CN117024917A - 复合物、成型体及固化物 - Google Patents
复合物、成型体及固化物 Download PDFInfo
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- CN117024917A CN117024917A CN202311130493.6A CN202311130493A CN117024917A CN 117024917 A CN117024917 A CN 117024917A CN 202311130493 A CN202311130493 A CN 202311130493A CN 117024917 A CN117024917 A CN 117024917A
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- composite
- mass
- epoxy resin
- metal
- resin
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
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- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
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- 230000001590 oxidative effect Effects 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
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- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- AKLJIUURIIIOLU-UHFFFAOYSA-N silane 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound [SiH4].CO[Si](OC)(OC)CCCOC(=O)C(C)=C AKLJIUURIIIOLU-UHFFFAOYSA-N 0.000 description 1
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- 239000010703 silicon Substances 0.000 description 1
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- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
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- 125000001424 substituent group Chemical group 0.000 description 1
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- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
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- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZYMHKOVQDOFPHH-UHFFFAOYSA-N trimethoxy(oct-1-enyl)silane Chemical compound CCCCCCC=C[Si](OC)(OC)OC ZYMHKOVQDOFPHH-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- QYJYJTDXBIYRHH-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound C(C1CO1)OCCCCCCCC[Si](OC)(OC)OC QYJYJTDXBIYRHH-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- C—CHEMISTRY; METALLURGY
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- C08K5/00—Use of organic ingredients
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- C08K5/098—Metal salts of carboxylic acids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
- H01F1/153—Amorphous metallic alloys, e.g. glassy metals
- H01F1/15358—Making agglomerates therefrom, e.g. by pressing
- H01F1/15366—Making agglomerates therefrom, e.g. by pressing using a binder
- H01F1/15375—Making agglomerates therefrom, e.g. by pressing using a binder using polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
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| JP3651018B2 (ja) | 1994-05-18 | 2005-05-25 | 日立化成工業株式会社 | 金型表面離型処理用樹脂組成物及び該組成物を用いた金型表面の離型処理法並びに該組成物で離型処理した金型を用いた熱硬化性樹脂成形品の成形方法 |
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| JP2002260909A (ja) | 2001-02-28 | 2002-09-13 | Matsushita Electric Ind Co Ltd | 複合磁性材料 |
| GB2419884B (en) * | 2003-08-26 | 2008-03-12 | Mitsubishi Rayon Co | Thermoplastic resin composition for light reflector,molded article for light reflector,light reflector & method for producing molded article. |
| EP2051330A4 (en) * | 2006-08-11 | 2011-04-27 | Mitsui Chemicals Inc | ANTENNA CORE AND ANTENNA |
| JP5242555B2 (ja) | 2007-03-30 | 2013-07-24 | 日本カーバイド工業株式会社 | 金型離型回復用樹脂組成物及び金型離型回復方法 |
| JP5417074B2 (ja) * | 2009-07-23 | 2014-02-12 | 日立粉末冶金株式会社 | 圧粉磁心及びその製造方法 |
| JP6159512B2 (ja) | 2012-07-04 | 2017-07-05 | 太陽誘電株式会社 | インダクタ |
| CN103666364B (zh) | 2012-09-13 | 2015-09-16 | 东睦新材料集团股份有限公司 | 金属软磁复合材料用有机绝缘粘结剂及制备金属软磁复合材料方法 |
| JP6456836B2 (ja) | 2013-10-16 | 2019-01-23 | 日本化薬株式会社 | 硬化性樹脂組成物およびその硬化物 |
| EP3131100A4 (en) | 2014-03-25 | 2018-04-18 | NTN Corporation | Magnetic core component, magnetic element, and production method for magnetic core component |
| JP6812091B2 (ja) * | 2014-05-29 | 2021-01-13 | 日東電工株式会社 | 軟磁性樹脂組成物および軟磁性フィルム |
| WO2017111115A1 (ja) * | 2015-12-24 | 2017-06-29 | 株式会社カネカ | 樹脂組成物およびそれを用いた半硬化性熱伝導フィルムおよび回路基板および接着シート |
| JP6926421B2 (ja) | 2016-09-08 | 2021-08-25 | スミダコーポレーション株式会社 | 複合磁性材料、その複合磁性材料を熱硬化して得られる複合磁性成形体、その複合磁性成形体を用いて得られる電子部品、およびそれらの製造方法 |
| TWI852242B (zh) | 2017-06-29 | 2024-08-11 | 日商力森諾科股份有限公司 | 密封用樹脂組成物、再配置晶圓、半導體封裝及半導體封裝的製造方法 |
| JP6907842B2 (ja) | 2017-09-11 | 2021-07-21 | 昭和電工マテリアルズ株式会社 | コンパウンド、硬化物、及びボンド磁石 |
| CN111094450A (zh) | 2017-09-15 | 2020-05-01 | 日立化成株式会社 | 环氧树脂组合物和电子部件装置 |
| JP7511322B2 (ja) | 2017-10-20 | 2024-07-05 | 住友ベークライト株式会社 | 磁性コア形成用樹脂組成物および構造体 |
| WO2019106813A1 (ja) | 2017-11-30 | 2019-06-06 | 日立化成株式会社 | コンパウンド及びタブレット |
| CN108057878B (zh) | 2017-12-19 | 2020-01-31 | 浙江大学 | 一种双壳层软磁复合材料的制备方法 |
| WO2019229961A1 (ja) | 2018-05-31 | 2019-12-05 | 日立化成株式会社 | コンパウンド、成形体、及び電子部品 |
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| EP3960801A4 (en) | 2022-07-20 |
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