CN1153805C - 阻燃耐热聚碳酸酯/abs模塑组合物 - Google Patents
阻燃耐热聚碳酸酯/abs模塑组合物 Download PDFInfo
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- CN1153805C CN1153805C CNB988080842A CN98808084A CN1153805C CN 1153805 C CN1153805 C CN 1153805C CN B988080842 A CNB988080842 A CN B988080842A CN 98808084 A CN98808084 A CN 98808084A CN 1153805 C CN1153805 C CN 1153805C
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- 238000000465 moulding Methods 0.000 title claims description 14
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- -1 phosphorus compound Chemical class 0.000 claims abstract description 56
- 125000003118 aryl group Chemical group 0.000 claims abstract description 33
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 26
- 239000011574 phosphorus Substances 0.000 claims abstract description 26
- 150000001875 compounds Chemical class 0.000 claims abstract description 24
- 239000000178 monomer Substances 0.000 claims abstract description 23
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- KWQPWOQUXSQDNN-UHFFFAOYSA-N (2,3,4-trimethylphenyl) dihydrogen phosphate Chemical compound CC1=CC=C(OP(O)(O)=O)C(C)=C1C KWQPWOQUXSQDNN-UHFFFAOYSA-N 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
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- GFMYEVPBEJFZHH-UHFFFAOYSA-N CP(O)(O)O Chemical compound CP(O)(O)O GFMYEVPBEJFZHH-UHFFFAOYSA-N 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- NHIGHVRZSNLMEB-UHFFFAOYSA-N P(=O)(OCCCCCCCC)(O)O.C1(=CC=CC=C1)C1=CC=CC=C1 Chemical compound P(=O)(OCCCCCCCC)(O)O.C1(=CC=CC=C1)C1=CC=CC=C1 NHIGHVRZSNLMEB-UHFFFAOYSA-N 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000005864 Sulphur Substances 0.000 claims description 2
- ILFXTQPXQOZOBB-UHFFFAOYSA-N [H]C([H])([H])OP(O)(OC([H])([H])[H])C([H])([H])[H] Chemical class [H]C([H])([H])OP(O)(OC([H])([H])[H])C([H])([H])[H] ILFXTQPXQOZOBB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- VZEGPPPCKHRYGO-UHFFFAOYSA-N diethoxyphosphorylbenzene Chemical compound CCOP(=O)(OCC)C1=CC=CC=C1 VZEGPPPCKHRYGO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229920006158 high molecular weight polymer Polymers 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
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- 239000010703 silicon Substances 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 claims description 2
- 229920003244 diene elastomer Polymers 0.000 claims 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims 1
- 229920000578 graft copolymer Polymers 0.000 abstract description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 abstract description 2
- 230000009477 glass transition Effects 0.000 abstract 1
- 229920000728 polyester Polymers 0.000 abstract 1
- 229920006163 vinyl copolymer Polymers 0.000 abstract 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 18
- 229930185605 Bisphenol Natural products 0.000 description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 16
- 239000000839 emulsion Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 14
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 11
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 10
- 229920000573 polyethylene Polymers 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 8
- 239000002585 base Substances 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 7
- 239000001294 propane Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001263 acyl chlorides Chemical class 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N benzene-dicarboxylic acid Natural products OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 125000005250 alkyl acrylate group Chemical group 0.000 description 4
- 239000006085 branching agent Substances 0.000 description 4
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- 238000010559 graft polymerization reaction Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
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- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 2
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- 125000000217 alkyl group Chemical group 0.000 description 2
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- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
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- 125000001246 bromo group Chemical group Br* 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
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- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 2
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- OWICEWMBIBPFAH-UHFFFAOYSA-N (3-diphenoxyphosphoryloxyphenyl) diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1)(=O)OC1=CC=CC=C1 OWICEWMBIBPFAH-UHFFFAOYSA-N 0.000 description 1
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- LKLLNYWECKEQIB-UHFFFAOYSA-N 1,3,5-triazinane Chemical compound C1NCNCN1 LKLLNYWECKEQIB-UHFFFAOYSA-N 0.000 description 1
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- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical class COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- FUQAGKYWAUZSEJ-UHFFFAOYSA-N 2,3,4,5-tetrabromo-6-(2-hydroxyphenyl)phenol Chemical compound OC1=CC=CC=C1C1=C(O)C(Br)=C(Br)C(Br)=C1Br FUQAGKYWAUZSEJ-UHFFFAOYSA-N 0.000 description 1
- XSXWOBXNYNULJG-UHFFFAOYSA-N 2-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=CC=C1O XSXWOBXNYNULJG-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- KAIRTVANLJFYQS-UHFFFAOYSA-N 2-(3,5-dimethylheptyl)phenol Chemical compound CCC(C)CC(C)CCC1=CC=CC=C1O KAIRTVANLJFYQS-UHFFFAOYSA-N 0.000 description 1
- NFAOATPOYUWEHM-UHFFFAOYSA-N 2-(6-methylheptyl)phenol Chemical compound CC(C)CCCCCC1=CC=CC=C1O NFAOATPOYUWEHM-UHFFFAOYSA-N 0.000 description 1
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
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- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
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- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical class [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical class [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/12—Copolymers of styrene with unsaturated nitriles
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
- C08L69/005—Polyester-carbonates
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
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Abstract
本发明涉及阻燃的热塑性模塑材料,该材料包含:A)5-95 pbw芳族聚碳酸酯或聚酯碳酸酯;B)1-60 pbw至少一种由B.1)和B.2)制成的接枝聚合物:B.1)5-95wt%的一种或几种乙烯基单体,B.2)5-95wt%的至少一种玻璃化转变温度<10℃且平均粒度分布(d50值)为0.05-5μm的接枝基体;C)0-50 pbw热塑性乙烯基共聚物;D)0.5-20 pbw至少一种式(I)的磷化合物,及任选地至少一种不同于式(I)化合物的其它磷化合物;E)0.05-5 pbw氟代聚烯烃。
Description
本发明涉及用磷化合物赋予阻燃性的聚碳酸酯/ABS模塑组合物,该组合物具有卓越的机械性能,特别是高的耐热性。
EP-A-0 640 655描述了由芳族聚碳酸酯、含有苯乙烯的共聚物及接枝共聚物组成的、可使用单和/或低聚磷化合物赋予其阻燃性的模塑组合物。
EP-A-0 363 608描述了由芳族聚碳酸酯、含有苯乙烯的共聚物或接枝共聚物以及作为阻燃添加剂的低聚磷酸酯的阻燃聚合物混合物。对于许多应用,如居室内模塑制品,这些混合物的耐热性通常是不够的。
因此,本发明的目的是提供阻燃的聚碳酸酯/ABS模塑组合物,它们除具有所要求的高水平阻燃性外,还具有卓越的耐热性。
现在已令人惊讶地发现,通过使用根据本发明的单和/或低聚磷化合物可以获得阻燃模塑组合物,该组合物可生产具有非常好的机械性能和卓越的耐热性的模塑体。
因此,本发明提供了阻燃的热塑性模塑组合物,包含
A.5-95,优选10-90,特别是20-80重量份的芳族聚碳酸酯或聚酯碳酸酯,
B.1-60,优选1-40,特别是2-30重量份至少一种B.1接枝在B.2上的接枝聚合物:
B.1 5-95,优选20-60wt%的一种或多种乙烯基单体,
B.2 5-95,优选40-80wt%的一种或多种玻璃化转变温度低于10℃,优选0℃,特别是<-20℃且平均粒度(d50值)为0.05-5μm,优选0.20-0.35μm,特别是0.25-0.30μm的接枝基体,
C.0-50,优选1-30,特别是2-25重量份热塑性乙烯基(共)聚合物,
D.0.5-20,优选1-18,特别是2-15重量份至少一种通式(I)的磷化合物,和任选地下面的式(II)的另外磷化合物:
在式(I)中
A彼此独立地代表卤素,优选氯和/或溴;C1-C8-烷基,优选C1-C4-烷基,特别是甲基;C6-C10-芳基,优选苯基;或C7-C12-芳烷基,优选苯基-C1-C4-烷基,特别是苄基,
R1、R2、R3和R4彼此独立地代表任选卤代的C1-C8-烷基,或C5-C6-环烷基、C6-C20-芳基或C7-C12-芳烷基,每个任选可被卤素和/或C1-C4-烷基取代,
y彼此独立地为0、1、2、3或4,
n每个独立地为0或1,优选为1,
N为0.3-30
在式(II)中,R1、R2、R3、R4、n和N定义如上,并且
X代表含有6-30个碳原子的单核或多核芳族基团;联苯除外,
E.代表0.05-5,优选0.1-1,特别是0.1-0.5重量份氟代聚烯烃,
其中所有组分A+B+C+D+E的重量份的和为100。
组分A
适于本发明组分A的芳族聚碳酸酯和/或芳族聚酯碳酸酯是文献中已知的或可用文献中已知的方法生产(芳族聚碳酸酯的生产方法见例如Schnell的“聚碳酸酯的化学和物理”,IntersciencePublishers,1964和DE-AS 1 495 626、DE-OS 2 232 877、DE-OS 2703 376、DE-OS 2 714 544、DE-OS 3 000 610、DE-OS 3 832 396;芳族聚酯碳酸酯的生产方法见例如DE-OS 3 077 934)。
芳族聚碳酸酯是例如通过相界面方法使双酚与碳酰卤,优选光气,以及/或者与芳族二羧酸二酰卤,优选苯二羧酸二酰卤反应而生产的,任选使用链终止剂,例如单酚,并任选使用三官能团或三个以上官能团的支化剂,例如三苯酚或四苯酚。
制备芳族聚碳酸酯和/或芳族聚酯碳酸酯的双酚优选为式(III)的双酚
其中
A1代表单键、C1-C5-亚烷基、C2-C5-(1,1-)亚烷基、C5-C6-环(1,1-)亚烷基、-O-、-SO-、-CO-、-S-、-SO2-或C6-C12-亚芳基,该基团可稠合到另外可任选包含杂原子的芳环上,或式(IV)的基团,
或(V)的基团
B彼此独立地代表C1-C8-烷基,优选C1-C4-烷基,特别为甲基;卤素,优选氯和/或溴;C6-C10-芳基,优选苯基;C7-C12-芳烷基,或苯基-C1-C4-烷基,优选苄基,
x彼此独立地为0、1或2,
p为1或0,并且
对于每个Z,R5和R6是单独挑选的且彼此独立地代表氢或C1-C6-烷基,优选氢、甲基和/或乙基,
Z为碳,且
m为4-7的整数,优选4或5,条件是在至少一个Z原子上R5和R6均为烷基。
优选的双酚为氢醌、间苯二酚、4,4’-二羟基联苯、二-(羟基苯基)-C1-C5-烷烃、二-(羟基苯基)-C5-C6-环烷烃、二-(羟基苯基)-醚、二-(羟基苯基)-亚砜、二-(羟基苯基)-酮、二-(羟基苯基)-砜、α,α-二(羟基苯基)-二异丙基苯如其环溴代和/或环氯代衍生物。
特别优选的双酚为4,4’-联苯酚、双酚A、2,4-二-(4-羟基苯基)-2-甲基丁烷、1,1-二-(4-羟基苯基)-环己烷、1,1-二-(4-羟基苯基)-3,3,5-三甲基环己烷、4,4’-二羟基二苯基硫醚和4,4’-二羟基二苯基砜及其二和四溴代或氯代衍生物,如2,2-二-(3-氯-4-羟基苯基)-丙烷、2,2-二-(3,5-二氯-4-羟基苯基)-丙烷或2,2-二-(3,5-二溴-4-羟基苯基)-丙烷。
2,2-二-(4-羟基苯基)-丙烷(双酚A)是特别优选的。
双酚可以单独使用或以任意混合物使用。
双酚是文献中已知的或可用文献中已知的方法生产。
制备热塑性芳族聚碳酸酯的适宜链终止剂为例如苯酚、对氯苯酚、对叔丁基苯酚或2,4,6-三溴苯酚,以及根据DE-OS 2 842 005的长链烷基苯酚如4-(1,3-四甲基丁基)-苯酚或烷基取代基中含有8-20个碳原子的单烷基苯酚或二烷基苯酚如3,5-二叔丁基苯酚、对异辛基苯酚、对叔辛基苯酚、对十二碳烷基苯酚和2-(3,5-二甲基庚基)-苯酚及4-(3,5-二甲基庚基)-苯酚。相对具体所用双酚的摩尔数的和,所用链终止剂的量一般为0.5-10mol%。
热塑性芳族聚碳酸酯的重均分子量(Mw,通过超离心或散射光测量方法测定)为10,000-200,000,优选20,000-80,000。
热塑性芳族聚碳酸酯可用已知方法支化,事实上通过引入相对所用双酚之和0.05-2.0mol%的三官能团或三个以上官能团的化合物,如带有三个或更多个酚基团者。
均聚碳酸酯或共聚碳酸酯都是适宜的。为了制备根据本发明组分A的共聚碳酸酯,也可使用1-25wt%,优选2.5-25wt%(相对所用双酚的总量)的具有羟基-芳氧基终端的聚二有机硅氧烷。这些是已知的(见例如美国专利3 419 634)或可由文献中已知的方法生产。在例如DE-OS 3 334 782中描述了含有聚二有机硅氧烷的共聚碳酸酯的制备方法。
除了双酚A均聚碳酸酯外,优选的聚碳酸酯为含有相对双酚摩尔数之和最多15mol%的所述双酚以外的双酚A的共聚碳酸酯作为优选或特别优选的化合物,特别为2,2-二-(3,5-二溴-4-羟基苯基)-丙烷。
制备芳族聚酯碳酸酯的芳族二羧酸二酰卤优选为邻苯二甲酸、对苯二甲酸、二苯基醚-4,4’-二甲酸和萘-2,6-二甲酸的二酰氯。
比例为1∶20-20∶1的邻苯二甲酸二酰氯和对苯二甲酸二酰氯的混合物是特别优选的。
在制备聚酯碳酸酯时也可以使用碳酰卤,优选光气作为双官能团酸衍生物。
除了上述单酚外,制备芳族聚酯碳酸酯的适宜链终止剂为其氯代碳酸酯和芳族单羧酸酰氯,它们可任选被C1-C22-烷基或被卤素原子取代,以及脂族C2-C22-单羧酸酰氯。
在每种情况下链终止剂的量为0.1-10mol%,该量在酚链终止剂的情况下是相对双酚的摩尔数而言,在单羧酸酰氯链终止剂的情况下是相对二羧酸二酰氯的摩尔数而言。
也可将芳族羟基羧酸引入到芳族聚酯碳酸酯中。
芳族聚酯碳酸酯可以是线性的或可以以已知的方法被支化(也可参见DE-OS 2 940 024和DE-OS 3 007 934)。
可以以所述量使用下列化合物作为支化剂:三官能团或三个以上官能团羧酸酰氯如均苯三酸三酰氯、氰尿酸三酰氯、3,3’-4,4’-二苯甲酮四甲酸四酰氯、1,4,5,8-萘四甲酸四酰氯或均苯四甲酸四酰氯,用量为0.01-1.0mol%(相对所用二羧酸二酰氯);或者三官能团或三和以上官能团酚如间苯三酚、4,6-二甲基-2,4,6-三-(4-羟基苯基)-庚烯-2、4,4-二甲基-2,4,6-三-(4-羟基苯基)-庚烷、1,3,5-三-(4-羟基苯基)-苯、1,1,1-三-(4-羟基苯基)-乙烷、三-(4-羟基苯基)-苯基甲烷、2,2-二[4,4-二(4-羟基苯基)-环己基]-丙烷、2,4-二(4-羟基苯基-异丙基)-苯酚、四-(4-羟基苯基)-甲烷、2,6-二(2-羟基-5-甲基苄基)-4-甲基苯酚、2-(4-羟基苯基)-2-(2,4-二羟基苯基)-丙烷、四-(4-[4-羟基苯基异丙基]-苯氧基)-甲烷、1,4-二[4,4’-二羟基三苯基)-甲基]苯,相对所用双酚,用量为0.01-1.0mol%。可先将酚支化剂与双酚一起引入;酸酰氯支化剂可与酸二酰氯一起引入。
在热塑性芳族聚酯碳酸酯中碳酸酯结构单元的比例可为任何值。
相对于酯基团和碳酸酯基团的和,碳酸酯基团的比例优选最多为100mol%,特别最多为80mol%,最优选最多为50mol%。
芳族聚酯碳酸酯中酯和碳酸酯部分可以以嵌段的形式存在,或可无规分布于缩聚聚合物中。
芳族聚酯碳酸酯的相对溶液粘度(ηrel)范围为1.18-1.4,优选1.22-1.3(于25℃在0.5g聚酯碳酸酯在100ml二氯甲烷的溶液中测定)。
热塑性芳族聚碳酸酯和聚酯碳酸酯可分别使用或以彼此的任意混合物使用。
组分B
根据本发明的组分B是接枝聚合物。它们包括具有橡胶弹性性能的接枝共聚物,基本可由下列单体中的至少两种获得:氯丁二烯、1,3-丁二烯、异戊二烯、苯乙烯、丙烯腈、乙烯、丙烯、乙酸乙烯酯和醇组分中含有1-18个碳原子的(甲基)丙烯酸酯;即例如在“有机化学方法”(Houben-Weyl),14/1卷,Georg Thieme Verlag出版社,Stuttgart 1961,393-406页和在C.B.Bucknall的“增韧塑料”,应用科学出版社,伦敦1977中所述的聚合物。优选的聚合物B是部分交联的并且凝胶含量超过20wt%,优选超过40wt%,特别是超过60wt%。
优选的接枝聚合物B为B.1接枝在B.2上的接枝聚合物:
B.1 5-95,优选30-80重量份下列化合物的混合物:
B.1.1 50-99重量份苯乙烯、α-甲基苯乙烯、卤素或甲基环取代苯乙烯、甲基丙烯酸甲酯或这些化合物的混合物,和
B.1.2 1-50重量份丙烯腈、甲基丙烯腈、甲基丙烯酸甲酯、马来酸酐、C1-C4-烷基-或苯基-N-取代马来酰亚胺或这些化合物的混合物,
B.2 5-95,优选20-70重量份的玻璃化转变温度低于-10℃的基于二烯和/或丙烯酸烷基酯的聚合物。
优选的接枝聚合物B为例如用苯乙烯和/或丙烯腈和/或(甲基)丙烯酸烷基酯接枝的基体B.2如聚丁二烯、丁二烯/苯乙烯共聚物和丙烯酸酯橡胶,即DE-OS 1 694 173(=US-PS 3 564 077)所述类型的共聚物;或用丙烯酸烷基酯或甲基丙烯酸烷基酯、乙酸乙烯酯、丙烯腈、苯乙烯和/或其它烷基苯乙烯接枝的聚丁二烯、丁二烯/苯乙烯或丁二烯/丙烯腈共聚物、聚异丁烯或聚异戊二烯,如DE-OS 2 348 377(=US-PS 3 919 353)中所述。
特别优选的聚合物B为例如ABS聚合物,如例如DE-OS 2 035 390(=US-PS 3 644 574)或DE-OS 2 248 242(=GB-PS 1 409 275)中所述。
特别优选的接枝聚合物B是通过下列化合物的接枝反应而获得的:
α相对于接枝聚合物B,10-70,优选15-50,特别是20-40wt%的至少一种(甲基)丙烯酸酯或10-70,优选15-50,特别是20-40wt%由10-50,优选20-35wt%(相对混合物)丙烯腈或(甲基)丙烯酸酯和50-90,优选65-80wt%(相对于混合物)苯乙烯组成的混合物,作为接枝体B.1
β相对于接枝聚合物B,30-90,优选50-85,特别是60-80wt%的丁二烯聚合物(相对于β,含有至少50wt%丁二烯基团),作为接枝基体B.2,
其中接枝基体β的凝胶含量优选至少为70wt%(在甲苯中测定),接枝度G为0.15-0.55并且接枝聚合物B.2的平均颗粒直径d50为0.05-2μm,优选0.1-0.6μm。
(甲基)丙烯酸酯α为丙烯酸或甲基丙烯酸与含有1-18个碳原子的单羟基醇的酯。甲基丙烯酸甲酯、乙酯和丙酯,丙烯酸正丁酯,丙烯酸叔丁酯和甲基丙烯酸叔丁酯是特别优选的。
除了丁二烯基团,接枝基体β可含有相对β最多50wt%的其它烯键式不饱和单体如苯乙烯、丙烯腈、醇组分中含有1-4个碳原子的丙烯酸酯或甲基丙烯酸酯(如丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯)、乙烯基酯和/或乙烯基醚。优选的接枝基体β由纯聚丁二烯组成。
接枝度G为接枝的单体与接枝基体之间的重量比并且是无量纲的。
平均粒度d50为在该直径上下颗粒各占50wt%的直径。它可由超离心测量技术测定(W.Scholtan,H.Lange,Kolloid,Z.und Z.Polymere 250(1972),782-796)。
特别优选的聚合物B也为例如下列化合物的接枝聚合物:
τ.相对于组分B,20-90wt%玻璃化转变温度<-20℃的丙烯酸酯橡胶,作为接枝基体B.2,和
δ.相对于组分B,10-80wt%至少一种可聚合的烯键式不饱和单体,作为接枝单体C.1。
聚合物B中的丙烯酸酯橡胶τ优选为丙烯酸烷基酯的聚合物,任选含有最多40wt%(相对于τ)的其它可聚合烯键式不饱和单体。优选的可聚合丙烯酸酯包括C1-C8-烷基酯,如甲基、乙基、丁基、正辛基和2-乙基己基酯;卤代烷基酯,优选卤代-C1-C8-烷基酯,如氯乙基丙烯酸酯,及这些单体的混合物。
为了将产物交联,可共聚带有一个以上可聚合双键的单体。交联单体的优选实例为含有3-8个碳原子的不饱和单羧酸与含有3-12个碳原子的不饱和单羟基醇或含有2-4个OH基团和2-20个碳原子的饱和多元醇的酯如乙二醇二甲基丙烯酸酯、烯丙基甲基丙烯酸酯;多不饱和杂环化合物如三乙烯基和三烯丙基氰尿酸酯;多官能团乙烯基化合物如二-和三-乙烯基苯;以及三烯丙基磷酸酯和二烯丙基邻苯二甲酸酯。
优选的交联单体为烯丙基甲基丙烯酸酯、乙二醇二甲基丙烯酸酯、二烯丙基邻苯二甲酸酯和含有至少三个烯键式不饱和基团的杂环化合物。
特别优选的交联单体为环单体三烯丙基氰尿酸酯、三烯丙基异氰尿酸酯、三乙烯基氰尿酸酯、三丙烯酰基六氢均三嗪、三烯丙基苯。
相对于接枝基体τ,交联单体的量优选为0.02-5,特别为0.05-2wt%。
在含有至少三个烯键式不饱和基团的环交联单体的情况下,将接枝基体τ的量限定在1wt%以下是有利的。
除丙烯酸酯以外也可任选用来制备接枝基体τ的优选的“其它”可聚合烯键式不饱和单体为例如丙烯腈、苯乙烯、α-甲基苯乙烯、丙烯酰胺、乙烯基-C1-C6-烷基醚、甲基丙烯酸甲酯、丁二烯。优选的作为接枝基体τ的丙烯酸酯橡胶为凝胶含量至少为60wt%的乳液聚合物。
根据B.2另外的适宜接枝基体为带有接枝活性点的硅橡胶,如DE-OS 3 704 657、DE-OS 3 704 655、DE-OS 3 631 540和DE-OS 3631 539中所述。
接枝基体B.2的凝胶含量是在25℃于二甲基甲酰胺中测定的(M.Hoffmann,H.Krmer,R.Kuhn,聚合物分析I和II,GeorgeThieme-Verlag出版社,Stuttgart 1977)。
接枝聚合物B可由已知的方法如本体、悬浮、乳液或本体-乳液法生产。
因为在接枝反应期间,已知接枝单体不能完全彻底地接枝到接枝基体上,所以根据本发明的接枝聚合物B也应理解为是指在接枝基体存在下通过聚合接枝单体而获得的那些产物。
平均粒度d50为在该直径上下颗粒各占50wt%的直径。它可由超离心测量技术测定(W.Scholtan,H.Lange,Kolloid,Z.und Z.Polymere 250(1972),782-1796)。
因为在接枝反应期间,已知接枝单体不能完全彻底地接枝到接枝基体上,所以根据本发明的接枝聚合物B也应理解为是指在接枝基体上,所以根据本发明的接枝聚合物B也应理解为是指在接枝基体存在下通过(共)聚合接枝单体而获得的并且在经过任何后处理过程后仍然存在的那些产物。
组分C
组分C包括至少一种热塑性乙烯基(共)聚合物。
适于用作(共)聚合物C的聚合物为由来自乙烯基芳族化合物、乙烯基氰化物如不饱和腈、(甲基)丙烯酸-C1-C8-烷基酯、不饱和羧酸及其衍生物如不饱和羧酸的酸酐和酰亚胺中的至少一种单体制成的聚合物。
由下列化合物制成的(共)聚合物是特别适宜的:
C.1 50-99重量份乙烯基芳族化合物和/或环取代乙烯基芳族化合物如苯乙烯、α-甲基苯乙烯、对甲基苯乙烯、对氯苯乙烯和/或(甲基)丙烯酸C1-C4-烷基酯如甲基丙烯酸甲酯、甲基丙烯酸乙酯,和
C.2 1-50重量份乙烯基氰化物如不饱和腈,例如丙烯腈和甲基丙烯腈和/或(甲基)丙烯酸的C1-C8-烷基酯,例如甲基丙烯酸甲酯、丙烯酸正丁酯、丙烯酸叔丁酯和/或不饱和羧酸如马来酸和/或衍生物如不饱和羧酸的酸酐和酰亚胺,例如马来酸酐和N-苯基马来酰亚胺。
(共)聚合物C是类似树脂的、热塑性的且不含橡胶。
C.1苯乙烯和C.2丙烯腈的共聚物是特别优选的。
根据组分C的(共)聚合物是已知的并可由自由基聚合,特别是乳液、悬浮、溶液或本体聚合生产。根据组分C的(共)聚合物的分子量Mw(重均,由光散射或沉降法测定)优选为15,000-200,000。
在接枝聚合组分B期间根据组分C的(共)聚合物通常作为副产物来形成,特别是如果将大量单体B.1接枝到少量橡胶B.2上时。根据本发明也可任选地使用的C的量不包括这些接枝聚合B的副产物。
如果组分C存在于模塑组合物中,则组分B∶C的重量比为2∶1-1∶4,优选1∶1-1∶2,以获得特殊应用所要求的机械性能。
组分D
本发明的模塑组合物包含至少一种式(I)的有机磷化合物作为阻燃剂:
在该结构式中,R1、R2、R3、R4和A以及n和y具有上述相同的含义。芳族基团R1、R2、R3和R4及A本身可以被卤素和/或烷基,优选氯、溴和/或C1-C4-烷基取代。特别优选的芳基为甲苯基、苯基、二甲苯基、丙基苯基或丁基苯基及其相应的溴代和氯代衍生物。
N可以具有0.3-30的值,优选0.3-20的平均值,特别优选0.5-10,最优选0.5-6。当存在磷化合物的混合物时,N可具有上面给出的平均值。在该混合物中可包含单磷化合物和/或低聚磷化合物。当N=0时,式(I)描述的是单磷化合物。
部分化合物D(最多75wt%)可被至少一种不同于式(I)化合物的式(II)的单和/或低聚和/或聚磷化合物替代,
其中R1、R2、R3、R4、n和N具有上述相同的含义并且
在式(II)中,X代表含有6-30个碳原子的单核或多核芳族基团,联苯除外。该基团衍生自根据式(III)的双酚如双酚A、间苯二酚或氢醌或其氯代或溴代衍生物。
优选用N值为0.5-10,特别是0.5-6的式(I)的磷化合物、优选式(I)的单和/或低聚磷酸酯的混合物作为组分D。
在混合物中优选选择可产生协同效应的式(I)的单和低聚磷化合物。该混合物一般由10-90wt%式(I)的低聚物和90-10wt%式(I)的单磷化合物组成。优选将12-50,优选14-40,特别是15-40wt%的单磷化合物和/或单磷酸酯化合物与补足量的低聚磷酸酯化合物混合。
适宜的单磷化合物,即N=0者为三丁基磷酸酯、三-(2-氯乙基)-磷酸酯、三-(2,3-二溴丙基)-磷酸酯、三苯基磷酸酯、三甲苯基磷酸酯、二苯基甲苯基磷酸酯、二苯基辛基磷酸酯、二苯基-2-乙基甲苯基磷酸酯、三-(异丙基苯基)-磷酸酯、卤素取代的芳基磷酸酯、甲基膦酸二甲基酯、甲基膦酸二苯基酯、苯基膦酸二乙基酯、三苯基氧化膦和/或三甲苯基氧化膦。
根据组分D的磷化合物一般是已知的有机化合物或可以类似的方式由已知的方法制备(见例如Ullmanns Encyklopdie derTechnischen Chemie,18卷,301及以后各页,179;Houben-Weyl,Methoden der Organischen Chemie,12/1卷,43页;贝恩斯坦,6卷,177页)。
组分E
氟代聚烯烃E是高分子量的聚合物并且玻璃化转变温度超过-30℃,一般超过100℃,氟含量优选为65-76,特别是70-76wt%,平均颗粒直径d50为0.05-1000,优选0.08-20μm。一般而言氟代聚烯烃E的密度为1.2-2.3g/cm3。优选的氟代聚烯烃E为聚四氟乙烯、聚偏二氟乙烯、四氟乙烯/六氟丙烯共聚物和乙烯/四氟乙烯共聚物。这些氟代聚烯烃是已知的(参看Schildknecht的“乙烯基及相关聚合物”,John Wiley & Sons,Inc.,纽约,1962,484-494页;Wall的“氟聚合物”,Wiley Interscience,John Wiley & Sons,Inc.,纽约,13卷,1970,623-654页;“现代塑料百科全书”,1970-1971,47卷,10A期,1970年10月,McGraw-Hill,Inc.,纽约,134和774页;“现代塑料百科全书”,1975-1976,1975年10月,52卷,10A期,McGraw-Hill,Inc.,纽约,27、28和472页及US-PS 3 671487、3 723 373和3 838 092)。
它们可以由已知的方法生产,例如通过在水相介质中使用形成自由基的催化剂如钠、钾或铵过二硫酸盐在7-71kg/cm2的压力和0-200℃,优选20-100℃的温度下聚合四氟乙烯。(进一步的细节见例如美国专利2 393 967)。取决于实际应用的形式,这些材料的密度可为1.2-2.3g/cm3,平均粒度为0.5-1000μm。
本发明优选的氟代聚烯烃E为四氟乙烯聚合物并且平均颗粒直径为0.05-20μm,优选0.08-10μm,且密度为1.2-1.9g/cm3,优选以四氟乙烯聚合物E乳液与接枝聚合物B乳液的凝聚混合物形式使用。
可以以粉末形式使用的适宜氟代聚烯烃E为平均颗粒直径为100-1000μm且密度为2.0-2.3g/cm3的四氟乙烯聚合物。
为了制备B和E的凝聚混合物,首先将接枝聚合物B的水相乳液(乳胶)与氟代聚烯烃E的精细分散乳液混合;适宜的氟代聚烯烃乳液的固体含量一般为30-70wt%,优选为50-60wt%,特别为30-35wt%。
描述组分B的量的数据不包括在接枝聚合物和氟代聚烯烃的凝聚混合物中接枝聚合物的比例。
在乳液混合物中,接枝聚合物B对氟代聚烯烃E的比值为95∶5-60∶40。乳液混合物以已知的方式凝聚,例如通过喷雾干燥、冷冻干燥或通过加入无机或有机盐、酸、碱或与水混溶的有机溶剂如醇或酮凝聚,优选在20-150℃,特别是50-100℃进行。如果需要,可在50-200℃,优选70-100℃进行干燥。
适宜的四氟乙烯聚合物乳液为市售产品并且由例如杜邦公司以Teflon 30N出售。
根据本发明的模塑组合物可包含至少一种常规添加剂,如润滑剂、脱模剂、流动促进剂、成核剂、抗静电剂、稳定剂以及染料、颜料和/或增强材料。适宜的无机增强材料为玻璃纤维(任选已切割或研磨)、玻璃珠、玻璃球,片状增强材料如高岭土、滑石粉、云母、碳纤维。优选长度为1-10mm且直径<20μm的切割或研磨玻璃纤维以1-40重量份的量优选用作增强材料;优选对玻璃纤维进行表面处理。
本发明的模塑组合物也可包含至少一种极性化合物作为非常精细的无机粉末,该化合物为至少一种周期表1-5主族或1-8副族的金属与至少一种选自氧、硫、硼、碳、磷、氮、氢和硅的元素的化合物。优选用氧化物或氢氧化物,优选TiO2,SiO2,SnO2,ZnO,勃姆石,ZrO2,Al2O3,氧化铁,它们的混合物及掺杂化合物作为极性化合物,特别是勃姆石或TiO2,它们的平均颗粒直径小于200nm,优选0.1-100nm,特别是1-50nm。
根据本发明的模塑组合物可包含相对于整个模塑组合物而言占0.01-35重量%的至少一种另外的阻燃剂。
根据本发明的模塑组合物可包含一种或多种另外任选地具有协同效应的阻燃剂。以下列举了另外的阻燃剂:有机卤化物如十溴二苯醚、四溴二苯酚,无机卤化物如溴化铵,氮化合物如蜜胺、蜜胺甲醛树脂,无机氢氧化物如氢氧化镁或铝,无机化合物如氧化锑、偏硼酸钡、羟锑酸盐、氧化锆、氢氧化锆、氧化钼、钼酸铵、硼酸锌、硼酸铵和氧化锡以及硅氧烷化合物。这些阻燃剂一般以最多20wt%的量(相对于总模塑组合物)加入。
根据本发明包含组分A-E和任选地其它已知的添加剂如稳定剂、染料、颜料、润滑剂和脱模剂、成核剂、小颗粒及抗静电剂和增强材料及阻燃剂的模塑组合物是通过以已知的方法混合各组分并在200-300℃于常规加工设备如密炼机、挤出机和双轴螺杆设备中熔融配混或熔融挤塑而生产的,其中组分E优选以上述凝聚混合物的形式使用。
可以以已知的方法连续或同时混合各个组分,事实上是在约20℃(室温)或更高的温度进行。
本发明的模塑组合物可用来生产任何类型的模塑体。模塑体可特别由注塑法生产。可制备的模塑体的实例为:各种居室部件,例如家庭用品如榨汁机、咖啡机、搅拌机,办公室机器如监视器、打印机或复印机,或建筑部件的面板及机动车辆部件。这些模塑体也可用于电机工程领域,因为它们具有非常好的电性能。
这些模塑组合物特别适于生产对所用塑料的耐热性有特别高限制要求的模塑部件。
另一种加工形式为通过热成型由先前制备的板材或薄膜来生产模塑体。
本发明还提供了本发明的模塑组合物在生产各种模塑体、优选上述类型模塑体方面的应用,以及由本发明模塑组合物制成的模塑体。
实施例
组分A
相对溶液粘度为1.252的基于双酚A的线性聚碳酸酯,粘度是以CH2Cl2为溶剂在25℃和浓度为0.5g/100ml时测定的。
组分B
45重量份苯乙烯和丙烯腈以72∶28的比例的共聚物在55重量份颗粒状交联聚丁二烯橡胶(平均颗粒直径d50=0.4μm)上的接枝聚合物,通过乳液聚合生产。
组分C
苯乙烯/丙烯腈重量比为72∶28且特性粘度为0.55dl/g(于20℃在二甲基甲酰胺中测定)的苯乙烯/丙烯腈共聚物。
组分D
D1
D2作为对比例
由Akzo公司提供的Fyrolflex RDP,基于间亚苯基双二苯基磷酸酯。
组分E
作为由根据上述组分C的SAN接枝聚合物在水中的乳液和四氟乙烯聚合物在水中的乳液形成的凝聚混合物的四氟乙烯聚合物。混合物中接枝聚合物C与四氟乙烯聚合物E的重量比为90wt%比10wt%。四氟乙烯聚合物乳液的固体含量为60wt%,平均颗粒直径为0.05-0.5μm。SAN接枝聚合物乳液的固体含量为34wt%,平均乳胶颗粒直径为0.4μm。
E的制备
将四氟乙烯聚合物(Teflon 30N,杜邦公司提供)乳液与SAN接枝聚合物C乳液混合并用占聚合物固体1.8wt%的酚类抗氧剂稳定。在85-95℃用MgSO4(泻盐)水溶液和乙酸在pH为4-5时凝聚混合物,过滤并洗涤直到基本不含电解质;然后离心除去大部分水并在100℃将混合物干燥为粉末。随后可将该粉末与其它组分在所述加工设备中进行复配。
制备并试验本发明的模塑组合物
在3升密炼机中混合组分A-E。于260℃在Arburg 270E型注塑机中制备模塑体。
根据ISO180 1A方法于室温在80×10×4mm3棒上测定缺口抗冲击性。
根据DIN 53 460测定Vicat B软化点。
本体温度为260℃时在80×10×4mm3棒上测试应力开裂特性。用60vol%甲苯和40vol%异丙醇的混合物作为测试介质。通过圆弧模板将样品预拉伸并于室温存放在测试介质中5或10分钟,预拉伸度δx为0.2-2.4%。通过作为预拉伸度函数的断裂或裂纹形成来评价应力开裂特性。
试验材料的组成和所得数据归纳在下表中。
表1 聚碳酸酯/ABS模塑组合物的组成和性能
实施例 1 2 3
对比例
组分
(重量份)
A 66.7 66.7 66.7
B 7.3 7.3 7.3
C 9.4 9.4 9.4
D1 - 12.0 14.0
D2 12.0 - -
E 4.2 4.2 4.2
脱模剂 0.4 0.4 0.4
性能:
Vicat B120(℃) 94 115 112
缺口抗冲击性:
(kJ/m2) 42 59 60
侯化龟裂行为
10min/2.4% 无裂纹
5min/2.4% BR 5:00
5min/1.6% BR 5:00
从表中可见根据本发明的模塑组合物具有非常好的机械性能、特别是抗应力开裂性的改进、缺口抗冲击性和耐热性的组合。
Claims (14)
1.阻燃热塑性模塑组合物,包含
A 5-95重量份芳族聚碳酸酯或聚酯碳酸酯,
B 1-60重量份B.1接枝在B.2上的接枝聚合物:
B.1 5-95wt%的一种或多种乙烯基单体,
B.2 5-95wt%的一种或多种玻璃化转变温度<10℃且平均粒度(d50值)为0.05-5μm的接枝基体,
C 0-50重量份热塑性乙烯基(共)聚合物,
D 0.5-20重量份通式(I)的磷化合物,和任选地一种或多种式(II)的另外的磷化合物:
在式(I)中
A彼此独立地代表卤素或C1-C8-烷基,C6-C10-芳基,C7-C12-芳烷基,
R1、R2、R3和R4彼此独立地代表任选卤代的C1-C8-烷基,或C5-C6-环烷基、C6-C20-芳基或C7-C12-芳烷基,每个可任选被卤素和/或C1-C4-烷基取代,
y彼此独立地为0、1、2、3或4,
n每个独立地为0或1,
N为0.3-30,
在式(II)中,R1、R2、R3、R4、n和N定义如上,并且
X在式(II)中代表含有6-30个碳原子的单核或多核芳族基团,联苯除外,
E 0.05-5重量份氟代聚烯烃,
其中在模塑组合物中所有组分的重量份之和为100。
2.根据权利要求1的模塑组合物,其中式(I)的磷化合物具有0.3-20的平均N值。
3.根据权利要求1或2的模塑组合物,其中在式(II)中X衍生自双酚A、间苯二酚或氢醌。
4.根据权利要求1或2的模塑组合物,其中式(II)的磷化合物为三丁基磷酸酯、三-(2-氯乙基)-磷酸酯、三-(2,3-二溴丙基)-磷酸酯、三苯基磷酸酯、三甲苯基磷酸酯、二苯基甲苯基磷酸酯、二苯基辛基磷酸酯、二苯基-2-乙基甲苯基磷酸酯、三-(异丙基苯基)-磷酸酯、卤素取代的芳基磷酸酯、甲基膦酸二甲基酯、甲基膦酸二苯基酯、苯基膦酸二乙基酯、三苯基氧化膦或三甲苯基氧化膦。
5.根据权利要求1或2的模塑组合物,其中式(I)及任选地式(II)的磷化合物为N取0.5-10平均值的磷化合物的混合物。
6.根据权利要求1或2的模塑组合物,其中氟代聚烯烃E是高分子量的聚合物,氟含量为65-76wt%,平均颗粒直径d50为0.08-20μm且密度为1.2-2.3g/cm3。
7.根据权利要求1或2的模塑组合物,所述组合物包含相对于整个模塑组合物而言占0.01-35wt%的至少一种另外的阻燃剂。
8.根据权利要求1或2的模塑组合物,该组合物包含10-90重量份组分A、1-40重量份组分B和1-18重量份组分D。
9.根据权利要求8的模塑组合物,该组合物包含20-80重量份组分A、2-30重量份组分B和2-15重量份组分D。
10.根据权利要求1或2的模塑组合物,其中接枝基体B.2为二烯橡胶、丙烯酸酯橡胶、硅橡胶或乙烯/丙烯/二烯橡胶。
11.根据权利要求1或2的模塑组合物,该组合物包含元素周期表1-5主族或1-8副族元素与至少一种选自氧、硫、硼、碳、磷、氮、氢和硅的元素的非常精细的化合物。
12.根据权利要求1或2的模塑组合物,该组合物包含至少一种来自稳定剂、颜料、脱模剂、流动促进剂、无机增强材料、小颗粒和/或抗静电剂的添加剂。
13.权利要求1-12之一的模塑组合物在生产模塑体方面的应用。
14.由权利要求1-12之一的模塑组合物制成的模塑体。
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-
1997
- 1997-08-11 DE DE19734663A patent/DE19734663A1/de not_active Withdrawn
-
1998
- 1998-07-27 TW TW087112203A patent/TW517071B/zh not_active IP Right Cessation
- 1998-07-29 BR BR9811887-0A patent/BR9811887A/pt not_active IP Right Cessation
- 1998-07-29 KR KR1020007001368A patent/KR100554585B1/ko not_active IP Right Cessation
- 1998-07-29 DK DK98943796T patent/DK1003808T3/da active
- 1998-07-29 EP EP98943796A patent/EP1003808B1/de not_active Expired - Lifetime
- 1998-07-29 AU AU91568/98A patent/AU9156898A/en not_active Abandoned
- 1998-07-29 ES ES98943796T patent/ES2175766T3/es not_active Expired - Lifetime
- 1998-07-29 CN CNB988080842A patent/CN1153805C/zh not_active Expired - Lifetime
- 1998-07-29 US US09/485,284 patent/US6566428B1/en not_active Expired - Lifetime
- 1998-07-29 DE DE59804070T patent/DE59804070D1/de not_active Expired - Lifetime
- 1998-07-29 JP JP2000506270A patent/JP4257688B2/ja not_active Expired - Lifetime
- 1998-07-29 WO PCT/EP1998/004733 patent/WO1999007779A1/de active IP Right Grant
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Also Published As
Publication number | Publication date |
---|---|
TW517071B (en) | 2003-01-11 |
DE59804070D1 (de) | 2002-06-13 |
CA2300218A1 (en) | 1999-02-18 |
US6566428B1 (en) | 2003-05-20 |
DK1003808T3 (da) | 2002-08-26 |
AU9156898A (en) | 1999-03-01 |
ES2175766T3 (es) | 2002-11-16 |
EP1003808A1 (de) | 2000-05-31 |
EP1003808B1 (de) | 2002-05-08 |
DE19734663A1 (de) | 1999-02-18 |
WO1999007779A1 (de) | 1999-02-18 |
JP2001512766A (ja) | 2001-08-28 |
CA2300218C (en) | 2007-11-20 |
HK1030619A1 (en) | 2001-05-11 |
JP4257688B2 (ja) | 2009-04-22 |
CN1266450A (zh) | 2000-09-13 |
BR9811887A (pt) | 2000-08-22 |
KR20010022768A (ko) | 2001-03-26 |
KR100554585B1 (ko) | 2006-03-03 |
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