 of the gas injection part 220 described in the above embodiment may be omitted. That is, the gas injection part 220 is configured such that the internal flow paths 222 penetrate both ends of the gas injection part 220 and can be directly connected to the gas inflow ports 212 a provided at both ends of the housing 210 without the need for separate connecting flow paths.

As mentioned above, as an embodiment in which the gas injection part 220 is configured to be changeable into various arrangement positions within the cavity 211 of the housing 210 , the gas injection part 220 having a polygonal outer contour cross-sectional shape that is detachably arranged is taken as an example. However, the present invention is not limited thereto. As long as the gas injection part 220 can be changed into various arrangement positions in the cavity 211 of the housing 210, it may be configured in various forms. For example, the outer contour cross-sectional shape of the gas injection part may be formed in a circular shape, and the cavity of the housing housing the gas injection part may have a circular cross-sectional shape corresponding to the outer contour cross-sectional shape of the gas injection part. In this case, the gas injection part is arranged to be rotated in the cavity by driving means such as a motor, and the configuration position relative to the cavity can be changed by the rotation operation without being disassembled from the cavity of the housing, so it is possible to choose The gas injection hole portion of the required gas injection portion is positioned so that the gas injection hole portion faces the opening of the housing.

In addition, in the present invention, the structure in which one gas injection hole is arranged for each gas injection wall (side wall) of the gas injection part 220 has been specifically described. However, the invention is not limited to this. If necessary, the gas injection hole may be provided in the gas injection part 220 . Each gas injection wall (side wall) of 220 is arranged with multiple rows of gas injection holes. In this case, the plurality of rows of gas injection hole portions arranged on each gas injection wall (side wall) may be formed in various forms, and the injection angles of the gas injection hole portions in each row may be set to be different as necessary.

In addition, in the above description, the structure of the conveying unit including the rotating shaft and the roller arranged on the rotating shaft in the substrate processing apparatus has been described as an embodiment. However, the conveying unit of the present invention is not limited to this structure. As long as the conveying unit is executed Of course, the functional configuration of the substrate can also be implemented in various forms.

As mentioned above, although the present invention has been described through limited embodiments and drawings, the present invention is not limited thereto. Within the scope of equivalence between the technical idea of the present invention and the patent application scope described below, it is common knowledge in the technical field to which the invention belongs. Of course, various modifications and transformations can be made.

10:Substrate processing device 100: Process chamber 110:Move-in entrance 120:Move out 130: Drainage port 200:Gas injection unit 210: Shell 211:Cavity 212, 212a: gas inlet 213:Open your mouth 220:Gas injection part 221: Gas injection hole part 221a: First gas injection hole part 221b: Second gas injection hole part 221c: Third gas injection hole part 221d: The fourth gas injection hole part 222: Internal flow path 223:Gas jet wall 223a: First gas injection wall 223b: Second gas injection wall 223c: Third gas injection wall 223d: The fourth gas injection wall 224:Connect flow path 224a: First connection flow path 224b: Second connection flow path 224c: Third connection flow path 224d: Fourth connection flow path 225: Gas injection hole 225a: First gas injection hole 225b: Second gas injection hole 225c: The third gas injection hole 225d: The fourth gas injection hole 230: Cover 231: spit out 232:Sealing bump 300:Conveying unit 310:Rotation axis 320: Roller parts S:Substrate P1: first configuration position P2: Second configuration position

[Fig. 1a] and [Fig. 1b] are exemplary diagrams respectively showing substrate processing apparatuses according to different embodiments of the present invention. [Fig. 2] is an exploded view of a gas injection unit according to an embodiment of the present invention. [Fig. 3] is an exploded view of the gas injection unit viewed from the side of Fig. 2. [Fig. [Fig. 4] is a front view of the gas injection unit according to one embodiment of the present invention. [Fig. 5a] and [Fig. 5b] are cross-sectional views taken along line AA' and line BB' of Fig. 4, respectively. [Fig. 6a] and [Fig. 6b] are diagrams showing two adjacent gas injection walls in the gas injection part of the gas injection unit according to an embodiment of the present invention. 7 is a diagram illustrating a structure of a gas injection portion of the gas injection unit in which other gas injection hole portions except for the gas injection hole portion facing the opening are omitted in the gas injection unit according to one embodiment of the present invention. 8a and 8b are views analyzing the gas flow rate in the process of injecting gas to a substrate by a conventional gas injection unit having an integrally formed slit-shaped gas injection port and a gas injection unit of the present invention, respectively. [Fig. 9a] and [Fig. 9b] are diagrams illustrating the analysis of gas pressure in the process of injecting gas to a substrate by a conventional gas injection unit having an integrated slit-shaped gas injection port and a gas injection unit of the present invention, respectively. [Fig. 10] is a front view of a gas injection unit according to another embodiment of the present invention.

200:Gas injection unit

210: Shell

211:Cavity

212:Gas inlet

213:Open your mouth

220:Gas injection part

221: Gas injection hole part

222: Internal flow path

223:Gas jet wall

224:Connect flow path

225: Gas injection hole

230: Cover

231: spit out

232:Sealing bump

Claims (20)

A gas injection unit including: A housing including a gas inlet and a cavity, the cavity being connected to the gas inlet and having an opening formed on one surface; and A gas injection part is arranged in the cavity, is configured to change into a plurality of configuration positions relative to the cavity, and has an internal flow path and a plurality of mutually different gas injection hole parts, the internal flow path is connected to the gas flow Inlet, the gas injection hole portions are connected to the internal flow path, and are configured to inject gas toward the opening according to the arrangement position. The gas injection unit of claim 1, wherein the gas injection part is detachably installed in the cavity. The gas injection unit according to claim 1, wherein the gas injection part includes a plurality of gas injection walls, and mutually different gas injection hole parts are arranged on the gas injection walls. The gas injection unit of claim 3, wherein the outer contour cross-sectional shape of the gas injection part is formed into a polygonal shape, each gas injection wall is defined by each side wall of the gas injection part, and the cavity is formed to be in line with the gas injection part. The shape corresponds to the cross-sectional shape of the outer contour of the part. The gas injection unit according to claim 4, wherein each gas injection wall is provided with a connecting flow path connecting the gas inlet and the internal flow path. The gas injection unit according to claim 4, wherein the outer contour cross-sectional shape of the gas injection part is formed in a square shape, and a connecting flow path connecting the gas inlet and the internal flow path is arranged on each gas injection wall. , the cavity is formed with the opening on one surface, and is formed into a rectangular shape corresponding to the outer surfaces of at least three gas injection walls of the gas injection part. In this configuration position, one of the gas injection walls is configured to Toward the opening, three other gas injection walls are in close contact with the inner wall of the cavity. The gas injection unit of claim 1, wherein the gas inlet is disposed at the upper center portion of the housing. The gas injection unit according to claim 1, wherein the gas inlets are respectively arranged at both ends of the housing. The gas injection unit according to claim 1, further comprising: a cover coupled to the opening and formed with an outlet exposing the gas injection hole. The gas injection unit according to claim 9, wherein the gas injection part is formed with a plurality of connection flow paths connecting the gas inlet and the internal flow path, and the cover is disposed with a plurality of connection flow paths inserted into the connection flow paths and facing The opening is connected to a sealing protrusion in the flow path for sealing. The gas injection unit according to any one of claims 1 to 10, wherein each gas injection hole portion includes a plurality of gas injection holes respectively arranged with the same hole diameter and prescribed intervals. The gas injection unit according to claim 11, wherein the gas injection hole portions are configured such that the gas injection hole has a hole shape, a hole diameter, and a gap between adjacent gas injection holes on the same gas injection wall. of at least one different from each other. A gas injection unit including: A housing including a gas inlet and a cavity, the cavity is connected to the gas inlet and has an opening formed on one surface; A gas injection part is configured in the cavity, is detachably configured in a variety of configuration positions relative to the cavity, and has an outer contour cross-sectional shape formed into a rectangular shape; and a cover covering the opening and forming an outlet exposing a gas injection hole portion of the gas injection portion, The gas injection part includes: an internal flow path connected to the gas inlet; four gas injection walls defined by each side wall of the gas injection part; a plurality of gas injection hole parts different from each other, including connected to the gas inlet. The internal flow path and a plurality of gas injection holes arranged at predetermined intervals in each of the gas injection walls are arranged toward the opening according to the arrangement position to inject gas. The gas injection unit according to claim 13, wherein each gas injection wall is provided with a connecting flow path connecting the gas inlet and the internal flow path, the cavity is formed with the opening on one surface, and is formed It is a rectangular shape corresponding to the outer surfaces of at least three gas injection walls of the gas injection part. In this arrangement position, one of the gas injection walls is arranged toward the opening, and the other three gas injection walls are in close contact with the opening. The inner wall of the cavity. The gas injection unit of claim 14, wherein the cover is provided with a sealing protrusion inserted into the connecting flow path toward the opening among the connecting flow paths for sealing. The gas injection unit of claim 13, wherein the gas inlet is formed in the upper center portion of the housing. The gas injection unit according to claim 13, wherein the plurality of gas injection hole portions arranged on the gas injection walls are configured such that the hole shape, hole diameter, and the number of holes located on the same gas injection wall and adjacent to each other are At least one of the intervals between the gas injection holes is different from each other. A substrate processing device including: a process chamber configured with a transport unit that transports a substrate; and A gas injection unit is configured in the process chamber and injects gas to the substrate, The gas injection unit includes: A housing including a gas inlet and a cavity, the cavity being connected to the gas inlet and having an opening formed on one surface; and A gas injection part is arranged in the cavity, is configured to change into a plurality of configuration positions relative to the cavity, and has an internal flow path and a plurality of mutually different gas injection hole parts, the internal flow path is connected to the gas flow Inlet, the gas injection hole portions are connected to the internal flow path, and are configured to inject gas toward the opening according to the arrangement position. The substrate processing apparatus according to claim 18, wherein the gas injection part includes a plurality of gas injection walls, and the gas injection hole parts that are different from each other are arranged on the gas injection walls. The substrate processing apparatus according to claim 19, wherein the gas injection hole portion arranged in each gas injection wall includes a plurality of gas injection holes arranged with the same hole diameter and at predetermined intervals, and the gas injection hole portions are configured as, At least one of the hole shape, the hole diameter, and the spacing between the gas injection holes located on the same gas injection wall and adjacent to each other are different from each other.