CN115449317A - 各向异性导电性膜及连接构造体 - Google Patents

各向异性导电性膜及连接构造体 Download PDF

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Publication number
CN115449317A
CN115449317A CN202210859672.2A CN202210859672A CN115449317A CN 115449317 A CN115449317 A CN 115449317A CN 202210859672 A CN202210859672 A CN 202210859672A CN 115449317 A CN115449317 A CN 115449317A
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Prior art keywords
anisotropic conductive
conductive film
conductive particles
electronic component
center
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CN202210859672.2A
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筱原诚一郎
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Dexerials Corp
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Dexerials Corp
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Priority claimed from JP2014219793A external-priority patent/JP6119718B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN115449317A publication Critical patent/CN115449317A/zh
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Abstract

各向异性导电性膜（1A、1B）包括绝缘粘接剂层（10）和以点阵状配置于该绝缘粘接剂层（10）的导电粒子（P）。在关于任意的导电粒子（P0）和与该导电粒子（P0）邻接的导电粒子的中心间距而将与导电粒子（P0）相距的最短的距离设为第1中心间距（d1）且将第二短的距离设为第2中心间距（d2）的情况下，这些中心间距（d1、d2）分别是导电粒子的粒径的1.5～5倍，关于由任意的导电粒子（P0）、与该导电粒子（P0）相距第1中心间距的导电粒子（P1）以及与该导电粒子（P0）相距第1中心间距（d1）或第2中心间距（d2）的导电粒子（P2）形成的锐角三角形，相对于通过导电粒子（P0、P1）的第1排列方向（L1）而正交的直线（L0）与通过导电粒子（P1、P2）的第2排列方向（L2）所构成的锐角的角度（α）是18～35°。该各向异性导电性膜（1A、1B）即使在COG连接中，也具有稳定的连接可靠性。

Description

各向异性导电性膜及连接构造体
本申请是如下发明申请的分案申请：
发明名称：各向异性导电性膜及连接构造体；申请号：201910661743.6；申请日：2014年11月18日。
技术领域
本发明涉及各向异性导电性膜、使用各向异性导电性膜的连接方法及通过各向异性导电性膜而连接的连接构造体。
背景技术
在将IC芯片等电子部件安装于基板时，广泛地使用各向异性导电性膜。近年来，在便携电话、笔记本电脑等小型电子设备中，要求布线的高密度化，作为使各向异性导电性膜应对该高密度化的手法，已知将导电粒子以矩阵状均等配置于各向异性导电性膜的绝缘粘接剂层的技术。
然而，即使均等配置导电粒子，也产生连接电阻出现偏差这一问题。这是因为，位于端子的边缘上的导电粒子由于绝缘性粘接剂的熔化而流出至空间，难以被上下的端子夹着。针对该问题，提出了如下的方案：以导电粒子的第1排列方向作为各向异性导电性膜的长度方向，使与第1排列方向相交的第2排列方向相对于与各向异性导电性膜的长度方向正交的方向而以5°以上且15°以下倾斜（专利文献1）。
专利文献1：日本专利4887700号公报。
发明内容
发明要解决的课题
然而，如果通过各向异性导电性膜而连接的电子部件的凸点尺寸进一步变小，则能够通过凸点而捕捉的导电粒子的数量也进一步变少，关于专利文献1所记载的各向异性导电性膜，存在未充分地得到导通可靠性的情况。特别地，关于将液晶画面等控制用IC与玻璃基板上的透明电极连接的所谓的COG连接，由于伴随着液晶画面的高精细化而产生的多端子化和IC芯片的小型化而导致凸点尺寸变小，使能够通过凸点而捕捉的导电粒子数增加而提高连接可靠性成为课题。
因此，本发明的课题在于，即使在COG连接中，也使用各向异性导电性膜来得到稳定的连接可靠性。
用于解决课题的方案
本发明人发现如下的情况而完成本发明：在将导电粒子以点阵状配置于绝缘粘接剂层上的各向异性导电性膜中，如果使导电粒子的粒子间距与排列方向保持特定的关系，则即使在需要高密度布线的COG连接中，也能以稳定的连接可靠性进行各向异性导电性连接。
即，本发明提供一种各向异性导电性膜，该各向异性导电性膜是包括绝缘粘接剂层和以点阵状配置于该绝缘粘接剂层的导电粒子的各向异性导电性膜，
在关于任意的导电粒子和与该导电粒子邻接的导电粒子的中心间距而将与任意的导电粒子的最短的距离设为第1中心间距且将第二短的距离设为第2中心间距的情况下，
第1中心间距及第2中心间距分别是导电粒子的粒径的1.5～5倍，
关于由任意的导电粒子P0、与任意的导电粒子P0相距第1中心间距的导电粒子P1以及与任意的导电粒子P0相距第1中心间距或第2中心间距的导电粒子P2形成的锐角三角形，相对于通过导电粒子P0、P1的直线的方向（以下，称为第1排列方向）而正交的直线和通过导电粒子P1、P2的直线的方向（以下，称为第2排列方向）所构成的锐角的角度α（以下，也称为第2排列方向的倾斜角α）是18～35°。
另外，本发明是使用上述各向异性导电性膜来对第1电子部件的连接端子和第2电子部件的连接端子进行各向异性导电性连接的连接方法，提供使各向异性导电性膜的长度方向与第1电子部件或第2电子部件的连接端子的宽度方向一致的连接方法，特别地，提供使与各向异性导电性膜的第1排列方向大致正交的方向与第1电子部件或第2电子部件的连接端子的长度方向一致的连接方法。
在此，所谓大致正交，不但包括与第1排列方向严格地正交的方向，而且还包括在使用各向异性导电性膜来安装电子部件时产生的偏差的范围。通常，包括相对于与第1排列方向正交的方向而±3°。
此外，本发明提供通过上述的连接方法而对第1电子部件和第2电子部件进行各向异性导电性连接的连接构造体。
发明的效果
依据本发明的各向异性导电性膜，关于邻接的导电粒子的中心间距，以作为最短的中心间距的第1中心间距和作为第二短的中心间距的第2中心间距是导电粒子的粒径的1.5～5倍这一高密度配置导电粒子，而且，导电粒子沿特定方向以点阵状配置于绝缘粘接剂层，因而能够抑制邻接的端子间的短路，并且，连接高密度的布线。
而且，在本发明的各向异性导电性膜中，相对于导电粒子的第1排列方向而正交的直线和第2排列方向所构成的锐角的角度（第2排列方向的倾斜角α）是18～35°，因而通过使与各向异性导电性膜的第1排列方向大致正交的方向与连接端子的长度方向一致而进行各向异性导电性连接，从而能够使通过连接端子而捕捉的导电粒子的数量增加，即使在将本发明的各向异性导电性膜用于COG连接的情况下，也能够得到稳定的连接可靠性。
附图说明
图1是实施例的各向异性导电性膜中的导电粒子的配置图。
图2是各向异性导电性膜中的导电粒子的排列方向和连接端子的长度方向的优选方向的说明图。
图3是另一实施例的各向异性导电性膜中的导电粒子的排列方向和连接端子的长度方向的优选方向的说明图。
图4是使用实施例的各向异性导电性膜的评价用连接物中的导电粒子的配置的说明图。
图5是使用实施例及比较例的各向异性导电性膜的连接物中的平均1个凸点的导电粒子捕捉数与频度的关系图。
具体实施方式
以下，参照附图，并且，详细地说明本发明。
图1是本发明的一个实施例的各向异性导电性膜1A中的导电粒子P的配置图。该各向异性导电性膜1A具有绝缘粘接剂层10和以点阵状的配置固定于绝缘粘接剂层10的导电粒子P。
在该各向异性导电性膜1A中，在关于任意的导电粒子P0和与该导电粒子P0邻接的导电粒子的中心间距而将最短的距离设为第1中心间距d1且将第二短的距离设为第2中心间距d2的情况下，关于由与导电粒子P0相距第1中心间距d1的导电粒子P1和与导电粒子P0相距第2中心间距的导电粒子P2形成的锐角三角形P0P1P2，导电粒子沿通过导电粒子P0、P1的第1排列方向L1以间距d1排列，并且，导电粒子还沿通过导电粒子P1、P2的第2排列方向L2排列，导电粒子沿通过导电粒子P0、P2的第3排列方向L3以间距d2排列。此外，在本实施例中，第3排列方向上的导电粒子的间距d2比第1排列方向L1上的导电粒子的间距d1更大，但这些间距也可以是相同的。
从短路的防止和电极间接合的稳定性的点来看，导电粒子P的粒径D优选为1～10μm。
第1中心间距d1及第2中心间距d2分别是导电粒子的粒径D的1.5～5倍，优选为1.8～4.5倍，更优选为2～4倍。如果第1中心间距d1及第2中心间距d2过短，则在使用各向异性导电性膜来将端子间连接的情况下，容易发生短路，相反，如果过长，则在端子间被捕捉的导电粒子数不足。
另外，第1中心间距d1与第2中心间距d2的差优选为小于导电粒子P的粒径D的2倍，更优选为小于1.5倍，进一步优选为等倍以下。因为，如果该差过大，则使用各向异性导电性膜1A来进行各向异性导电性连接时的捕捉到凸点的捕捉性变差。
导电粒子P的密度优选为2000～250000个/mm2。根据导电粒子P的粒径和配置方向而适当调整该粒子密度。
即使要制造将导电粒子以既定的密度以点阵状配置的各向异性导电性膜，在实际的制法上，导电粒子有时候也从点阵位置脱落。关于导电粒子从点阵位置脱落的现象，在该各向异性导电性膜1A中，关于第1排列方向L1及第2排列方向L2的各个，特别地，关于各排列方向L1、L2、L3的各个，连续的导电粒子P的脱落数优选为6个以下，更优选为5个以下，进一步优选为4个以下。另外，在从任意的导电粒子的配置位置沿第1排列方向连续地将10个区域拔出且沿第2排列方向连续地将10个区域拔出，即将10个×10个（共计100个）配置位置拔出的情况下，在100个配置位置中，优选存在75个以上导电粒子，更优选为80个以上，进一步优选为90个以上，特别地优选为94个以上。
通过这样地抑制导电粒子的脱落，从而在使用各向异性导电性膜来连接方形的凸点时，无论使用各向异性导电性膜的哪个部分，都容易使凸点捕捉足以导通的数量的导电粒子，能够应对细小间距的各向异性导电性连接。
此外，作为这样地抑制导电粒子的脱落的方法，在如后所述地将导电粒子P配置于绝缘粘接剂层10时，优选在模具或具有贯通孔的构件上反复地进行擦拭。
另外，在该各向异性导电性膜1A中，第2排列方向的倾斜角α是18～35°。在上述的粒径D与间距d1、d2的关系中，这样地确定第2排列方向的倾斜角α，由此，在通过该各向异性导电性膜1A而对矩形的连接端子（凸点）进行各向异性导电性连接的情况下，无论将该各向异性导电性连接所使用的矩形区域选取在各向异性导电性膜1A的膜面内的何处，都能够确保足够的个数的有助于导通的导电粒子。
一般而言，关于电子设备的生产线上的各向异性导电性连接，通常，连接端子3的宽度方向配置成沿着各向异性导电性膜1A的长度方向。因此，从各向异性导电性膜的生产性的点来看，如图2所示，优选使矩形的连接端子3的长度方向Lt和与第1排列方向L1正交的方向L0一致（即，使连接端子3的宽度方向与第1排列方向L1一致）。换言之，期望使第1排列方向L1与各向异性导电性膜1A的长度方向Lf大致平行地形成，即，在当制造各向异性导电性膜时产生的导电粒子的配置的偏差的范围内，使导电粒子的第1排列方向L1与各向异性导电性膜1A的长度方向Lf平行地形成。
另一方面，从提高各向异性导电性连接时的连接端子中的导电粒子的捕捉性的点来看，优选，如图3所示的各向异性导电性膜1B那样，导电粒子P的第1排列方向L1、第2排列方向L2、第3排列方向L3的任一个都相对于各向异性导电性膜1B的长度方向而倾斜。特别地，第1排列方向L1与各向异性导电性膜1B的长度方向Lf所构成的锐角的角度β（以下，也称为倾斜角β）优选为5～25°。
此外，除了导电粒子P的第1排列方向L1相对于各向异性导电性膜1B的长度方向Lf而倾斜以外，该各向异性导电性膜1B与前述的各向异性导电性膜1A同样地构成。
在此，由于将导电粒子以紧密的状态配置，使得各向异性导电性膜能够应对更细小的间距的端子连接，因而如后述的图4所示，与各向异性导电性膜1B的长度方向Lf正交的方向的，导电粒子P的外切线（二点点划线）也可以贯穿与该导电粒子P邻接的导电粒子Pc、Pe。由此，在使各向异性导电性膜1B重叠于连接端子3的端子面的平面图上，能够进一步增大导电粒子在连接端子3的连接面所占的面积。因而，能够防止在各向异性导电性连接时被夹持于对置的连接端子3之间且被连接端子3压入而使连接端子3之间导通的导电粒子P的数量不足。
只要本发明的各向异性导电性膜如上所述地进行导电粒子的配置，就能够对导电粒子P自身的构成或绝缘粘接剂层10的层构成或构成树脂采用各种方式。
即，作为导电粒子P，能够从众所周知的各向异性导电性膜所使用的导电粒子中适当选择而使用。列举例如镍、钴、银、铜、金、钯等金属粒子、金属覆盖式树脂粒子等。也能够同时使用2种以上。
作为绝缘粘接剂层10，能够适当采用众所周知的各向异性导电性膜所使用的绝缘性树脂层。能够使用例如含有丙烯酸酯化合物和光自由基聚合引发剂的光自由基聚合型树脂层、含有丙烯酸酯化合物和热自由基聚合引发剂的热自由基聚合型树脂层、含有环氧化合物和热阳离子聚合引发剂的热阳离子聚合型树脂层、含有环氧化合物和热阴离子聚合引发剂的热阴离子聚合型树脂层等。另外，能够根据需要而使这些树脂层分别聚合。另外，也可以由多个树脂层形成绝缘粘接剂层10。
而且，也可以根据需要而将二氧化硅微粒、氧化铝、氢氧化铝等绝缘性填充剂添加至绝缘粘接剂层10。优选，绝缘性填充剂的配合量相对于100质量份的形成绝缘粘接剂层的树脂而成为3～40质量份。由此，即使在各向异性导电性连接时，绝缘粘接剂层10熔化，也能够抑制由于熔化的树脂而导致导电粒子2徒劳地移动的情况。
作为通过上述的配置而将导电粒子P固定于绝缘粘接剂层10的方法，通过机械加工或激光加工、光刻等众所周知的方法来制作具有与导电粒子P的配置相对应的凹陷的模具，将导电粒子放入该模具，将绝缘粘接剂层形成用组合物填充于导电粒子上并使该组合物硬化，从模具取出即可。也可以由刚性比这样的模具更低的材质制成模具。
另外，为了将导电粒子P以上述的配置设置于绝缘粘接剂层10，也可以利用以下的方法等：在绝缘粘接剂层形成组合物层上，设置以既定的配置形成有贯通孔的构件，从该构件上供给导电粒子P并使导电粒子P通过贯通孔。
在使用本发明的各向异性导电性膜1A、1B来对柔性基板、玻璃基板等第1电子部件的连接端子和IC芯片、IC模块等第2电子部件的连接端子进行各向异性导电性连接的情况下，如图2、图3所示，使各向异性导电性膜1A、1B的长度方向Lf与第1电子部件或第2电子部件的连接端子3的宽度方向一致。由此，能够有效利用本发明的各向异性导电性膜1A、1B中的导电粒子P的配置来充分地提高连接端子中的导电粒子P的捕捉数，特别地，在使用导电粒子P的任一个排列方向都相对于各向异性导电性膜的长度方向Lf而倾斜的各向异性导电性膜1B的情况下，能够显著地提高连接端子3中的导电粒子P的捕捉性。
例如，在将通过透明电极而形成有连接端子的玻璃基板等用作第1电子部件且将IC芯片等用作第2电子部件而进行高密度布线的COG连接的情况下，更具体而言，在这些连接端子的连接面的大小为宽度8～60μm、长度400μm以下（下限与宽度等倍）的情况下，或在连接端子的连接面的宽度方向的宽度小于导电粒子的粒径的7倍的情况下，特别地，与从前的各向异性导电性连接相比，能够通过连接端子而捕捉的导电粒子数稳定地增加，能够提高连接可靠性。此外，如果连接端子面的宽度方向的宽度比上述的情况更小，则经常发生连接不良，如果比上述的情况更大，则难以应对COG连接所需要的高密度安装。另外，如果连接端子面的长度比上述的情况更短，则难以获得稳定的导通，如果长度比上述的情况更长，则成为部分碰触的主要原因。另一方面，连接端子间的最小距离依照连接端子的连接面的宽度方向的宽度而确定，例如，能够成为8～30μm。
另外，在能够通过本发明的各向异性导电性膜而连接的细小间距的端子中，能够使在包括互相连接的对置的端子的端子的并联方向上隔开间隙而邻接的最小端子间距（该距离也可以在能够进行各向异性连接的范围内沿并联方向偏离）小于导电粒径的4倍。在该情况下，连接的端子的连接面的宽度方向的宽度能够小于导电粒子的粒径的7倍。
本发明还包含这样地进行各向异性导电性连接的第1电子部件与第2电子部件的连接构造体。
实施例
以下，基于实施例而具体地说明本发明。
实验例1
关于各向异性导电性膜中的导电粒子P（粒径D＝4μm）的配置，在设为第1中心间距d1＝第2中心间距d2＝10μm且如表1所示地改变倾斜角α的情况下，通过将电极尺寸为15μm×100μm的狭小的凸点重叠于各向异性导电性膜的图案，从而求出加热加压前的凸点能够捕捉的导电粒子的最多粒子数和最少粒子数。在该情况下，使各向异性导电性膜的长度方向与凸点的宽度方向一致。另外，面积的50%以上相对于凸点的缘端部而脱落的粒子不作为凸点能够捕捉的导电粒子来计数。
从该结果能够看出倾斜角α和凸点的粒子捕捉性的倾向。在表1中示出结果。
[表1]
倾斜角α（°） 0° 5° 15° 18° 20° 25° 30° 35° 40° 45°
最多粒子数 20个 13个 13个 14个 14个 14个 18个 18个 13个 14个
最少粒子数 9个 9个 9个 11个 11个 12个 12个 12个 7个 7个
从表1得知，在倾斜角α为18～35°的情况下，通过凸点而捕捉的粒子数的最小数及最大数的差较小而稳定，对狭小的凸点有效。
相对于此，如果倾斜角α过小，则捕捉数的差变大。这是因为，由于倾斜角过小而导致粒子排列在凸点的端部的进展状况直接影响到捕捉数。即使相反而倾斜角α过大，也产生同样的现象，存在从凸点脱落的粒子变多的倾向。
这样，对于狭小的凸点而得知，在为了稳定地保持导电性而使捕捉效率一定的情况下，需要适当地保持倾斜角α。
实施例1～8，比较例1～5
接着，为了具体地检验导电粒子的粒子间的距离与倾斜角α的关系，使用表2所示的树脂，如下地制造导电粒子（积水化学工业（股份制），AUL704，粒径4μm）成为表2所示的配置的各向异性导电性膜。即，以表2所示的组成调制含有热塑性树脂、热硬化性树脂及潜在性硬化剂的绝缘性树脂的混合溶液，将该混合溶液涂敷于膜厚50μm的PET膜上，使该混合溶液在80℃的烘箱中干燥5分钟，在PET膜上形成厚度20μm的粘附层。
另一方面，以表2所示的配置制成具有凸部的排列图案的金属模具，使众所周知的透明性树脂的颗粒以熔化的状态流入该金属模具而冷却并凝固，由此，凹部形成表2所示的排列图案的树脂模具。将导电粒子填充至该树脂模具的凹部，使上述的绝缘性树脂的粘附层覆盖于凹部上，通过紫外线硬化而使该绝缘性树脂所包含的热硬化性树脂硬化。然后，将绝缘性树脂从模具剥离，制造各实施例及比较例的各向异性导电性膜。
实施例9～13，比较例6、7
除了使导电粒子成为表3所示的配置以外，与上述的实施例及比较例同样地制造实施例9～13、比较例6、7的各向异性导电性膜。
在此，比较例7成为四方点阵的形状，实施例3、9～13成为六方点阵的形状。
此外，在比较例1、比较例6中，使导电粒子分散于低沸点溶剂而形成喷雾，随机地配置于同一平面上。
使用光学显微镜来计测并确认导电粒子的邻接粒子中心间距d（第1中心间距d1及第2中心间距d2）。在该情况下，任意地计测处于第1排列方向或第2排列方向的100个50组，求出其平均值，确认是预期的邻接粒子中心间距d。在表2中示出结果。
另一方面，比较例1、6任意地选择100个导电粒子，计测各导电粒子的最接近的粒子的中心间距。
评价
分别如下地评价各实施例及比较例的各向异性导电性膜的（a）粒子捕捉数、（b）初始导通电阻、（c）导通可靠性、（d）短路发生率。在表2、表3中示出结果。
（a）粒子捕捉数
（a－1）平均数
使用各实施例及比较例的各向异性导电性膜来对100个15×100μm的凸点和玻璃基板进行加热加压（180℃，80MPa，5秒）而得到连接物。在该情况下，使各向异性导电性膜的长度方向与凸点的宽度方向一致。然后，计测各凸点中的粒子捕捉数，求出每1个凸点的平均粒子捕捉数。
（a－2）最小数
求出通过（a－1）而计测的各凸点的粒子捕捉数中的最小数。
（b）初始导通电阻
将各实施例及比较例的各向异性导电性膜夹在初始导通及导通可靠性的评价用IC与玻璃基板之间，进行加热加压（180℃，80MPa，5秒）而得到各评价用连接物。在该情况下，使各向异性导电性膜的长度方向与凸点的宽度方向一致。然后，测定评价用连接物的导通电阻。
在此，该各评价用IC和玻璃基板，它们的端子图案相对应，尺寸如下。
初始导通及导通可靠性的评价用IC
外径 0.7×20mm
厚度 0.2mm
凸点规格 镀金、高度12μm、尺寸15×100μm、凸点间距15μm
玻璃基板
玻璃材质 康宁公司制
外径 30×50mm
厚度 0.5mm
电极 ITO布线
（c）导通可靠性
与（b）同样地对将（b）的评价用IC与各实施例及比较例的各向异性导电性膜的评价用连接物在温度85℃、湿度85%RH的恒温槽中放置500小时之后的导通电阻进行测定。此外，如果该导通电阻为5Ω以上，则从连接的电子部件的实际使用的导通稳定性的点来看，不优选。
（d）短路发生率
作为短路发生率的评价用IC，准备第二IC（7.5μm间隔的梳齿TEG（test elementgroup，测试元件组））。
外径 1.5×13mm
厚度 0.5mm
凸点规格 镀金、高度15μm、尺寸25×140μm、凸点间距7.5μm
将各实施例及比较例的各向异性导电性膜夹在短路发生率的评价用IC和与该评价用IC相对应的图案的玻璃基板之间。在与（b）同样的连接条件下进行加热加压而得到连接物，求出该连接物的短路发生率。按照“发生短路的次数/7.5μm间隔的总数”算出短路发生率。如果短路发生率为1ppm以上，则从制造实际使用上的连接构造体的点来看，不优选。
Figure 10235DEST_PATH_IMAGE001
（注）*1：新日铁住金，YP-50（热塑性树脂）
*2：三菱化学，jER828（热硬化性树脂）
*3：三新化学工业，SI-60L（潜在性硬化剂）
Figure 927375DEST_PATH_IMAGE002
（注）*1：新日铁住金，YP-50（热塑性树脂）
*2：三菱化学，jER828（热硬化性树脂）
*3：三新化学工业，SI-60L（潜在性硬化剂）
从表2得知，如果导电粒子的倾斜角α为18～35°，则初始导通电阻较低，导通可靠性也较高，还抑制短路发生率，能进行与粒径的4倍左右的端子宽度的高密度布线相对应的各向异性导电性连接。
相对于此，得知，在比较例1中，由于粒子密度过高，因而绝缘性较差，另外，在比较例2～比较例5中，倾斜角α背离18～35°的范围，凸点中的粒子捕捉数较少，导通可靠性不足。
另外，从表3得知，导电粒子的各排列方向沿各向异性导电性膜的长度方向倾斜的实施例9～13，导通可靠性也优异，短路发生率降低。但在对使用这些实施例9～13的各向异性导电性膜来将初始导通及导通可靠性的评价用IC与玻璃基板连接的评价用连接物进行观察的情况下，如图4所示的导电粒子的配置那样，凸点3的长度方向Lt的，导电粒子P的外切线（二点点划线）和与该导电粒子P邻接的导电粒子Pc、Pe重叠，该外切线贯穿导电粒子Pc、Pe。由此，能够确认，即使凸点3的宽度进一步变窄，也能够捕捉足以获得导通的数量的导电粒子。
另外，如果对使用比较例7和实施例9～13的各向异性导电性膜的评价用连接物的外观进行比较，则在使用实施例9～13的各向异性导电性膜的评价用连接物中，位于凸点3的宽度方向的中央部的导电粒子Pc与位于凸点3的边缘上的导电粒子Pe的压痕状态的差比使用比较例7的各向异性导电性膜的评价用连接物更少。由此，得知，如果使用实施例的各向异性导电性膜，则能够实现更均匀的压接。此外，凸点面积狭小，由此，未必在一个凸点3中在边缘上和宽度方向的中央部的双方捕捉导电粒子，因而通过观察在许多并联的凸点的任一个中在边缘捕捉的导电粒子和在宽度方向的中央部捕捉的导电粒子，从而得到上述的结果。
实施例14～19
在实施例3、9～13中，将导电粒子的粒径D从4μm变更成3μm，将邻接粒子间中心距离设为6μm（即，（d－D）/D＝1），配置密度设为28000个/mm2，制造实施例14～19的各向异性导电性膜，同样地进行评价。其结果是，关于这些实施例，也得到如下的与实施例3及9～13大致同样的效果：初始导通电阻较低，导通可靠性较高，抑制短路发生率。另外，关于位于这些评价用连接物中的凸点的边缘上的导电粒子和位于宽度方向的中央部的导电粒子的压痕状态，也与实施例9～13同样。
而且，关于在实施例14和比较例1中制作的粒子个数密度为60000个/mm2的各向异性导电性膜，使用具有凸点面积为700μm2（凸点尺寸14μm×50μm，凸点间距14μm）的凸点的IC，与实施例1的粒子捕捉数的计测的情况同样地连接，调查由1个凸点捕捉的导电粒子的频度。在图5中示出结果。
从图5得知，相对于比较例1，在实施例14中，平均1个凸点的导电粒子捕捉数为9个左右，出现频度急剧地增大，平均1个凸点的导电粒子捕捉数稳定。
实施例20～25
在实施例3、9～13中，制造将导电粒子的粒径D依然设为4μm且将邻接粒子间中心距离设为7μm（（d－D）/D＝0.75，配置密度20000个/mm2）的实施例20～25的各向异性导电性膜，同样地进行评价。其结果是，关于这些实施例，也得到如下的与实施例3、9～13大致同样的效果：初始导通电阻较低，导通可靠性较高，抑制短路发生率。另外，关于位于这些评价用连接物中的凸点的边缘上的导电粒子和位于宽度方向的中央部的导电粒子的压痕状态，也与实施例9～13同样。
实施例26～31
在实施例3、9～13中，制造将导电粒子的粒径D依然设为4μm且将邻接粒子间中心距离设为16μm（（d－D）/D＝3，配置密度4000个/mm2）的实施例26～31的各向异性导电性膜，同样地进行评价。其结果是，关于这些实施例，初始导通电阻比实施例3、9～13更高，但不存在实际使用上的问题。导通可靠性较高和抑制短路发生率的效果与实施例3、9～13同样。这是考虑到，因为，实施例26～31的各向异性导电性膜，导电粒子的配置密度较低。位于评价用连接物中的凸点的边缘上的导电粒子和位于宽度方向的中央部的导电粒子的压痕状态与实施例9～13同样。
实施例32～33
在实施例5、7中，将20质量份的二氧化硅微粒填充剂（二氧化硅微粒，アエロジルRY200（AEROSIL RY200），日本アエロジル株式会社（日本AEROSIL股份有限公司））添加至100质量份的绝缘性树脂中，与实施例5、7同样地制造各向异性导电性膜并进行评价。其结果是，得到如下的与实施例5、7同样的效果：初始导通电阻较低，导通可靠性较高，抑制短路发生率。
标号说明
1A、1B 各向异性导电性膜
3 连接端子或凸点
10 绝缘粘接剂层
L0 与第1排列方向正交的方向
L1 第1排列方向
L2 第2排列方向
L3 第3排列方向
Lf 各向异性导电性膜的长度方向
Lt 连接端子的长度方向
d1 第1中心间距，间距
d2 第2中心间距，间距
D 导电粒子的粒径
P、P0、P1、P2、Pc、Pe 导电粒子
α 倾斜角
β 倾斜角。

Claims (38)

1.一种各向异性导电性膜，是包括绝缘粘接剂层和以点阵状配置于该绝缘粘接剂层的导电粒子的各向异性导电性膜，其中，
在关于任意的导电粒子和与该导电粒子邻接的导电粒子的中心间距而将与任意的导电粒子的最短的距离设为第1中心间距且将第二短的距离设为第2中心间距的情况下，
第1中心间距及第2中心间距分别是导电粒子的粒径的1.5～5倍，
关于由任意的导电粒子P0、与任意的导电粒子P0相距第1中心间距的导电粒子P1以及与任意的导电粒子P0相距第1中心间距或第2中心间距的导电粒子P2形成的锐角三角形，将通过导电粒子P0、P1的直线的方向设为第1排列方向、将通过导电粒子P1、P2的直线的方向设为第2排列方向、并将通过导电粒子P0、P2的直线的方向设为第3排列方向的情况下，第1排列方向相对于各向异性导电性膜的长度方向大致平行。
2.如权利要求1所述的各向异性导电性膜，其中，关于第1排列方向及第2排列方向的各个方向，导电粒子的连续的脱落数是6个以下。
3.如权利要求2所述的各向异性导电性膜，其中，在第3排列方向的方向上，导电粒子的连续的脱落数是6个以下。
4.如权利要求1～3的任一项所述的各向异性导电性膜，其中，第1排列方向与膜长度方向所构成的角度比第2排列方向与膜长度方向所构成的角度小。
5.如权利要求1～3的任一项所述的各向异性导电性膜，其中，第1排列方向与各向异性导电性膜的长度方向所构成的角度β是5～25°。
6.如权利要求1～3的任一项所述的各向异性导电性膜，其中，绝缘粘接剂层是含有丙烯酸酯化合物和光或热自由基聚合引发剂的光或热自由基聚合型树脂层、或者含有环氧化合物和热阳离子或热阴离子聚合引发剂的热阳离子或热阴离子聚合型树脂层。
7.如权利要求1～3的任一项所述的各向异性导电性膜，其中，第1中心间距与第2中心间距的差小于导电粒子的粒径的2倍。
8.如权利要求1～3的任一项所述的各向异性导电性膜，其中，导电粒子的密度是2000～250000个/mm2。
9.如权利要求1～3的任一项所述的各向异性导电性膜，其中，所述导电粒子是金属粒子或金属覆盖式树脂粒子。
10.如权利要求1～3的任一项所述的各向异性导电性膜，其中，所述导电粒子并用两种以上。
11.如权利要求1～3的任一项所述的各向异性导电性膜，其中，所述绝缘粘接剂层由多个树脂层构成。
12.如权利要求1～3的任一项所述的各向异性导电性膜，其中，所述绝缘粘接剂层中，相对于100质量份的形成该绝缘粘接剂层的树脂而含有3～40质量份的绝缘性填充剂。
13.一种制造方法，是如权利要求1～12的任一项所述的各向异性导电性膜的制造方法，利用以既定配置形成有贯通孔的构件，从该构件上供给导电粒子并使导电粒子通过贯通孔，从而将导电粒子配置于绝缘粘接剂层。
14.如权利要求13所述的制造方法，其中，所述绝缘粘接剂层中，相对于100质量份的形成该绝缘粘接剂层的树脂而含有3～40质量份的绝缘性填充剂。
15.一种连接方法，是使用如权利要求1～12的任一项所述的各向异性导电性膜来对第1电子部件的连接端子和第2电子部件的连接端子进行连接的连接方法，其中，使各向异性导电性膜的长度方向与第1电子部件或第2电子部件的连接端子的宽度方向一致，使与各向异性导电性膜的第1排列方向大致正交的方向与第1电子部件或第2电子部件的连接端子的长度方向一致。
16.如权利要求15所述的连接方法，其中，第1电子部件是通过透明电极而形成有连接端子的玻璃基板，第2电子部件是IC芯片。
17.如权利要求15或16所述的连接方法，其中，连接端子的连接面的大小是宽度8～60μm、长度400μm以下。
18.一种连接构造体，通过如权利要求1～12的任一项所述的各向异性导电性膜而对第1电子部件的连接端子和第2电子部件的连接端子进行连接，
其中，使各向异性导电性膜的长度方向与第1电子部件或第2电子部件的连接端子的宽度方向一致。
19.一种连接构造体的制造方法，通过如权利要求1～12的任一项所述的各向异性导电性膜而对第1电子部件的连接端子和第2电子部件的连接端子进行连接，
其中，使各向异性导电性膜的长度方向与第1电子部件或第2电子部件的连接端子的宽度方向一致地连接。
20.一种各向异性导电性膜，是包括绝缘粘接剂层和以点阵状配置于该绝缘粘接剂层的导电粒子的各向异性导电性膜，其中，
在关于任意的导电粒子和与该导电粒子邻接的导电粒子的中心间距而将与任意的导电粒子的最短的距离设为第1中心间距且将第二短的距离设为第2中心间距的情况下，
第1中心间距及第2中心间距分别是导电粒子的粒径的1.5～5倍，
关于由任意的导电粒子P0、与任意的导电粒子P0相距第1中心间距的导电粒子P1以及与任意的导电粒子P0相距第1中心间距或第2中心间距的导电粒子P2形成的锐角三角形，将通过导电粒子P0、P1的直线的方向设为第1排列方向、将通过导电粒子P1、P2的直线的方向设为第2排列方向、并将通过导电粒子P0、P2的直线的方向设为第3排列方向的情况下，第1排列方向相对于各向异性导电性膜的长度方向大致平行，
相对于第1排列方向而正交的直线和第2排列方向所构成的锐角的角度α是18～35°。
21.如权利要求20所述的各向异性导电性膜，其中，关于第1排列方向及第2排列方向的各个方向，导电粒子的连续的脱落数是6个以下。
22.如权利要求21所述的各向异性导电性膜，其中，在第3排列方向的方向上，导电粒子的连续的脱落数是6个以下。
23.如权利要求20～22的任一项所述的各向异性导电性膜，其中，第1排列方向与膜长度方向所构成的角度比第2排列方向与膜长度方向所构成的角度小。
24.如权利要求20～22的任一项所述的各向异性导电性膜，其中，第1排列方向与各向异性导电性膜的长度方向所构成的角度β是5～25°。
25.如权利要求20～22的任一项所述的各向异性导电性膜，其中，绝缘粘接剂层是含有丙烯酸酯化合物和光或热自由基聚合引发剂的光或热自由基聚合型树脂层、或者含有环氧化合物和热阳离子或热阴离子聚合引发剂的热阳离子或热阴离子聚合型树脂层。
26.如权利要求20～22的任一项所述的各向异性导电性膜，其中，第1中心间距与第2中心间距的差小于导电粒子的粒径的2倍。
27.如权利要求20～22的任一项所述的各向异性导电性膜，其中，导电粒子的密度是2000～250000个/mm2。
28.如权利要求20～22的任一项所述的各向异性导电性膜，其中，所述导电粒子是金属粒子或金属覆盖式树脂粒子。
29.如权利要求20～22的任一项所述的各向异性导电性膜，其中，所述导电粒子并用两种以上。
30.如权利要求20～22的任一项所述的各向异性导电性膜，其中，所述绝缘粘接剂层由多个树脂层构成。
31.如权利要求20～22的任一项所述的各向异性导电性膜，其中，所述绝缘粘接剂层中，相对于100质量份的形成该绝缘粘接剂层的树脂而含有3～40质量份的绝缘性填充剂。
32.一种制造方法，是如权利要求20～31的任一项所述的各向异性导电性膜的制造方法，利用以既定配置形成有贯通孔的构件，从该构件上供给导电粒子并使导电粒子通过贯通孔，从而将导电粒子配置于绝缘粘接剂层。
33.如权利要求32所述的制造方法，其中，所述绝缘粘接剂层中，相对于100质量份的形成该绝缘粘接剂层的树脂而含有3～40质量份的绝缘性填充剂。
34.一种连接方法，是使用如权利要求20～31的任一项所述的各向异性导电性膜来对第1电子部件的连接端子和第2电子部件的连接端子进行连接的连接方法，其中，使各向异性导电性膜的长度方向与第1电子部件或第2电子部件的连接端子的宽度方向一致，使与各向异性导电性膜的第1排列方向大致正交的方向与第1电子部件或第2电子部件的连接端子的长度方向一致。
35.如权利要求34所述的连接方法，其中，第1电子部件是通过透明电极而形成有连接端子的玻璃基板，第2电子部件是IC芯片。
36.如权利要求34或35所述的连接方法，其中，连接端子的连接面的大小是宽度8～60μm、长度400μm以下。
37.一种连接构造体，通过如权利要求20～31的任一项所述的各向异性导电性膜而对第1电子部件的连接端子和第2电子部件的连接端子进行连接，
其中，使各向异性导电性膜的长度方向与第1电子部件或第2电子部件的连接端子的宽度方向一致。
38.一种连接构造体的制造方法，通过如权利要求20～31的任一项所述的各向异性导电性膜而对第1电子部件的连接端子和第2电子部件的连接端子进行连接，
其中，使各向异性导电性膜的长度方向与第1电子部件或第2电子部件的连接端子的宽度方向一致地连接。
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