CN114762088A - 基板液处理装置 - Google Patents

基板液处理装置 Download PDF

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Publication number
CN114762088A
CN114762088A CN202080082687.1A CN202080082687A CN114762088A CN 114762088 A CN114762088 A CN 114762088A CN 202080082687 A CN202080082687 A CN 202080082687A CN 114762088 A CN114762088 A CN 114762088A
Authority
CN
China
Prior art keywords
nozzle
liquid
unit
processing apparatus
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080082687.1A
Other languages
English (en)
Chinese (zh)
Inventor
竹口博史
桥本佑介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN114762088A publication Critical patent/CN114762088A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202080082687.1A 2019-12-06 2020-11-24 基板液处理装置 Pending CN114762088A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019221552 2019-12-06
JP2019-221552 2019-12-06
PCT/JP2020/043677 WO2021111927A1 (ja) 2019-12-06 2020-11-24 基板液処理装置

Publications (1)

Publication Number Publication Date
CN114762088A true CN114762088A (zh) 2022-07-15

Family

ID=76222194

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080082687.1A Pending CN114762088A (zh) 2019-12-06 2020-11-24 基板液处理装置

Country Status (4)

Country Link
JP (1) JP7292417B2 (ja)
KR (1) KR20220107234A (ja)
CN (1) CN114762088A (ja)
WO (1) WO2021111927A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3317855B2 (ja) 1996-09-02 2002-08-26 東京エレクトロン株式会社 洗浄装置
JP2013026381A (ja) * 2011-07-20 2013-02-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP6456793B2 (ja) * 2015-08-11 2019-01-23 東京エレクトロン株式会社 基板処理装置および昇華性物質の析出防止方法
JP6762184B2 (ja) * 2016-09-26 2020-09-30 株式会社Ｓｃｒｅｅｎホールディングス 回収配管洗浄方法および基板処理装置
JP6914050B2 (ja) * 2017-02-15 2021-08-04 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
JP7292417B2 (ja) 2023-06-16
WO2021111927A1 (ja) 2021-06-10
JPWO2021111927A1 (ja) 2021-06-10
KR20220107234A (ko) 2022-08-02

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