JPWO2022176161A1 - - Google Patents

Info

Publication number
JPWO2022176161A1
JPWO2022176161A1 JP2023500462A JP2023500462A JPWO2022176161A1 JP WO2022176161 A1 JPWO2022176161 A1 JP WO2022176161A1 JP 2023500462 A JP2023500462 A JP 2023500462A JP 2023500462 A JP2023500462 A JP 2023500462A JP WO2022176161 A1 JPWO2022176161 A1 JP WO2022176161A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023500462A
Other languages
Japanese (ja)
Other versions
JP7634074B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022176161A1 publication Critical patent/JPWO2022176161A1/ja
Application granted granted Critical
Publication of JP7634074B2 publication Critical patent/JP7634074B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023500462A 2021-02-19 2021-02-19 接着シート Active JP7634074B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/006368 WO2022176161A1 (ja) 2021-02-19 2021-02-19 接着シート

Publications (2)

Publication Number Publication Date
JPWO2022176161A1 true JPWO2022176161A1 (https=) 2022-08-25
JP7634074B2 JP7634074B2 (ja) 2025-02-20

Family

ID=82930449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023500462A Active JP7634074B2 (ja) 2021-02-19 2021-02-19 接着シート

Country Status (6)

Country Link
US (1) US12565606B2 (https=)
EP (1) EP4296331A4 (https=)
JP (1) JP7634074B2 (https=)
CN (1) CN116964172A (https=)
TW (1) TWI834120B (https=)
WO (1) WO2022176161A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025027175A (ja) * 2023-08-14 2025-02-27 Ｊｆｅスチール株式会社 接着継手構造および接着継手構造部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314888A (ja) * 1989-06-13 1991-01-23 Nichiban Co Ltd 熱硬化型シート状粘接着体
US5585178A (en) * 1991-12-31 1996-12-17 Minnesota Mining & Manufacturing Company Composite adhesive tape
US5593759A (en) * 1992-10-20 1997-01-14 Avery Dennison Corporation Pressure-sensitive structural adhesive
JP2007518865A (ja) * 2004-01-22 2007-07-12 スリーエム イノベイティブ プロパティズ カンパニー 構造接着用接着テープ
JP2017005160A (ja) * 2015-06-12 2017-01-05 古河電気工業株式会社 ウエハ加工用テープ
JP2017203114A (ja) * 2016-05-12 2017-11-16 スリーエム イノベイティブ プロパティズ カンパニー 接着剤、金属部材組立体及び金属部材組立体の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6565969B1 (en) 1999-10-21 2003-05-20 3M Innovative Properties Company Adhesive article
JP3696131B2 (ja) * 2001-07-10 2005-09-14 株式会社東芝 アクティブマトリクス基板及びその製造方法
JP2008266456A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 熱剥離型両面粘着シート
JP2012186315A (ja) * 2011-03-04 2012-09-27 Nitto Denko Corp 薄膜基板の製造方法
JP2012193317A (ja) * 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
US8618348B2 (en) * 2011-09-28 2013-12-31 Johnson & Johnson Consumer Companies, Inc. Dressings with a foamed adhesive layer
CN105555892A (zh) 2013-09-23 2016-05-04 路博润先进材料公司 组合热熔粘合剂和压敏性粘合剂体系和由其制得的复合材料
JP6584284B2 (ja) 2014-10-23 2019-10-02 ソマール株式会社 接着シート
JP6326147B2 (ja) * 2014-11-11 2018-05-16 株式会社寺岡製作所 発泡樹脂基材を有する粘着テープ及びその製造方法
KR101771884B1 (ko) 2015-04-10 2017-08-25 가부시키가이샤 데라오카 세이사쿠쇼 접착 시트
WO2021193850A1 (ja) * 2020-03-25 2021-09-30 大日本印刷株式会社 発泡性接着シートおよび物品の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314888A (ja) * 1989-06-13 1991-01-23 Nichiban Co Ltd 熱硬化型シート状粘接着体
US5585178A (en) * 1991-12-31 1996-12-17 Minnesota Mining & Manufacturing Company Composite adhesive tape
US5593759A (en) * 1992-10-20 1997-01-14 Avery Dennison Corporation Pressure-sensitive structural adhesive
JP2007518865A (ja) * 2004-01-22 2007-07-12 スリーエム イノベイティブ プロパティズ カンパニー 構造接着用接着テープ
JP2017005160A (ja) * 2015-06-12 2017-01-05 古河電気工業株式会社 ウエハ加工用テープ
JP2017203114A (ja) * 2016-05-12 2017-11-16 スリーエム イノベイティブ プロパティズ カンパニー 接着剤、金属部材組立体及び金属部材組立体の製造方法

Also Published As

Publication number Publication date
US20240228844A9 (en) 2024-07-11
EP4296331A4 (en) 2024-03-20
US12565606B2 (en) 2026-03-03
EP4296331A1 (en) 2023-12-27
JP7634074B2 (ja) 2025-02-20
TWI834120B (zh) 2024-03-01
US20240132761A1 (en) 2024-04-25
WO2022176161A1 (ja) 2022-08-25
TW202239914A (zh) 2022-10-16
CN116964172A (zh) 2023-10-27

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