CN116097397A - 工件清洗装置及工件清洗方法以及桨夹具 - Google Patents

工件清洗装置及工件清洗方法以及桨夹具 Download PDF

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Publication number
CN116097397A
CN116097397A CN202180056267.0A CN202180056267A CN116097397A CN 116097397 A CN116097397 A CN 116097397A CN 202180056267 A CN202180056267 A CN 202180056267A CN 116097397 A CN116097397 A CN 116097397A
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CN
China
Prior art keywords
cleaning
workpiece
immersion
paddle
post
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Pending
Application number
CN202180056267.0A
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English (en)
Chinese (zh)
Inventor
大谷义和
富冈恭平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
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Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Publication of CN116097397A publication Critical patent/CN116097397A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN202180056267.0A 2020-09-09 2021-04-19 工件清洗装置及工件清洗方法以及桨夹具 Pending CN116097397A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-151262 2020-09-09
JP2020151262 2020-09-09
PCT/JP2021/015921 WO2022054331A1 (ja) 2020-09-09 2021-04-19 ワーク洗浄装置及びワーク洗浄方法並びにパドル治具

Publications (1)

Publication Number Publication Date
CN116097397A true CN116097397A (zh) 2023-05-09

Family

ID=80631525

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180056267.0A Pending CN116097397A (zh) 2020-09-09 2021-04-19 工件清洗装置及工件清洗方法以及桨夹具

Country Status (4)

Country Link
JP (1) JP7017670B1 (ja)
CN (1) CN116097397A (ja)
TW (1) TW202228191A (ja)
WO (1) WO2022054331A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283394A (ja) * 1992-04-02 1993-10-29 Nippondenso Co Ltd エッチングポット
JPH10107130A (ja) * 1996-09-30 1998-04-24 Kyocera Corp ウエハ保持具
JP2003051484A (ja) * 2001-08-07 2003-02-21 Denso Corp 表面処理装置及び表面処理方法
KR20090018996A (ko) * 2009-01-28 2009-02-24 (주)지원테크 기판 박판화 방법, 기판 박판화 장치 및 이를 포함하는 기판 박판화 시스템
CN104979262A (zh) * 2015-05-14 2015-10-14 浙江中纳晶微电子科技有限公司 一种晶圆分离的方法
JP2016143722A (ja) * 2015-01-30 2016-08-08 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体
JP2017092063A (ja) * 2015-11-02 2017-05-25 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283394A (ja) * 1992-04-02 1993-10-29 Nippondenso Co Ltd エッチングポット
JPH10107130A (ja) * 1996-09-30 1998-04-24 Kyocera Corp ウエハ保持具
JP2003051484A (ja) * 2001-08-07 2003-02-21 Denso Corp 表面処理装置及び表面処理方法
KR20090018996A (ko) * 2009-01-28 2009-02-24 (주)지원테크 기판 박판화 방법, 기판 박판화 장치 및 이를 포함하는 기판 박판화 시스템
JP2016143722A (ja) * 2015-01-30 2016-08-08 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体
CN104979262A (zh) * 2015-05-14 2015-10-14 浙江中纳晶微电子科技有限公司 一种晶圆分离的方法
JP2016219776A (ja) * 2015-05-14 2016-12-22 浙江中▲納▼晶微▲電▼子科技有限公司Ｚｈｅｊｉａｎｇ Ｍｉｃｒｏｔｅｃｈ Ｍａｔｅｒｉａｌ Ｃｏ．， Ｌｔｄ． キャリア−ワークピース接合スタックの分離方法
JP2017092063A (ja) * 2015-11-02 2017-05-25 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体

Also Published As

Publication number Publication date
TW202228191A (zh) 2022-07-16
JP7017670B1 (ja) 2022-02-08
WO2022054331A1 (ja) 2022-03-17
JPWO2022054331A1 (ja) 2022-03-17

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