TW202228191A - 工件洗淨裝置、工件洗淨方法及坑狀治具 - Google Patents

工件洗淨裝置、工件洗淨方法及坑狀治具 Download PDF

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Publication number
TW202228191A
TW202228191A TW110133020A TW110133020A TW202228191A TW 202228191 A TW202228191 A TW 202228191A TW 110133020 A TW110133020 A TW 110133020A TW 110133020 A TW110133020 A TW 110133020A TW 202228191 A TW202228191 A TW 202228191A
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TW
Taiwan
Prior art keywords
cleaning
workpiece
immersion
pit
post
Prior art date
Application number
TW110133020A
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English (en)
Chinese (zh)
Inventor
大谷義和
富岡恭平
Original Assignee
日商信越工程股份有限公司
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Publication date
Application filed by 日商信越工程股份有限公司 filed Critical 日商信越工程股份有限公司
Publication of TW202228191A publication Critical patent/TW202228191A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW110133020A 2020-09-09 2021-09-06 工件洗淨裝置、工件洗淨方法及坑狀治具 TW202228191A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020151262 2020-09-09
JP2020-151262 2020-09-09
WOPCT/JP2021/015921 2021-04-19
PCT/JP2021/015921 WO2022054331A1 (ja) 2020-09-09 2021-04-19 ワーク洗浄装置及びワーク洗浄方法並びにパドル治具

Publications (1)

Publication Number Publication Date
TW202228191A true TW202228191A (zh) 2022-07-16

Family

ID=80631525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110133020A TW202228191A (zh) 2020-09-09 2021-09-06 工件洗淨裝置、工件洗淨方法及坑狀治具

Country Status (4)

Country Link
JP (1) JP7017670B1 (ja)
CN (1) CN116097397A (ja)
TW (1) TW202228191A (ja)
WO (1) WO2022054331A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2857958B2 (ja) * 1992-04-02 1999-02-17 株式会社デンソー エッチングポット
JPH10107130A (ja) * 1996-09-30 1998-04-24 Kyocera Corp ウエハ保持具
JP3876663B2 (ja) * 2001-08-07 2007-02-07 株式会社デンソー 表面処理装置及び表面処理方法
KR20090018996A (ko) * 2009-01-28 2009-02-24 (주)지원테크 기판 박판화 방법, 기판 박판화 장치 및 이를 포함하는 기판 박판화 시스템
JP6367727B2 (ja) * 2015-01-30 2018-08-01 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体
CN104979262B (zh) * 2015-05-14 2020-09-22 浙江中纳晶微电子科技有限公司 一种晶圆分离的方法
JP6573531B2 (ja) * 2015-11-02 2019-09-11 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体

Also Published As

Publication number Publication date
CN116097397A (zh) 2023-05-09
WO2022054331A1 (ja) 2022-03-17
JPWO2022054331A1 (ja) 2022-03-17
JP7017670B1 (ja) 2022-02-08

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