JPWO2021172032A1 - - Google Patents
Info
- Publication number
- JPWO2021172032A1 JPWO2021172032A1 JP2022503254A JP2022503254A JPWO2021172032A1 JP WO2021172032 A1 JPWO2021172032 A1 JP WO2021172032A1 JP 2022503254 A JP2022503254 A JP 2022503254A JP 2022503254 A JP2022503254 A JP 2022503254A JP WO2021172032 A1 JPWO2021172032 A1 JP WO2021172032A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020034101 | 2020-02-28 | ||
| PCT/JP2021/005129 WO2021172032A1 (ja) | 2020-02-28 | 2021-02-12 | 弾性波デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021172032A1 true JPWO2021172032A1 (https=) | 2021-09-02 |
| JPWO2021172032A5 JPWO2021172032A5 (https=) | 2023-11-20 |
Family
ID=77491467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022503254A Pending JPWO2021172032A1 (https=) | 2020-02-28 | 2021-02-12 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12334900B2 (https=) |
| JP (1) | JPWO2021172032A1 (https=) |
| CN (1) | CN115176416A (https=) |
| WO (1) | WO2021172032A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7527604B2 (ja) * | 2019-08-08 | 2024-08-05 | 国立大学法人東北大学 | 弾性波デバイス |
| WO2023085210A1 (ja) * | 2021-11-09 | 2023-05-19 | 京セラ株式会社 | 弾性波装置、フィルタ、分波器及び通信装置 |
| JP7829370B2 (ja) * | 2022-03-17 | 2026-03-13 | 太陽誘電株式会社 | 弾性波デバイス、フィルタ、およびマルチプレクサ |
| WO2025052739A1 (ja) * | 2023-09-06 | 2025-03-13 | 国立大学法人東北大学 | 弾性波デバイス |
| WO2026070989A1 (ja) * | 2024-09-25 | 2026-04-02 | 株式会社村田製作所 | 弾性波装置 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11220352A (ja) * | 1998-02-03 | 1999-08-10 | Seiko Epson Corp | 3次オーバートーンsaw共振子 |
| JP2011015397A (ja) * | 2009-06-30 | 2011-01-20 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | 導波型音響波共振装置およびその装置の製造方法 |
| WO2012086441A1 (ja) * | 2010-12-24 | 2012-06-28 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
| JP2013528996A (ja) * | 2010-04-23 | 2013-07-11 | テクノロジアン テュトキムスケスクス ヴェーテーテー | 広帯域音響結合薄膜bawフィルタ |
| JP2015537492A (ja) * | 2012-12-12 | 2015-12-24 | エプコス アクチエンゲゼルシャフトEpcos Ag | 電子音響部品 |
| WO2016047255A1 (ja) * | 2014-09-26 | 2016-03-31 | 国立大学法人東北大学 | 弾性波装置 |
| WO2020204045A1 (ja) * | 2019-04-03 | 2020-10-08 | 国立大学法人東北大学 | 高次モード弾性表面波デバイス |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3204290B2 (ja) * | 1995-02-09 | 2001-09-04 | 住友電気工業株式会社 | 表面弾性波素子 |
| CN102217194A (zh) * | 2008-11-18 | 2011-10-12 | 株式会社村田制作所 | 可调滤波器 |
| JP5354020B2 (ja) * | 2009-10-13 | 2013-11-27 | 株式会社村田製作所 | 弾性表面波装置 |
| CN106209007B (zh) * | 2010-12-24 | 2019-07-05 | 株式会社村田制作所 | 弹性波装置 |
| JP5592811B2 (ja) * | 2011-01-27 | 2014-09-17 | 日東電工株式会社 | 半導体装置の製造方法 |
| CN103733642B (zh) * | 2011-08-12 | 2016-12-14 | 株式会社特瑞君思半导体 | 驱动电路 |
| US10938367B2 (en) * | 2016-03-31 | 2021-03-02 | Qorvo Us, Inc. | Solidly mounted layer thin film device with grounding layer |
| US11258427B2 (en) * | 2016-11-25 | 2022-02-22 | Tohoku University | Acoustic wave devices |
| JP2018182615A (ja) | 2017-04-18 | 2018-11-15 | 株式会社村田製作所 | 弾性波装置 |
| CN108039872A (zh) * | 2017-12-26 | 2018-05-15 | 海宁市瑞宏科技有限公司 | 一种用于高性能声表面波滤波器的谐振器结构设计 |
| JP2019140456A (ja) * | 2018-02-07 | 2019-08-22 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
| US11223341B2 (en) * | 2019-10-22 | 2022-01-11 | Vtt Technical Research Centre Of Finland Ltd | Suppressing parasitic sidebands in lateral bulk acoustic wave resonators |
-
2021
- 2021-02-12 WO PCT/JP2021/005129 patent/WO2021172032A1/ja not_active Ceased
- 2021-02-12 CN CN202180017384.6A patent/CN115176416A/zh active Pending
- 2021-02-12 US US17/801,886 patent/US12334900B2/en active Active
- 2021-02-12 JP JP2022503254A patent/JPWO2021172032A1/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11220352A (ja) * | 1998-02-03 | 1999-08-10 | Seiko Epson Corp | 3次オーバートーンsaw共振子 |
| JP2011015397A (ja) * | 2009-06-30 | 2011-01-20 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | 導波型音響波共振装置およびその装置の製造方法 |
| JP2013528996A (ja) * | 2010-04-23 | 2013-07-11 | テクノロジアン テュトキムスケスクス ヴェーテーテー | 広帯域音響結合薄膜bawフィルタ |
| WO2012086441A1 (ja) * | 2010-12-24 | 2012-06-28 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
| JP2015537492A (ja) * | 2012-12-12 | 2015-12-24 | エプコス アクチエンゲゼルシャフトEpcos Ag | 電子音響部品 |
| WO2016047255A1 (ja) * | 2014-09-26 | 2016-03-31 | 国立大学法人東北大学 | 弾性波装置 |
| WO2020204045A1 (ja) * | 2019-04-03 | 2020-10-08 | 国立大学法人東北大学 | 高次モード弾性表面波デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230361752A1 (en) | 2023-11-09 |
| CN115176416A (zh) | 2022-10-11 |
| WO2021172032A1 (ja) | 2021-09-02 |
| US12334900B2 (en) | 2025-06-17 |
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