CN114846601B - 半导体装置 - Google Patents

半导体装置

Info

Publication number
CN114846601B
CN114846601B CN202080085890.4A CN202080085890A CN114846601B CN 114846601 B CN114846601 B CN 114846601B CN 202080085890 A CN202080085890 A CN 202080085890A CN 114846601 B CN114846601 B CN 114846601B
Authority
CN
China
Prior art keywords
region
overlapping
solder
heat sink
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080085890.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN114846601A (zh
Inventor
荒井俊介
西畑雅由
平光真二
柿本规行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to CN202511471500.8A priority Critical patent/CN121335181A/zh
Publication of CN114846601A publication Critical patent/CN114846601A/zh
Application granted granted Critical
Publication of CN114846601B publication Critical patent/CN114846601B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/493—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode the static converters being arranged for operation in parallel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
CN202080085890.4A 2019-12-12 2020-10-14 半导体装置 Active CN114846601B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202511471500.8A CN121335181A (zh) 2019-12-12 2020-10-14 半导体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019224847A JP7167907B2 (ja) 2019-12-12 2019-12-12 半導体装置
JP2019-224847 2019-12-12
PCT/JP2020/038747 WO2021117334A1 (ja) 2019-12-12 2020-10-14 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202511471500.8A Division CN121335181A (zh) 2019-12-12 2020-10-14 半导体装置

Publications (2)

Publication Number Publication Date
CN114846601A CN114846601A (zh) 2022-08-02
CN114846601B true CN114846601B (zh) 2025-10-28

Family

ID=76312788

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202080085890.4A Active CN114846601B (zh) 2019-12-12 2020-10-14 半导体装置
CN202511471500.8A Pending CN121335181A (zh) 2019-12-12 2020-10-14 半导体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202511471500.8A Pending CN121335181A (zh) 2019-12-12 2020-10-14 半导体装置

Country Status (4)

Country Link
US (2) US12476172B2 (https=)
JP (1) JP7167907B2 (https=)
CN (2) CN114846601B (https=)
WO (1) WO2021117334A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
JP7689653B2 (ja) * 2022-02-17 2025-06-09 株式会社デンソー 半導体装置
JP7647630B2 (ja) * 2022-03-02 2025-03-18 株式会社デンソー 半導体装置
JP7829800B2 (ja) * 2023-03-15 2026-03-13 三菱電機株式会社 半導体装置
JP2024171657A (ja) * 2023-05-30 2024-12-12 株式会社デンソー 電力変換装置
JP2024171658A (ja) * 2023-05-30 2024-12-12 株式会社デンソー 電力変換装置
CN121444624A (zh) * 2023-07-05 2026-01-30 株式会社电装 半导体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106062950A (zh) * 2014-03-10 2016-10-26 丰田自动车株式会社 半导体装置
WO2019187608A1 (ja) * 2018-03-29 2019-10-03 株式会社デンソー 半導体装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4702196B2 (ja) 2005-09-12 2011-06-15 株式会社デンソー 半導体装置
JP5487956B2 (ja) * 2009-12-25 2014-05-14 トヨタ自動車株式会社 半導体装置
JP5143211B2 (ja) * 2009-12-28 2013-02-13 パナソニック株式会社 半導体モジュール
JP6114149B2 (ja) * 2013-09-05 2017-04-12 トヨタ自動車株式会社 半導体装置
JP6578900B2 (ja) * 2014-12-10 2019-09-25 株式会社デンソー 半導体装置及びその製造方法
DE112015005561B4 (de) * 2014-12-10 2022-05-05 Denso Corporation Halbleitervorrichtung und verfahren zu deren fertigung
JP6430843B2 (ja) 2015-01-30 2018-11-28 株式会社ジェイデバイス 半導体装置
JP2016181607A (ja) * 2015-03-24 2016-10-13 株式会社デンソー 半導体装置及びその製造方法
JP2017159335A (ja) * 2016-03-10 2017-09-14 株式会社デンソー 半導体装置及びその製造方法
JP6485398B2 (ja) * 2016-04-13 2019-03-20 株式会社デンソー 電子装置及びその製造方法
JP6874467B2 (ja) * 2017-03-29 2021-05-19 株式会社デンソー 半導体装置とその製造方法
JP2019153752A (ja) * 2018-03-06 2019-09-12 トヨタ自動車株式会社 半導体装置
JP7139862B2 (ja) * 2018-10-15 2022-09-21 株式会社デンソー 半導体装置
WO2021065736A1 (ja) * 2019-10-04 2021-04-08 株式会社デンソー 半導体装置
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
JP7346592B2 (ja) * 2019-12-16 2023-09-19 日立Astemo株式会社 半導体装置の製造方法および半導体装置
JP7452233B2 (ja) * 2020-05-01 2024-03-19 株式会社デンソー 半導体装置および電力変換装置
JP7400773B2 (ja) * 2021-05-27 2023-12-19 株式会社デンソー 半導体装置
JP7509084B2 (ja) * 2021-05-27 2024-07-02 株式会社デンソー 半導体装置
JP7552503B2 (ja) * 2021-05-27 2024-09-18 株式会社デンソー 半導体装置
JP7424347B2 (ja) * 2021-05-27 2024-01-30 株式会社デンソー 半導体装置
JP7528865B2 (ja) * 2021-05-27 2024-08-06 株式会社デンソー 半導体装置
JP7512954B2 (ja) * 2021-05-27 2024-07-09 株式会社デンソー 半導体装置
JP7400774B2 (ja) * 2021-05-27 2023-12-19 株式会社デンソー 半導体装置
JP7689653B2 (ja) * 2022-02-17 2025-06-09 株式会社デンソー 半導体装置
JP7740055B2 (ja) * 2022-02-22 2025-09-17 株式会社デンソー 半導体装置
JP7694512B2 (ja) * 2022-09-02 2025-06-18 株式会社デンソー 半導体装置
JP2024089412A (ja) * 2022-12-21 2024-07-03 株式会社デンソー 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106062950A (zh) * 2014-03-10 2016-10-26 丰田自动车株式会社 半导体装置
WO2019187608A1 (ja) * 2018-03-29 2019-10-03 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
WO2021117334A1 (ja) 2021-06-17
US20260040962A1 (en) 2026-02-05
US20220278030A1 (en) 2022-09-01
JP7167907B2 (ja) 2022-11-09
CN121335181A (zh) 2026-01-13
CN114846601A (zh) 2022-08-02
JP2021093503A (ja) 2021-06-17
US12476172B2 (en) 2025-11-18

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