CN116209791A - 制造配线基板的方法及配线基板 - Google Patents

制造配线基板的方法及配线基板 Download PDF

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Publication number
CN116209791A
CN116209791A CN202180061938.2A CN202180061938A CN116209791A CN 116209791 A CN116209791 A CN 116209791A CN 202180061938 A CN202180061938 A CN 202180061938A CN 116209791 A CN116209791 A CN 116209791A
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CN
China
Prior art keywords
layer
mass
pretreatment liquid
resist layer
metal layer
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Pending
Application number
CN202180061938.2A
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English (en)
Chinese (zh)
Inventor
东之崎庆
岩下健一
小野敬司
成田真生
满仓一行
鸟羽正也
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Resonac Corp
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Resonac Corp
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Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN116209791A publication Critical patent/CN116209791A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202180061938.2A 2020-09-11 2021-09-09 制造配线基板的方法及配线基板 Pending CN116209791A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020153096 2020-09-11
JP2020-153096 2020-09-11
PCT/JP2021/033172 WO2022054873A1 (ja) 2020-09-11 2021-09-09 配線基板を製造する方法、及び配線基板

Publications (1)

Publication Number Publication Date
CN116209791A true CN116209791A (zh) 2023-06-02

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ID=80632152

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180061938.2A Pending CN116209791A (zh) 2020-09-11 2021-09-09 制造配线基板的方法及配线基板

Country Status (6)

Country Link
US (1) US20240015889A1 (https=)
JP (1) JPWO2022054873A1 (https=)
KR (1) KR20230080401A (https=)
CN (1) CN116209791A (https=)
TW (1) TW202218492A (https=)
WO (1) WO2022054873A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034068A1 (ja) * 2022-08-10 2024-02-15 株式会社レゾナック 配線基板を製造する方法、レジスト層又は配線基板を評価する方法、及び配線基板
WO2024185566A1 (ja) * 2023-03-07 2024-09-12 日本発條株式会社 回路パターンの製造方法、回路基板の製造方法、及び回路パターン
JP2024153251A (ja) * 2023-04-17 2024-10-29 コニカミノルタ株式会社 積層体、プリント基板、及びプリント基板の製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit
JP2009242860A (ja) * 2008-03-31 2009-10-22 Ebara-Udylite Co Ltd 酸性銅用前処理剤およびこれを利用するめっき方法
CN102191522A (zh) * 2010-03-02 2011-09-21 上村工业株式会社 电镀预处理剂、用于电镀的预处理方法以及电镀方法
JP2012033642A (ja) * 2010-07-29 2012-02-16 Kyocer Slc Technologies Corp 配線基板の製造方法
JP2014067976A (ja) * 2012-09-27 2014-04-17 Hitachi Chemical Co Ltd 多層配線基板の製造方法
CN104342701A (zh) * 2013-08-01 2015-02-11 三菱瓦斯化学株式会社 印刷电路板的制造方法
JP2015078443A (ja) * 2015-01-14 2015-04-23 上村工業株式会社 電気銅めっき用前処理剤、電気銅めっきの前処理方法及び電気銅めっき方法
CN106462067A (zh) * 2014-05-23 2017-02-22 日立化成株式会社 抗蚀剂图案形成方法、印刷配线板制造方法、投影曝光用感光性树脂组合物及感光性元件
WO2019216012A1 (ja) * 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4269746B2 (ja) 2002-04-02 2009-05-27 凸版印刷株式会社 プリント配線板の製造方法、プリント配線板および半導体パッケージ
JP2009260216A (ja) * 2008-03-19 2009-11-05 Shinko Electric Ind Co Ltd 配線基板の製造方法
KR20130133304A (ko) * 2011-04-08 2013-12-06 다이요 잉키 세이조 가부시키가이샤 감광성 조성물, 그의 경화 피막, 및 그것들을 사용한 프린트 배선판

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit
JP2009242860A (ja) * 2008-03-31 2009-10-22 Ebara-Udylite Co Ltd 酸性銅用前処理剤およびこれを利用するめっき方法
CN102191522A (zh) * 2010-03-02 2011-09-21 上村工业株式会社 电镀预处理剂、用于电镀的预处理方法以及电镀方法
JP2012033642A (ja) * 2010-07-29 2012-02-16 Kyocer Slc Technologies Corp 配線基板の製造方法
JP2014067976A (ja) * 2012-09-27 2014-04-17 Hitachi Chemical Co Ltd 多層配線基板の製造方法
CN104342701A (zh) * 2013-08-01 2015-02-11 三菱瓦斯化学株式会社 印刷电路板的制造方法
CN106462067A (zh) * 2014-05-23 2017-02-22 日立化成株式会社 抗蚀剂图案形成方法、印刷配线板制造方法、投影曝光用感光性树脂组合物及感光性元件
JP2015078443A (ja) * 2015-01-14 2015-04-23 上村工業株式会社 電気銅めっき用前処理剤、電気銅めっきの前処理方法及び電気銅めっき方法
WO2019216012A1 (ja) * 2018-05-11 2019-11-14 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法

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KR20230080401A (ko) 2023-06-07
US20240015889A1 (en) 2024-01-11
WO2022054873A1 (ja) 2022-03-17
TW202218492A (zh) 2022-05-01
JPWO2022054873A1 (https=) 2022-03-17

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