JPWO2021111927A1 - - Google Patents

Info

Publication number
JPWO2021111927A1
JPWO2021111927A1 JP2021562583A JP2021562583A JPWO2021111927A1 JP WO2021111927 A1 JPWO2021111927 A1 JP WO2021111927A1 JP 2021562583 A JP2021562583 A JP 2021562583A JP 2021562583 A JP2021562583 A JP 2021562583A JP WO2021111927 A1 JPWO2021111927 A1 JP WO2021111927A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021562583A
Other versions
JP7292417B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021111927A1 publication Critical patent/JPWO2021111927A1/ja
Application granted granted Critical
Publication of JP7292417B2 publication Critical patent/JP7292417B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021562583A 2019-12-06 2020-11-24 基板液処理装置 Active JP7292417B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019221552 2019-12-06
JP2019221552 2019-12-06
PCT/JP2020/043677 WO2021111927A1 (ja) 2019-12-06 2020-11-24 基板液処理装置

Publications (2)

Publication Number Publication Date
JPWO2021111927A1 true JPWO2021111927A1 (ja) 2021-06-10
JP7292417B2 JP7292417B2 (ja) 2023-06-16

Family

ID=76222194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021562583A Active JP7292417B2 (ja) 2019-12-06 2020-11-24 基板液処理装置

Country Status (4)

Country Link
JP (1) JP7292417B2 (ja)
KR (1) KR20220107234A (ja)
CN (1) CN114762088A (ja)
WO (1) WO2021111927A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1074725A (ja) * 1996-09-02 1998-03-17 Tokyo Electron Ltd 洗浄装置
JP2013026381A (ja) * 2011-07-20 2013-02-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2017037985A (ja) * 2015-08-11 2017-02-16 東京エレクトロン株式会社 基板処理装置および昇華性物質の析出防止方法
JP2018056187A (ja) * 2016-09-26 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 回収配管洗浄方法および基板処理装置
JP2018133429A (ja) * 2017-02-15 2018-08-23 東京エレクトロン株式会社 基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1074725A (ja) * 1996-09-02 1998-03-17 Tokyo Electron Ltd 洗浄装置
JP2013026381A (ja) * 2011-07-20 2013-02-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2017037985A (ja) * 2015-08-11 2017-02-16 東京エレクトロン株式会社 基板処理装置および昇華性物質の析出防止方法
JP2018056187A (ja) * 2016-09-26 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 回収配管洗浄方法および基板処理装置
JP2018133429A (ja) * 2017-02-15 2018-08-23 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20220107234A (ko) 2022-08-02
JP7292417B2 (ja) 2023-06-16
WO2021111927A1 (ja) 2021-06-10
CN114762088A (zh) 2022-07-15

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