JPWO2021172032A1 - - Google Patents

Info

Publication number
JPWO2021172032A1
JPWO2021172032A1 JP2022503254A JP2022503254A JPWO2021172032A1 JP WO2021172032 A1 JPWO2021172032 A1 JP WO2021172032A1 JP 2022503254 A JP2022503254 A JP 2022503254A JP 2022503254 A JP2022503254 A JP 2022503254A JP WO2021172032 A1 JPWO2021172032 A1 JP WO2021172032A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022503254A
Other languages
Japanese (ja)
Other versions
JPWO2021172032A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021172032A1 publication Critical patent/JPWO2021172032A1/ja
Publication of JPWO2021172032A5 publication Critical patent/JPWO2021172032A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • H03H9/02559Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • H03H9/02574Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/145Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2022503254A 2020-02-28 2021-02-12 Pending JPWO2021172032A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020034101 2020-02-28
PCT/JP2021/005129 WO2021172032A1 (ja) 2020-02-28 2021-02-12 弾性波デバイス

Publications (2)

Publication Number Publication Date
JPWO2021172032A1 true JPWO2021172032A1 (https=) 2021-09-02
JPWO2021172032A5 JPWO2021172032A5 (https=) 2023-11-20

Family

ID=77491467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022503254A Pending JPWO2021172032A1 (https=) 2020-02-28 2021-02-12

Country Status (4)

Country Link
US (1) US12334900B2 (https=)
JP (1) JPWO2021172032A1 (https=)
CN (1) CN115176416A (https=)
WO (1) WO2021172032A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7527604B2 (ja) * 2019-08-08 2024-08-05 国立大学法人東北大学 弾性波デバイス
WO2023085210A1 (ja) * 2021-11-09 2023-05-19 京セラ株式会社 弾性波装置、フィルタ、分波器及び通信装置
JP7829370B2 (ja) * 2022-03-17 2026-03-13 太陽誘電株式会社 弾性波デバイス、フィルタ、およびマルチプレクサ
WO2025052739A1 (ja) * 2023-09-06 2025-03-13 国立大学法人東北大学 弾性波デバイス
WO2026070989A1 (ja) * 2024-09-25 2026-04-02 株式会社村田製作所 弾性波装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220352A (ja) * 1998-02-03 1999-08-10 Seiko Epson Corp 3次オーバートーンsaw共振子
JP2011015397A (ja) * 2009-06-30 2011-01-20 Commissariat A L'energie Atomique Et Aux Energies Alternatives 導波型音響波共振装置およびその装置の製造方法
WO2012086441A1 (ja) * 2010-12-24 2012-06-28 株式会社村田製作所 弾性波装置及びその製造方法
JP2013528996A (ja) * 2010-04-23 2013-07-11 テクノロジアン テュトキムスケスクス ヴェーテーテー 広帯域音響結合薄膜bawフィルタ
JP2015537492A (ja) * 2012-12-12 2015-12-24 エプコス アクチエンゲゼルシャフトEpcos Ag 電子音響部品
WO2016047255A1 (ja) * 2014-09-26 2016-03-31 国立大学法人東北大学 弾性波装置
WO2020204045A1 (ja) * 2019-04-03 2020-10-08 国立大学法人東北大学 高次モード弾性表面波デバイス

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3204290B2 (ja) * 1995-02-09 2001-09-04 住友電気工業株式会社 表面弾性波素子
CN102217194A (zh) * 2008-11-18 2011-10-12 株式会社村田制作所 可调滤波器
JP5354020B2 (ja) * 2009-10-13 2013-11-27 株式会社村田製作所 弾性表面波装置
CN106209007B (zh) * 2010-12-24 2019-07-05 株式会社村田制作所 弹性波装置
JP5592811B2 (ja) * 2011-01-27 2014-09-17 日東電工株式会社 半導体装置の製造方法
CN103733642B (zh) * 2011-08-12 2016-12-14 株式会社特瑞君思半导体 驱动电路
US10938367B2 (en) * 2016-03-31 2021-03-02 Qorvo Us, Inc. Solidly mounted layer thin film device with grounding layer
US11258427B2 (en) * 2016-11-25 2022-02-22 Tohoku University Acoustic wave devices
JP2018182615A (ja) 2017-04-18 2018-11-15 株式会社村田製作所 弾性波装置
CN108039872A (zh) * 2017-12-26 2018-05-15 海宁市瑞宏科技有限公司 一种用于高性能声表面波滤波器的谐振器结构设计
JP2019140456A (ja) * 2018-02-07 2019-08-22 株式会社村田製作所 弾性波装置、高周波フロントエンド回路及び通信装置
US11223341B2 (en) * 2019-10-22 2022-01-11 Vtt Technical Research Centre Of Finland Ltd Suppressing parasitic sidebands in lateral bulk acoustic wave resonators

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220352A (ja) * 1998-02-03 1999-08-10 Seiko Epson Corp 3次オーバートーンsaw共振子
JP2011015397A (ja) * 2009-06-30 2011-01-20 Commissariat A L'energie Atomique Et Aux Energies Alternatives 導波型音響波共振装置およびその装置の製造方法
JP2013528996A (ja) * 2010-04-23 2013-07-11 テクノロジアン テュトキムスケスクス ヴェーテーテー 広帯域音響結合薄膜bawフィルタ
WO2012086441A1 (ja) * 2010-12-24 2012-06-28 株式会社村田製作所 弾性波装置及びその製造方法
JP2015537492A (ja) * 2012-12-12 2015-12-24 エプコス アクチエンゲゼルシャフトEpcos Ag 電子音響部品
WO2016047255A1 (ja) * 2014-09-26 2016-03-31 国立大学法人東北大学 弾性波装置
WO2020204045A1 (ja) * 2019-04-03 2020-10-08 国立大学法人東北大学 高次モード弾性表面波デバイス

Also Published As

Publication number Publication date
US20230361752A1 (en) 2023-11-09
CN115176416A (zh) 2022-10-11
WO2021172032A1 (ja) 2021-09-02
US12334900B2 (en) 2025-06-17

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