CN115917746A - 一种驱动背板、其制作方法及发光基板 - Google Patents
一种驱动背板、其制作方法及发光基板 Download PDFInfo
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- CN115917746A CN115917746A CN202180000799.2A CN202180000799A CN115917746A CN 115917746 A CN115917746 A CN 115917746A CN 202180000799 A CN202180000799 A CN 202180000799A CN 115917746 A CN115917746 A CN 115917746A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种驱动背板、其制作方法及发光基板，驱动背板中，第一导电层形(2)成于衬底(1)上；第一有机膜层(3)形成于第一导电层(2)与第一导电层(2)之间，第一有机膜层(3)设有多个第一过孔(V1)；第一无机膜层(4)形成于第一有机膜层(3)远离衬底(1)一侧；第二导电层(5)形成于第一无机膜层(4)远离第一有机膜层(3)的一侧，且第二导电层(5)与第一导电层(2)之间通过第一过孔(V1)导电连接；第一导电层(2)在衬底(1)的正投影与第二导电层(5)在衬底(1)的正投影具有交叠区，交叠区包括第一过孔(V1)在衬底(1)的正投影所在区域以及第一区域，第一无机膜层(4)在衬底(1)的正投影覆盖至少部分第一区域。驱动背板能够避免第二导电层(5)中的走线与第一导电层(2)中的走线之间的交叠区域短路，增加产品良率。
Description
PCT国内申请，说明书已公开。
Claims (13)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/087899 WO2022217608A1 (zh) | 2021-04-16 | 2021-04-16 | 一种驱动背板、其制作方法及发光基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115917746A true CN115917746A (zh) | 2023-04-04 |
Family
ID=83639447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180000799.2A Pending CN115917746A (zh) | 2021-04-16 | 2021-04-16 | 一种驱动背板、其制作方法及发光基板 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240105892A1 (zh) |
| CN (1) | CN115917746A (zh) |
| WO (1) | WO2022217608A1 (zh) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5134193B2 (ja) * | 2005-07-15 | 2013-01-30 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP2009037115A (ja) * | 2007-08-03 | 2009-02-19 | Sony Corp | 半導体装置およびその製造方法、並びに表示装置 |
| CN205428907U (zh) * | 2016-02-17 | 2016-08-03 | 京东方科技集团股份有限公司 | 层堆叠结构、阵列基板和显示装置 |
| JP6768394B2 (ja) * | 2016-07-29 | 2020-10-14 | 株式会社ジャパンディスプレイ | 電子機器 |
| KR102597297B1 (ko) * | 2018-10-11 | 2023-11-02 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR20200115852A (ko) * | 2019-03-28 | 2020-10-08 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR20210016114A (ko) * | 2019-07-31 | 2021-02-15 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN112331681A (zh) * | 2020-11-25 | 2021-02-05 | 湖北长江新型显示产业创新中心有限公司 | 一种显示面板和显示装置 |
-
2021
- 2021-04-16 US US17/768,324 patent/US20240105892A1/en active Pending
- 2021-04-16 CN CN202180000799.2A patent/CN115917746A/zh active Pending
- 2021-04-16 WO PCT/CN2021/087899 patent/WO2022217608A1/zh active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022217608A1 (zh) | 2022-10-20 |
| US20240105892A1 (en) | 2024-03-28 |
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