CN116964172A - 粘接片 - Google Patents

粘接片 Download PDF

Info

Publication number
CN116964172A
CN116964172A CN202180094068.9A CN202180094068A CN116964172A CN 116964172 A CN116964172 A CN 116964172A CN 202180094068 A CN202180094068 A CN 202180094068A CN 116964172 A CN116964172 A CN 116964172A
Authority
CN
China
Prior art keywords
adhesive
adhesive layer
region
adhesive sheet
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180094068.9A
Other languages
English (en)
Chinese (zh)
Inventor
荻野昇平
石川和树
岩上祐树
土屋靖史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teraoka Seisakusho Co Ltd
Original Assignee
Teraoka Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teraoka Seisakusho Co Ltd filed Critical Teraoka Seisakusho Co Ltd
Publication of CN116964172A publication Critical patent/CN116964172A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202180094068.9A 2021-02-19 2021-02-19 粘接片 Pending CN116964172A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/006368 WO2022176161A1 (ja) 2021-02-19 2021-02-19 接着シート

Publications (1)

Publication Number Publication Date
CN116964172A true CN116964172A (zh) 2023-10-27

Family

ID=82930449

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180094068.9A Pending CN116964172A (zh) 2021-02-19 2021-02-19 粘接片

Country Status (6)

Country Link
US (1) US12565606B2 (https=)
EP (1) EP4296331A4 (https=)
JP (1) JP7634074B2 (https=)
CN (1) CN116964172A (https=)
TW (1) TWI834120B (https=)
WO (1) WO2022176161A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025027175A (ja) * 2023-08-14 2025-02-27 Ｊｆｅスチール株式会社 接着継手構造および接着継手構造部品

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314888A (ja) 1989-06-13 1991-01-23 Nichiban Co Ltd 熱硬化型シート状粘接着体
US5585178A (en) * 1991-12-31 1996-12-17 Minnesota Mining & Manufacturing Company Composite adhesive tape
EP0665782B1 (en) * 1992-10-20 2000-03-22 Avery Dennison Corporation Pressure-sensitive structural adhesive
US6565969B1 (en) 1999-10-21 2003-05-20 3M Innovative Properties Company Adhesive article
JP3696131B2 (ja) * 2001-07-10 2005-09-14 株式会社東芝 アクティブマトリクス基板及びその製造方法
EP1557449A1 (en) 2004-01-22 2005-07-27 3M Innovative Properties Company Adhesive tape for structural bonding
JP2008266456A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 熱剥離型両面粘着シート
JP2012186315A (ja) * 2011-03-04 2012-09-27 Nitto Denko Corp 薄膜基板の製造方法
JP2012193317A (ja) * 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
US8618348B2 (en) * 2011-09-28 2013-12-31 Johnson & Johnson Consumer Companies, Inc. Dressings with a foamed adhesive layer
CN105555892A (zh) 2013-09-23 2016-05-04 路博润先进材料公司 组合热熔粘合剂和压敏性粘合剂体系和由其制得的复合材料
JP6584284B2 (ja) 2014-10-23 2019-10-02 ソマール株式会社 接着シート
JP6326147B2 (ja) * 2014-11-11 2018-05-16 株式会社寺岡製作所 発泡樹脂基材を有する粘着テープ及びその製造方法
KR101771884B1 (ko) 2015-04-10 2017-08-25 가부시키가이샤 데라오카 세이사쿠쇼 접착 시트
JP2017005160A (ja) 2015-06-12 2017-01-05 古河電気工業株式会社 ウエハ加工用テープ
JP2017203114A (ja) 2016-05-12 2017-11-16 スリーエム イノベイティブ プロパティズ カンパニー 接着剤、金属部材組立体及び金属部材組立体の製造方法
WO2021193850A1 (ja) * 2020-03-25 2021-09-30 大日本印刷株式会社 発泡性接着シートおよび物品の製造方法

Also Published As

Publication number Publication date
US20240228844A9 (en) 2024-07-11
EP4296331A4 (en) 2024-03-20
US12565606B2 (en) 2026-03-03
JPWO2022176161A1 (https=) 2022-08-25
EP4296331A1 (en) 2023-12-27
JP7634074B2 (ja) 2025-02-20
TWI834120B (zh) 2024-03-01
US20240132761A1 (en) 2024-04-25
WO2022176161A1 (ja) 2022-08-25
TW202239914A (zh) 2022-10-16

Similar Documents

Publication Publication Date Title
TWI835721B (zh) 黏著片
KR102309944B1 (ko) 휴대형 전자 기기용 점착 시트
KR101824852B1 (ko) 점착 시트
EP2048213B1 (en) Solid type rubber-based pressue sensitive adhesive composition and pressue-sensitive adhesive sheet thereof
CN113597458B (zh) 热剥离型粘着胶带
CN107109148A (zh) 具有发泡树脂基材的粘着带及其制造方法
JP7094148B2 (ja) 粘着テープ
EP3783077A1 (en) Pressure-sensitive adhesive tape
KR101880682B1 (ko) 열 가역성 점착 조성물 및 이를 포함하는 열변형 점착 테이프
JP2017057295A (ja) ガラス研磨材用両面粘着テープ
JP2011044444A (ja) 多層粘着シート及び多層粘着シートを用いた電子部品の製造方法。
CN116964172A (zh) 粘接片
JP6863375B2 (ja) 離型フィルム
CN115427524B (zh) 双面粘合带
JP2019172744A (ja) 接着構造体の製造方法
CN116745377B (zh) 粘合片
JP7115623B1 (ja) 電子機器部品固定用発泡粘着テープ、および電子機器部品固定用発泡粘着テープを用いた電子機器。
KR20240037255A (ko) 이형 필름 및 반도체 패키지의 제조 방법
JP2024120642A (ja) 両面粘着シート
TW202547979A (zh) 黏著劑組成物及黏著薄片

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination