CN115136302B - 散热构件 - Google Patents

散热构件

Info

Publication number
CN115136302B
CN115136302B CN202180014916.0A CN202180014916A CN115136302B CN 115136302 B CN115136302 B CN 115136302B CN 202180014916 A CN202180014916 A CN 202180014916A CN 115136302 B CN115136302 B CN 115136302B
Authority
CN
China
Prior art keywords
holes
hole
intermediate member
working fluid
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180014916.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN115136302A (zh
Inventor
阿部裕一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN115136302A publication Critical patent/CN115136302A/zh
Application granted granted Critical
Publication of CN115136302B publication Critical patent/CN115136302B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202180014916.0A 2020-02-26 2021-02-25 散热构件 Active CN115136302B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2020-031049 2020-02-26
JP2020031049 2020-02-26
JP2020-031035 2020-02-26
JP2020031059 2020-02-26
JP2020031035 2020-02-26
JP2020-031059 2020-02-26
PCT/JP2021/007216 WO2021172479A1 (ja) 2020-02-26 2021-02-25 放熱部材

Publications (2)

Publication Number Publication Date
CN115136302A CN115136302A (zh) 2022-09-30
CN115136302B true CN115136302B (zh) 2025-12-23

Family

ID=77491710

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180014916.0A Active CN115136302B (zh) 2020-02-26 2021-02-25 散热构件

Country Status (5)

Country Link
US (1) US12292238B2 (https=)
EP (1) EP4113596A4 (https=)
JP (4) JP7451678B2 (https=)
CN (1) CN115136302B (https=)
WO (1) WO2021172479A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7593793B2 (ja) * 2020-11-26 2024-12-03 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
JP2022110792A (ja) * 2021-01-19 2022-07-29 株式会社デンソー 沸騰冷却装置およびその製造方法
CN218483134U (zh) * 2022-01-25 2023-02-14 株式会社村田制作所 热扩散器件以及电子设备
CN218483131U (zh) * 2022-01-25 2023-02-14 株式会社村田制作所 热扩散器件和电子设备
CN121039807A (zh) * 2023-04-24 2025-11-28 三菱电机株式会社 冷却器
WO2026048992A1 (ja) * 2024-08-29 2026-03-05 京セラ株式会社 熱デバイス

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108882644A (zh) * 2018-07-25 2018-11-23 奇鋐科技股份有限公司 散热单元

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729335Y2 (https=) * 1976-09-18 1982-06-26
JPS5818596B2 (ja) * 1976-11-12 1983-04-13 日本特殊陶業株式会社 セラミツク伝熱板および該伝熱板の製造方法
JPS5732613Y2 (https=) * 1976-12-31 1982-07-17
JPS5729318Y2 (https=) * 1977-04-19 1982-06-26
JPS59173690A (ja) 1983-03-18 1984-10-01 Ngk Spark Plug Co Ltd ヒ−トパイプ構造ｉｃ基板
JP2000031363A (ja) * 1998-07-09 2000-01-28 Honda Motor Co Ltd ヒートシンクおよび該ヒートシンクが配設された基板
JP2002039693A (ja) * 2000-07-21 2002-02-06 Toufuji Denki Kk フラット型ヒートパイプ
JP4088079B2 (ja) * 2002-02-12 2008-05-21 ティーエス ヒートロニクス 株式会社 プレート型ヒートパイプ
US7775261B2 (en) * 2002-02-26 2010-08-17 Mikros Manufacturing, Inc. Capillary condenser/evaporator
DE10253457B3 (de) * 2002-11-16 2004-07-22 Stiebel Eltron Gmbh & Co. Kg Wärmeübertragungswandung
US20050287044A1 (en) * 2004-06-24 2005-12-29 International Business Machines Corporation Test apparatus and method
WO2007019558A2 (en) * 2005-08-09 2007-02-15 The Regents Of The University Of California Nanostructured micro heat pipes
JP4112602B2 (ja) 2005-09-01 2008-07-02 株式会社渕上ミクロ ヒートパイプ
WO2007029359A1 (en) 2005-09-01 2007-03-15 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
JP4874664B2 (ja) 2006-02-08 2012-02-15 株式会社フジクラ ヒートパイプ
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
EP2003703A2 (en) 2006-04-03 2008-12-17 Fuchigami Micro Co.,Ltd. Heat pipe
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
JP4557055B2 (ja) * 2008-06-25 2010-10-06 ソニー株式会社 熱輸送デバイス及び電子機器
JP5334288B2 (ja) 2008-09-05 2013-11-06 日本モレックス株式会社 ヒートパイプおよび電子機器
JP5455503B2 (ja) 2009-08-11 2014-03-26 モレックス インコーポレイテド 熱輸送ユニット、電子機器
JP2011096994A (ja) 2009-09-29 2011-05-12 Kyocera Corp 冷却器、配線基板、および発光体
JP2011124456A (ja) * 2009-12-12 2011-06-23 Molex Inc 冷却装置、電子機器
TWI429848B (zh) * 2011-11-25 2014-03-11 財團法人工業技術研究院 均熱結構與其製法及具有該均熱結構之散熱模組
US9835383B1 (en) * 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick
JP6311279B2 (ja) * 2013-11-11 2018-04-18 大日本印刷株式会社 放熱部材とその製造方法および放熱部材を用いた構造体
CN104754916A (zh) * 2013-12-27 2015-07-01 奇鋐科技股份有限公司 散热装置
DE202014001008U1 (de) * 2014-01-31 2014-08-18 Asia Vital Components Co., Ltd. Kühlvorrichtung
JP5759606B1 (ja) * 2014-09-30 2015-08-05 株式会社フジクラ ヒートパイプ
US10352626B2 (en) * 2016-12-14 2019-07-16 Shinko Electric Industries Co., Ltd. Heat pipe
TWI697650B (zh) * 2017-12-13 2020-07-01 奇鋐科技股份有限公司 散熱裝置製造方法
JP7386469B2 (ja) 2017-12-22 2023-11-27 国立大学法人 鹿児島大学 ヒートパイプ
JP6920231B2 (ja) * 2018-02-06 2021-08-18 新光電気工業株式会社 ループ型ヒートパイプ
US20190285357A1 (en) * 2018-03-19 2019-09-19 Asia Vital Components Co., Ltd. Middle member of heat dissipation device and the heat dissipation device
JP2019207759A (ja) * 2018-05-28 2019-12-05 信越ポリマー株式会社 放熱構造体およびバッテリー
WO2019230911A1 (ja) * 2018-05-30 2019-12-05 大日本印刷株式会社 ベーパーチャンバー、及び電子機器
US10935325B2 (en) * 2018-09-28 2021-03-02 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid
US10962298B2 (en) * 2018-09-28 2021-03-30 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid
TWM577130U (zh) * 2019-01-02 2019-04-21 奇鋐科技股份有限公司 Heat sink
US11013145B1 (en) * 2020-05-15 2021-05-18 Murata Manufacturing Co., Ltd. Vapor chamber
TWI837008B (zh) 2023-05-31 2024-03-21 科定企業股份有限公司 倒角地板結構改良

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108882644A (zh) * 2018-07-25 2018-11-23 奇鋐科技股份有限公司 散热单元

Also Published As

Publication number Publication date
US20230080077A1 (en) 2023-03-16
JP7693043B2 (ja) 2025-06-16
WO2021172479A1 (ja) 2021-09-02
CN115136302A (zh) 2022-09-30
US12292238B2 (en) 2025-05-06
JP2024069313A (ja) 2024-05-21
JP7710554B2 (ja) 2025-07-18
JP2024059993A (ja) 2024-05-01
JP2024059978A (ja) 2024-05-01
JP7451678B2 (ja) 2024-03-18
EP4113596A4 (en) 2024-03-27
EP4113596A1 (en) 2023-01-04
JPWO2021172479A1 (https=) 2021-09-02

Similar Documents

Publication Publication Date Title
CN115136302B (zh) 散热构件
CN111712682B (zh) 均热板
JP6597892B2 (ja) ループヒートパイプ及びその製造方法並びに電子機器
KR101983108B1 (ko) 베이퍼 챔버
EP2224481A1 (en) Semiconductor device
US20210247151A1 (en) Fluid-based cooling device for cooling at least two distinct first heat-generating elements of a heat source assembly
US12595974B2 (en) Ceramic thermal device with three-layer vapor chamber
JPWO2014098214A1 (ja) 流路部材およびこれを用いた熱交換器ならびに半導体装置
KR102818827B1 (ko) 냉각 요소의 제조 방법 및 이러한 방법으로 제조된 냉각 요소
US20250224181A1 (en) Heat dissipation plate and vapor chamber
CN115763406B (zh) 一种带歧管微通道的嵌入式冷却芯片
WO2026048992A1 (ja) 熱デバイス
EP4534942A1 (en) Thermal device
US20250123058A1 (en) Multilayer high aspect ratio microchannel device
US20250031347A1 (en) Three-Dimensional Meshes and Casings for Thermal Ground Planes
JP7521710B2 (ja) 熱拡散デバイス及び電子機器
WO2022025254A1 (ja) 熱伝導部材
WO2025197761A1 (ja) 熱デバイス
WO2022025257A1 (ja) 熱伝導部材
CN121772149A (zh) 异质板材的均温板元件
JP2005229049A (ja) ベーパ・チャンバ及びその製造方法、冷却装置、並びにコンピュータ
JP2023127009A (ja) 熱伝導部材
JP2023127013A (ja) 熱伝導部材

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant