CN115413309B - 气体供给控制装置 - Google Patents

气体供给控制装置

Info

Publication number
CN115413309B
CN115413309B CN202180004762.7A CN202180004762A CN115413309B CN 115413309 B CN115413309 B CN 115413309B CN 202180004762 A CN202180004762 A CN 202180004762A CN 115413309 B CN115413309 B CN 115413309B
Authority
CN
China
Prior art keywords
gas
valve
port
control device
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180004762.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN115413309A (zh
Inventor
小川芳文
高妻丰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Publication of CN115413309A publication Critical patent/CN115413309A/zh
Application granted granted Critical
Publication of CN115413309B publication Critical patent/CN115413309B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B11/00—Servomotor systems without provision for follow-up action; Circuits therefor
    • F15B11/06—Servomotor systems without provision for follow-up action; Circuits therefor involving features specific to the use of a compressible medium, e.g. air, steam
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/06—Actuating devices; Operating means; Releasing devices electric; magnetic using a magnet, e.g. diaphragm valves, cutting off by means of a liquid
    • F16K31/0603—Multiple-way valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
    • F16K37/0025—Electrical or magnetic means
    • F16K37/005—Electrical or magnetic means for measuring fluid parameters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
    • F16K37/0075—For recording or indicating the functioning of a valve in combination with test equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G05D7/0652—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged in parallel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Drying Of Semiconductors (AREA)
  • Valve Housings (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
CN202180004762.7A 2021-03-29 2021-03-29 气体供给控制装置 Active CN115413309B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/013349 WO2022208621A1 (ja) 2021-03-29 2021-03-29 ガス供給制御装置

Publications (2)

Publication Number Publication Date
CN115413309A CN115413309A (zh) 2022-11-29
CN115413309B true CN115413309B (zh) 2025-07-15

Family

ID=83455783

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180004762.7A Active CN115413309B (zh) 2021-03-29 2021-03-29 气体供给控制装置

Country Status (6)

Country Link
US (1) US12449825B2 (https=)
JP (1) JP7341314B2 (https=)
KR (1) KR102676135B1 (https=)
CN (1) CN115413309B (https=)
TW (1) TWI830157B (https=)
WO (1) WO2022208621A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12442455B2 (en) 2021-02-08 2025-10-14 Hitachi High-Tech Corporation Gas supply apparatus, vacuum processing apparatus, and gas supply method
KR102676135B1 (ko) * 2021-03-29 2024-06-19 주식회사 히타치하이테크 가스 공급 제어 장치
US12587188B2 (en) * 2022-03-01 2026-03-24 Nutech Ventures Power modules for circuit protection
CN116520895A (zh) * 2023-04-13 2023-08-01 北京通嘉宏瑞科技有限公司 气体流量控制系统及控制方法
CN121028874A (zh) * 2025-09-25 2025-11-28 九未实业(上海)有限公司 一种气体流量控制柜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677234U (ja) * 1993-04-05 1994-10-28 古河電気工業株式会社 気相成長装置
CN101276732A (zh) * 2008-03-25 2008-10-01 大连八方经济技术有限公司 一种微电子气源柜吹扫系统
CN106029214A (zh) * 2015-01-30 2016-10-12 株式会社日立高新技术 真空处理装置
CN207122639U (zh) * 2017-09-06 2018-03-20 江苏正帆半导体设备有限公司 一种气动阀控制装置

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115663U (https=) * 1990-03-07 1991-11-29
US5605179A (en) * 1995-03-17 1997-02-25 Insync Systems, Inc. Integrated gas panel
JP2001029386A (ja) 1999-07-23 2001-02-06 Du Pont Toray Co Ltd 紙おむつの製造方法および紙おむつ
US6817381B2 (en) 1999-08-24 2004-11-16 Tokyo Electron Limited Gas processing apparatus, gas processing method and integrated valve unit for gas processing apparatus
JP4570748B2 (ja) * 1999-08-24 2010-10-27 東京エレクトロン株式会社 ガス処理装置およびそれに用いられる集合バルブ
JP2001235099A (ja) * 2000-02-21 2001-08-31 Ckd Corp プロセスガス供給ユニットの載せ替えシステム
JP2002222770A (ja) 2001-01-29 2002-08-09 Canon Inc 真空処理装置および真空処理方法
US6704667B2 (en) * 2002-05-13 2004-03-09 Taiwan Semiconductor Manufacturing Co., Ltd Real time mass flow control system with interlock
JP4314425B2 (ja) 2002-12-02 2009-08-19 株式会社フジキン 流体制御装置
JP4195819B2 (ja) 2003-01-17 2008-12-17 忠弘 大見 弗化水素ガスの流量制御方法及びこれに用いる弗化水素ガス用流量制御装置
JP4235076B2 (ja) 2003-10-08 2009-03-04 東京エレクトロン株式会社 半導体製造装置および半導体製造方法
JP4399517B2 (ja) * 2004-01-05 2010-01-20 株式会社堀場製作所 成膜装置と成膜方法
CN100501116C (zh) * 2004-02-23 2009-06-17 中海石油（中国）有限公司天津分公司 一种用于海洋修井机的天车防碰系统及其控制方法
JP2006261434A (ja) 2005-03-17 2006-09-28 L'air Liquide Sa Pour L'etude & L'exploitation Des Procede S Georges Claude シリコン酸化膜の形成方法
KR100805249B1 (ko) * 2006-08-30 2008-02-21 주식회사 케이씨텍 전자소재 제조용 가스공급장치
JP4606396B2 (ja) 2006-09-15 2011-01-05 東京エレクトロン株式会社 処理ガス供給システム及び処理ガス供給方法
CN101563663B (zh) 2006-12-05 2011-09-21 株式会社堀场Stec 流量控制装置的检定方法
JP4355724B2 (ja) 2006-12-25 2009-11-04 シーケーディ株式会社 ガス集積ユニット
JP5395060B2 (ja) 2008-03-31 2014-01-22 国立大学法人東北大学 ソレノイドバルブ
TWI563351B (en) 2010-10-20 2016-12-21 Entegris Inc Method and system for pump priming
JP5528374B2 (ja) * 2011-03-03 2014-06-25 東京エレクトロン株式会社 ガス減圧供給装置、これを備えるシリンダキャビネット、バルブボックス、及び基板処理装置
KR101599344B1 (ko) 2011-09-30 2016-03-03 가부시키가이샤 후지킨 가스 공급 장치
US20140137961A1 (en) 2012-11-19 2014-05-22 Applied Materials, Inc. Modular chemical delivery system
JP6336719B2 (ja) 2013-07-16 2018-06-06 株式会社ディスコ プラズマエッチング装置
JP6321972B2 (ja) 2014-01-21 2018-05-09 株式会社フジキン 圧力式流量制御装置及びその流量制御開始時のオーバーシュート防止方法
JP6664047B2 (ja) * 2016-03-31 2020-03-13 株式会社昭和真空 成膜装置及び成膜方法
WO2019053836A1 (ja) * 2017-09-14 2019-03-21 株式会社日立ハイテクノロジーズ プラズマ処理装置およびウェットクリーニング方法
JP7042134B2 (ja) * 2018-03-29 2022-03-25 東京エレクトロン株式会社 基板処理システム及びガスの流量を求める方法
JP7113681B2 (ja) * 2018-06-28 2022-08-05 株式会社日立ハイテク エッチング処理方法およびエッチング処理装置
CN116746845A (zh) 2019-07-11 2023-09-15 苏州宝时得电动工具有限公司 清洁机器人系统及其控制方法、基站
US12442455B2 (en) * 2021-02-08 2025-10-14 Hitachi High-Tech Corporation Gas supply apparatus, vacuum processing apparatus, and gas supply method
KR102676135B1 (ko) * 2021-03-29 2024-06-19 주식회사 히타치하이테크 가스 공급 제어 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677234U (ja) * 1993-04-05 1994-10-28 古河電気工業株式会社 気相成長装置
CN101276732A (zh) * 2008-03-25 2008-10-01 大连八方经济技术有限公司 一种微电子气源柜吹扫系统
CN106029214A (zh) * 2015-01-30 2016-10-12 株式会社日立高新技术 真空处理装置
CN207122639U (zh) * 2017-09-06 2018-03-20 江苏正帆半导体设备有限公司 一种气动阀控制装置

Also Published As

Publication number Publication date
TWI830157B (zh) 2024-01-21
KR20220136985A (ko) 2022-10-11
KR102676135B1 (ko) 2024-06-19
JP7341314B2 (ja) 2023-09-08
WO2022208621A1 (ja) 2022-10-06
CN115413309A (zh) 2022-11-29
US12449825B2 (en) 2025-10-21
US20240111313A1 (en) 2024-04-04
TW202238002A (zh) 2022-10-01
JPWO2022208621A1 (https=) 2022-10-06

Similar Documents

Publication Publication Date Title
CN115413309B (zh) 气体供给控制装置
KR101008241B1 (ko) 압력 센서를 보유하는 유량 제어 장치를 이용한 유체공급계의 이상 검출 방법
CN106029214B (zh) 真空处理装置
US5441076A (en) Processing apparatus using gas
TW202346631A (zh) 半導體熱處理設備及其控制方法
CN111725092A (zh) 基板处理装置、半导体装置的制造方法以及存储介质
KR20020033513A (ko) 가스 격리 박스 및 가스 스틱
KR102487786B1 (ko) 진공챔버를 이용한 배터리의 voc누출가스 검출장치 및 이를 이용한 검출방법
KR100694666B1 (ko) 원자층 증착 챔버의 에어 밸브 장치
CN115248097A (zh) 检查系统
AU2014376966A1 (en) Fuel cell unit
JPH01166457A (ja) 荷電粒子を用いる分析装置および方法
KR20220071667A (ko) 기판 처리 시스템
US20230069600A1 (en) Interface module with safety interlock system, storage medium, and safety verification method
JPH0683456A (ja) マスフローコントローラ
KR20190016887A (ko) 운송 인클로저 내부 오염도 측정 장치 및 이를 이용한 오염도 측정 방법
KR101872761B1 (ko) 운송 인클로저 내부 오염도 측정 장치 및 이를 이용한 오염도 측정 방법
CN221171823U (zh) 一种蚀刻设备
CN221472899U (zh) 一种半导体用液体硅源分配阀门箱
JPH04101414A (ja) 高温減圧反応装置
TW202243076A (zh) 基板處理裝置
CN116429689A (zh) 一种气体监测装置、半导体制程设备及气体监测方法
KR200338202Y1 (ko) 진공누설 검사장치
CN119665146A (zh) 吹扫模块、真空系统及加工设备
TW202417675A (zh) 具有封閉式流量開關及隔離閥之流量控制配置、具有流量控制配置之半導體處理系統及流量控制方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant