CN115176416A - 弹性波器件 - Google Patents

弹性波器件 Download PDF

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Publication number
CN115176416A
CN115176416A CN202180017384.6A CN202180017384A CN115176416A CN 115176416 A CN115176416 A CN 115176416A CN 202180017384 A CN202180017384 A CN 202180017384A CN 115176416 A CN115176416 A CN 115176416A
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CN
China
Prior art keywords
film
wavelength
acoustic
thickness
piezoelectric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180017384.6A
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English (en)
Chinese (zh)
Inventor
门田道雄
田中秀治
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Tohoku University NUC
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Tohoku University NUC
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Filing date
Publication date
Application filed by Tohoku University NUC filed Critical Tohoku University NUC
Publication of CN115176416A publication Critical patent/CN115176416A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202180017384.6A 2020-02-28 2021-02-12 弹性波器件 Pending CN115176416A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-034101 2020-02-28
JP2020034101 2020-02-28
PCT/JP2021/005129 WO2021172032A1 (ja) 2020-02-28 2021-02-12 弾性波デバイス

Publications (1)

Publication Number Publication Date
CN115176416A true CN115176416A (zh) 2022-10-11

Family

ID=77491467

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180017384.6A Pending CN115176416A (zh) 2020-02-28 2021-02-12 弹性波器件

Country Status (4)

Country Link
US (1) US12334900B2 (https=)
JP (1) JPWO2021172032A1 (https=)
CN (1) CN115176416A (https=)
WO (1) WO2021172032A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7527604B2 (ja) * 2019-08-08 2024-08-05 国立大学法人東北大学 弾性波デバイス
WO2023085210A1 (ja) * 2021-11-09 2023-05-19 京セラ株式会社 弾性波装置、フィルタ、分波器及び通信装置
JP7829370B2 (ja) * 2022-03-17 2026-03-13 太陽誘電株式会社 弾性波デバイス、フィルタ、およびマルチプレクサ
WO2025052739A1 (ja) * 2023-09-06 2025-03-13 国立大学法人東北大学 弾性波デバイス
WO2026070989A1 (ja) * 2024-09-25 2026-04-02 株式会社村田製作所 弾性波装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838090A (en) * 1995-02-09 1998-11-17 Sumitomo Electric Industries, Ltd. Surface acoustic wave device
JPH11220352A (ja) * 1998-02-03 1999-08-10 Seiko Epson Corp ３次オーバートーンｓａｗ共振子
WO2012102270A1 (ja) * 2011-01-27 2012-08-02 日東電工株式会社 半導体装置の製造方法
US20140152146A1 (en) * 2010-12-24 2014-06-05 Murata Manufacturing Co., Ltd. Elastic wave device and method for manufacturing the same
US20140169577A1 (en) * 2011-08-12 2014-06-19 Trigence Semiconductor, Inc. Drive circuit
WO2016047255A1 (ja) * 2014-09-26 2016-03-31 国立大学法人東北大学 弾性波装置
CN106209007A (zh) * 2010-12-24 2016-12-07 株式会社村田制作所 弹性波装置及其制造方法
CN108039872A (zh) * 2017-12-26 2018-05-15 海宁市瑞宏科技有限公司 一种用于高性能声表面波滤波器的谐振器结构设计
CN110114974A (zh) * 2016-11-25 2019-08-09 国立大学法人东北大学 弹性波器件
CN110120794A (zh) * 2018-02-07 2019-08-13 株式会社村田制作所 弹性波装置、高频前端电路以及通信装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102217194A (zh) * 2008-11-18 2011-10-12 株式会社村田制作所 可调滤波器
FR2947398B1 (fr) * 2009-06-30 2013-07-05 Commissariat Energie Atomique Dispositif resonant a ondes acoustiques guidees et procede de realisation du dispositif
JP5354020B2 (ja) * 2009-10-13 2013-11-27 株式会社村田製作所 弾性表面波装置
FI123640B (fi) 2010-04-23 2013-08-30 Teknologian Tutkimuskeskus Vtt Laajakaistainen akustisesti kytketty ohutkalvo-BAW-suodin
WO2014090302A1 (en) * 2012-12-12 2014-06-19 Epcos Ag Electroacoustic component
US10938367B2 (en) * 2016-03-31 2021-03-02 Qorvo Us, Inc. Solidly mounted layer thin film device with grounding layer
JP2018182615A (ja) 2017-04-18 2018-11-15 株式会社村田製作所 弾性波装置
US12401342B2 (en) * 2019-04-03 2025-08-26 Tohoku University High-order mode surface acoustic wave devices
US11223341B2 (en) * 2019-10-22 2022-01-11 Vtt Technical Research Centre Of Finland Ltd Suppressing parasitic sidebands in lateral bulk acoustic wave resonators

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838090A (en) * 1995-02-09 1998-11-17 Sumitomo Electric Industries, Ltd. Surface acoustic wave device
JPH11220352A (ja) * 1998-02-03 1999-08-10 Seiko Epson Corp ３次オーバートーンｓａｗ共振子
US20140152146A1 (en) * 2010-12-24 2014-06-05 Murata Manufacturing Co., Ltd. Elastic wave device and method for manufacturing the same
CN106209007A (zh) * 2010-12-24 2016-12-07 株式会社村田制作所 弹性波装置及其制造方法
WO2012102270A1 (ja) * 2011-01-27 2012-08-02 日東電工株式会社 半導体装置の製造方法
US20140169577A1 (en) * 2011-08-12 2014-06-19 Trigence Semiconductor, Inc. Drive circuit
WO2016047255A1 (ja) * 2014-09-26 2016-03-31 国立大学法人東北大学 弾性波装置
CN110114974A (zh) * 2016-11-25 2019-08-09 国立大学法人东北大学 弹性波器件
CN108039872A (zh) * 2017-12-26 2018-05-15 海宁市瑞宏科技有限公司 一种用于高性能声表面波滤波器的谐振器结构设计
CN110120794A (zh) * 2018-02-07 2019-08-13 株式会社村田制作所 弹性波装置、高频前端电路以及通信装置

Also Published As

Publication number Publication date
US20230361752A1 (en) 2023-11-09
WO2021172032A1 (ja) 2021-09-02
US12334900B2 (en) 2025-06-17
JPWO2021172032A1 (https=) 2021-09-02

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